SIZE EFFECT IN THIN SINGLE‐CRYSTAL SILVER FILMS

1968 ◽  
Vol 13 (6) ◽  
pp. 206-207 ◽  
Author(s):  
V. P. Duggal ◽  
V. P. Nagpal
Keyword(s):  
Size Effect ◽  
Single Crystal ◽  
Silver Films

Size effect in the low-field Hall coefficient of single-crystal copper films

1985 ◽  
Vol 61 (3-4) ◽  
pp. 281-289 ◽  
Author(s):  
I. Sakamoto ◽  
M. Fukuhara ◽  
Y. Koide ◽  
K. Yonemitsu
Keyword(s):  
Size Effect ◽  
Single Crystal ◽  
Hall Coefficient ◽  
Copper Films ◽  
Single Crystal Copper ◽  
Low Field

Nanoindentation size effect in single-crystal nanoparticles and thin films: A comparative experimental and simulation study

2011 ◽  
Vol 59 (6) ◽  
pp. 2309-2321 ◽  
Author(s):  
Dan Mordehai ◽  
Michael Kazakevich ◽  
David J. Srolovitz ◽  
Eugen Rabkin
Keyword(s):  
Thin Films ◽  
Size Effect ◽  
Single Crystal ◽  
Simulation Study

scholarly journals Size Effect on Mechanical Properties and Deformation Behavior of Pure Copper Wires Considering Free Surface Grains

Materials ◽  
2020 ◽  
Vol 13 (20) ◽  
pp. 4563
Author(s):  
Yu Hou ◽  
Xujun Mi ◽  
Haofeng Xie ◽  
Wenjing Zhang ◽  
Guojie Huang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Grain Size ◽  
Free Surface ◽  
Size Effect ◽  
Single Crystal ◽  
Deformation Behavior ◽  
Pure Copper ◽  
Critical Value ◽  
Wire Diameter ◽  
Surface Model

The size (grain size and specimen size) effect makes traditional macroscopic forming technology unsuitable for a microscopic forming process. In order to investigate the size effect on mechanical properties and deformation behavior, pure copper wires (diameters range from 50 μm to 500 μm) were annealed at different temperatures to obtain different grain sizes. The results show that a decrease in wire diameter leads to a reduction in tensile strength, and this change is pronounced for large grains. The elongation of the material is in linear correlation to size factor D/d (diameter/grain size), i.e., at the same wire diameter, more grains in the section bring better plasticity. This phenomenon is in relationship with the ratio of free surface grains. A surface model combined with the theory of single crystal and polycrystal is established, based on the relationship between specimen/grain size and tensile property. The simulated results show that the flow stress in micro-scale is in the middle of the single crystal model (lower critical value) and the polycrystalline model (upper critical value). Moreover, the simulation results of the hybrid model calculations presented in this paper are in good agreement with the experimental results.

Electrodeposition of nanometer-thick epitaxial films of silver onto single-crystal silicon wafers

2019 ◽  
Vol 7 (6) ◽  
pp. 1720-1725 ◽  
Author(s):  
Qingzhi Chen ◽  
Jay A. Switzer
Keyword(s):  
Single Crystal ◽  
Electrochemical Method ◽  
Single Crystal Silicon ◽  
Epitaxial Films ◽  
Silicon Wafers ◽  
Silver Acetate ◽  
Crystal Silicon ◽  
Silver Films ◽  
First Time

Silver films were deposited epitaxially for the first time onto low-index, single-crystal silicon wafers through an electrochemical method in an aqueous silver acetate bath.

Resistivity study of single‐crystal silver films from 4.2 to 56°K

1973 ◽  
Vol 44 (10) ◽  
pp. 4501-4504 ◽  
Author(s):  
V. P. Nagpal ◽  
V. P. Duggal
Keyword(s):  
Single Crystal ◽  
Silver Films ◽  
Resistivity Study
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