Optical waveguides in single layers of Ga1−xAlx As grown on GaAs substrates

1973 ◽  
Vol 23 (7) ◽  
pp. 403-404 ◽  
Author(s):  
E. Garmire
1993 ◽  
Vol 310 ◽  
Author(s):  
D. K. Fork ◽  
J. J. Kingston ◽  
G. B. Anderson ◽  
E. J. Tarsa ◽  
J. S. Speck

AbstractDiscoveries within the last two years have created possibilities for the fabrication of epitaxial oxide heterostructures on GaAs substrates. In particular, magnesium oxide, MgO, may have broad applications, including its use as a cladding layer in optical waveguides. This report expands upon earlier work by revealing additional epitaxial structures involving lithium niobate which have been grown. There are now five known variants of Z-lithium niobate on GaAs: direct Z-cut growth on GaAs (111)A or B, Z-cut growth on MgO (111)/GaAs (111)A or B, and Z-cut growth on MgO (111)/GaAs (001). Broad in-plane misalignment (about 15°) characterizes the latter structure, whereas the former posses a textural width of 3° to 5° in the plane. All structures contain internal boundaries resulting from 180° rotations about the Zaxis. A critical issue for any ferroelectric heterostructure is its integrity in the presence of thermally induced tensile strain. Approaches to the mitigation of thin fim fracture are discussed and a novel approach to strain relief via ridge waveguide fabrication is reported.


Author(s):  
Yih-Cheng Shih ◽  
E. L. Wilkie

Tungsten silicides (WSix) have been successfully used as the gate materials in self-aligned GaAs metal-semiconductor-field- effect transistors (MESFET). Thermal stability of the WSix/GaAs Schottky contact is of major concern since the n+ implanted source/drain regions must be annealed at high temperatures (∼ 800°C). WSi0.6 was considered the best composition to achieve good device performance due to its low stress and excellent thermal stability of the WSix/GaAs interface. The film adhesion and the uniformity in barrier heights and ideality factors of the WSi0.6 films have been improved by depositing a thin layer of pure W as the first layer on GaAs prior to WSi0.6 deposition. Recently WSi0.1 has been used successfully as the gate material in 1x10 μm GaAs FET's on the GaAs substrates which were sputter-cleaned prior to deposition. These GaAs FET's exhibited uniform threshold voltages across a 51 mm wafer with good film adhesion after annealing at 800°C for 10 min.


Author(s):  
W. E. Lee

An optical waveguide consists of a several-micron wide channel with a slightly different index of refraction than the host substrate; light can be trapped in the channel by total internal reflection.Optical waveguides can be formed from single-crystal LiNbO3 using the proton exhange technique. In this technique, polished specimens are masked with polycrystal1ine chromium in such a way as to leave 3-13 μm wide channels. These are held in benzoic acid at 249°C for 5 minutes allowing protons to exchange for lithium ions within the channels causing an increase in the refractive index of the channel and creating the waveguide. Unfortunately, optical measurements often reveal a loss in waveguiding ability up to several weeks after exchange.


Author(s):  
T.C. Sheu ◽  
S. Myhajlenko ◽  
D. Davito ◽  
J.L. Edwards ◽  
R. Roedel ◽  
...  

Liquid encapsulated Czochralski (LEC) semi-insulating (SI) GaAs has applications in integrated optics and integrated circuits. Yield and device performance is dependent on the homogeniety of the wafers. Therefore, it is important to characterise the uniformity of the GaAs substrates. In this respect, cathodoluminescence (CL) has been used to detect the presence of crystal defects and growth striations. However, when SI GaAs is examined in a scanning electron microscope (SEM), there will be a tendency for the surface to charge up. The surface charging affects the backscattered and secondary electron (SE) yield. Local variations in the surface charge will give rise to contrast (effectively voltage contrast) in the SE image. This may be associated with non-uniformities in the spatial distribution of resistivity. Wakefield et al have made use of “charging microscopy” to reveal resistivity variations across a SI GaAs wafer. In this work we report on CL imaging, the conditions used to obtain “charged” SE images and some aspects of the contrast behaviour.


Author(s):  
J.M. Bonar ◽  
R. Hull ◽  
R. Malik ◽  
R. Ryan ◽  
J.F. Walker

In this study we have examined a series of strained heteropeitaxial GaAs/InGaAs/GaAs and InGaAs/GaAs structures, both on (001) GaAs substrates. These heterostructures are potentially very interesting from a device standpoint because of improved band gap properties (InAs has a much smaller band gap than GaAs so there is a large band offset at the InGaAs/GaAs interface), and because of the much higher mobility of InAs. However, there is a 7.2% lattice mismatch between InAs and GaAs, so an InxGa1-xAs layer in a GaAs structure with even relatively low x will have a large amount of strain, and misfit dislocations are expected to form above some critical thickness. We attempt here to correlate the effect of misfit dislocations on the electronic properties of this material.The samples we examined consisted of 200Å InxGa1-xAs layered in a hetero-junction bipolar transistor (HBT) structure (InxGa1-xAs on top of a (001) GaAs buffer, followed by more GaAs, then a layer of AlGaAs and a GaAs cap), and a series consisting of a 200Å layer of InxGa1-xAs on a (001) GaAs substrate.


1985 ◽  
Vol 132 (6) ◽  
pp. 314 ◽  
Author(s):  
J.M. Arnold ◽  
A. Belghoraf ◽  
A. Dendane

1975 ◽  
Vol 11 (22) ◽  
pp. 534
Author(s):  
Shojiro Kawakami ◽  
Shigeo Nishida
Keyword(s):  

1980 ◽  
Vol 16 (11) ◽  
pp. 440 ◽  
Author(s):  
D.N. MacFadyen ◽  
C.R. Stanley ◽  
C.D.W. Wilkinson
Keyword(s):  

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