Simplified nonplanar wafer bonding for heterogeneous device integration

2004 ◽  
Vol 85 (2) ◽  
pp. 170-172
Author(s):  
Jon Geske ◽  
John E. Bowers ◽  
Anton Riley
Keyword(s):  
Wafer Bonding ◽  
Device Integration ◽  
Heterogeneous Device

Nanoscale transfer printing for heterogeneous device integration (Conference Presentation)

2017 ◽  
Author(s):  
Antonio Hurtado ◽  
Benoit J. E. Guilhabert ◽  
Michael J. Strain ◽  
Nicolas Laurand ◽  
Chennupati Jagadish ◽  
...  
Keyword(s):  
Transfer Printing ◽  
Device Integration ◽  
Heterogeneous Device
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