Ultrathin single-crystalline-silicon cantilever resonators: Fabrication technology and significant specimen size effect on Young’s modulus

2003 ◽  
Vol 83 (15) ◽  
pp. 3081-3083 ◽  
Author(s):  
Xinxin Li ◽  
Takahito Ono ◽  
Yuelin Wang ◽  
Masayoshi Esashi
Keyword(s):  
Size Effect ◽  
Young’S Modulus ◽  
Crystalline Silicon ◽  
Young's Modulus ◽  
Specimen Size ◽  
Single Crystalline Silicon ◽  
Fabrication Technology ◽  
Single Crystalline ◽  
Silicon Cantilever

Young's Modulus, Yield Strength and Fracture Strength of Microelements Determined by Tensile Testing

1998 ◽  
Vol 518 ◽  
Author(s):  
S. Greek ◽  
F. Ericson
Keyword(s):  
Mechanical Properties ◽  
Yield Strength ◽  
Young’S Modulus ◽  
Fracture Strength ◽  
Crystalline Silicon ◽  
Young's Modulus ◽  
Iron Alloy ◽  
Single Crystalline Silicon ◽  
Nickel Iron ◽  
Nickel Iron Alloy

AbstractSome mechanical properties of thin film microelements, e.g. fracture strength, depend on the manufacturing process, the load application as well as on size and shape of the microelements. Hence, the test structures that are used to determine mechanical properties should have dimensions of the same order of magnitude as an application structure, i.e. microelements must be used to accurately characterise MEMS. The fabrication of test structures must be realised in the same process as an intended application in order to give accurate results. Microelements are easily viewed in an SEM, but to be handled and tested in situ a micromanipulator was developed. Test structures were designed as released beams fixed to the substrate at one end, with a ring at the other. A high-precision testing unit was mounted on the micromanipulator next to the test structures. In the SEM, the testing unit was manoeuvred to grip the ring of the test structure beam and a tensile test of the beam was then executed. From the test data Young's modulus and fracture strength of polysilicon and single crystalline silicon were evaluated. Relative measurement of test structures with different beam lengths enabled Young's modulus to be evaluated with an accuracy of ±5%. Young's modulus was determined to 172±7 GPa for polysilicon and 142±9 GPa for single crystalline silicon in the <100> direction. The fracture surfaces were examined and compared. Young's modulus, yield strength and fracture strength of microelements made from electroplated nickel and nickel-iron alloy were also measured. Young's modulus was evaluated to 231±12 GPa for nickel and 155±8 GPa for nickel-iron alloy composed of 72 at% nickel and 28 at% iron.

Recombination Characteristics of Single-Crystalline Silicon Wafers with a Damaged Near-Surface Layer

2013 ◽  
Vol 58 (2) ◽  
pp. 142-150 ◽  
Author(s):  
A.V. Sachenko ◽  
◽  
V.P. Kostylev ◽  
V.G. Litovchenko ◽  
V.G. Popov ◽  
...  
Keyword(s):  
Surface Layer ◽  
Crystalline Silicon ◽  
Silicon Wafers ◽  
Single Crystalline Silicon ◽  
Near Surface ◽  
Single Crystalline

Dynamic Crack Propagation in Single-Crystalline Silicon

1998 ◽  
Vol 539 ◽  
Author(s):  
T. Cramer ◽  
A. Wanner ◽  
P. Gumbsch
Keyword(s):  
Crack Propagation ◽  
Crystalline Silicon ◽  
Potential Drop ◽  
Tensile Tests ◽  
Terminal Velocity ◽  
Dynamic Crack Propagation ◽  
Dynamic Crack ◽  
Single Crystalline Silicon ◽  
Single Crystalline ◽  
Crack Propagation Velocity

AbstractTensile tests on notched plates of single-crystalline silicon were carried out at high overloads. Cracks were forced to propagate on {110} planes in a <110> direction. The dynamics of the fracture process was measured using the potential drop technique and correlated with the fracture surface morphology. Crack propagation velocity did not exceed a terminal velocity of v = 3800 m/s, which corresponds to 83%7 of the Rayleigh wave velocity vR. Specimens fractured at low stresses exhibited crystallographic cleavage whereas a transition from mirror-like smooth regions to rougher hackle zones was observed in case of the specimens fractured at high stresses. Inspection of the mirror zone at high magnification revealed a deviation of the {110} plane onto {111} crystallographic facets.

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