Electron bunch acceleration and trapping by the ponderomotive force of an intense short-pulse laser

2003 ◽  
Vol 10 (12) ◽  
pp. 4605-4608 ◽  
Author(s):  
Q. Kong ◽  
S. Miyazaki ◽  
S. Kawata ◽  
K. Miyauchi ◽  
K. Nakajima ◽  
...  
2005 ◽  
Vol 23 (01) ◽  
Author(s):  
SHIGEO KAWATA ◽  
QING KONG ◽  
SHUJI MIYAZAKI ◽  
KOHICHI MIYAUCHI ◽  
RYO SONOBE ◽  
...  

2003 ◽  
Vol 36 (23) ◽  
pp. 2878-2882 ◽  
Author(s):  
Shuji Miyazaki ◽  
Qing Kong ◽  
Shigeo Kawata ◽  
Jiri Limpouch

2007 ◽  
Vol 127 (4) ◽  
pp. 199-204
Author(s):  
Shotaro Hasumi ◽  
Shuji Miyazaki ◽  
Shigeo Kawata ◽  
Qing Kong ◽  
Kei Sakai ◽  
...  

1983 ◽  
Vol 1 (1) ◽  
pp. 67-79 ◽  
Author(s):  
P. Lädrach ◽  
J. E. Balmer

A one-dimensional, time-dependent fluid code is presented that numerically solves the hydrodynamic equations together with the wave equation for a picosecond pulse laser heated plasma. The laser light absorption by classical inverse bremsstrahlung and the ponderomotive force are evaluated self-consistently from the computed electromagnetic field quantities. At oblique incidence of p-polarized 1·054 μm laser radiation the resonant electric field is saturated by plasma wave convection through the nonlinear density profile steepening prior to wave breaking.


Author(s):  
F. Beaudoin ◽  
P. Perdu ◽  
C. DeNardi ◽  
R. Desplats ◽  
J. Lopez ◽  
...  

Abstract Ultra-short pulse laser ablation is applied to IC backside sample preparation. It is contact-less, non-thermal, precise and can ablate the various types of material present in IC packages. This study concerns the optimization of ultra-short pulse laser ablation for silicon thinning. Uncontrolled silicon roughness and poor uniformity of the laser thinned cavity needed to be tackled. Special care is taken to minimize the silicon RMS roughness to less than 1µm. Application to sample preparation of 256Mbit devices is presented.


2013 ◽  
Vol 115 (4) ◽  
pp. 1469-1477 ◽  
Author(s):  
Evgeny Kharanzhevskiy ◽  
Sergey Reshetnikov

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