Change of electrical resistivity of metal films bombarded with helium ions of low energy

1974 ◽  
Vol 45 (6) ◽  
pp. 2394-2395
Author(s):  
A. Nomura ◽  
M. Kanayama ◽  
S. Kiyono
1998 ◽  
Vol 10 (4) ◽  
pp. 741-752 ◽  
Author(s):  
B Arezki ◽  
Y Boudouma ◽  
P Benoit-Cattin ◽  
A C Chami ◽  
C Benazeth ◽  
...  

1967 ◽  
Vol 38 (4) ◽  
pp. 1986-1987 ◽  
Author(s):  
D. I. Kennedy ◽  
R. E. Hayes ◽  
R. W. Alsford

2021 ◽  
Vol 126 (2) ◽  
Author(s):  
Khan‐Hyuk Kim ◽  
Hyuck‐Jin Kwon ◽  
Junhyun Lee ◽  
Ho Jin ◽  
Jungjoon Seough
Keyword(s):  

1983 ◽  
Vol 25 ◽  
Author(s):  
I.V. Mitchell ◽  
J.S. Williams ◽  
D.K. Sood ◽  
K.T. Short ◽  
S. Johnson ◽  
...  

ABSTRACTHelium ions of 2 MeV energy and electrons of 5 to 30 keV energy have been used to irradiate a variety of thin (10–330 nm) metal films after deposition on semiconductor and insulator substrates. Dose thresholds for increased adhesion were found following irradiation with either type of particle. It is argued that the stronger bonding arises from an electronic, rather than a collisional, process. Representative results are presented and discussed within the framework of a recent model for heavy ion-induced effects.


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