scholarly journals Electron–phonon heat transport and electronic thermal conductivity in heavily doped silicon-on-insulator film

2003 ◽  
Vol 94 (5) ◽  
pp. 3201-3205 ◽  
Author(s):  
P. Kivinen ◽  
A. Savin ◽  
M. Zgirski ◽  
P. Törmä ◽  
J. Pekola ◽  
...  
Micromachines ◽  
2021 ◽  
Vol 12 (2) ◽  
pp. 143
Author(s):  
Sitao Fei ◽  
Hao Ren

As a result of their IC compatibility, high acoustic velocity, and high thermal conductivity, aluminum nitride (AlN) resonators have been studied extensively over the past two decades, and widely implemented for radio frequency (RF) and sensing applications. However, the temperature coefficient of frequency (TCF) of AlN is −25 ppm/°C, which is high and limits its RF and sensing application. In contrast, the TCF of heavily doped silicon is significantly lower than the TCF of AlN. As a result, this study uses an AlN contour mode ring type resonator with heavily doped silicon as its bottom electrode in order to reduce the TCF of an AlN resonator. A simple microfabrication process based on Silicon-on-Insulator (SOI) is presented. A thickness ratio of 20:1 was chosen for the silicon bottom electrode to the AlN layer in order to make the TCF of the resonator mainly dependent upon heavily doped silicon. A cryogenic cooling test down to 77 K and heating test up to 400 K showed that the resonant frequency of the AlN resonator changed linearly with temperature change; the TCF was shown to be −9.1 ppm/°C. The temperature hysteresis characteristic of the resonator was also measured, and the AlN resonator showed excellent temperature stability. The quality factor versus temperature characteristic was also studied between 77 K and 400 K. It was found that lower temperature resulted in a higher quality factor, and the quality factor increased by 56.43%, from 1291.4 at 300 K to 2020.2 at 77 K.


1999 ◽  
Vol 38 (Part 1, No. 10) ◽  
pp. 5851-5852 ◽  
Author(s):  
Toshitsugu Sakamoto ◽  
Hisao Kawaura ◽  
Toshio Baba

Author(s):  
M. Asheghi ◽  
K. E. Goodson

Simulation of the temperature field in Silicon-on-insulator (SOI) transistors can benefit from better models and data for thermal conduction in pure and doped semiconducting materials. This work develops simple algebraic expressions to account for the reduction in thermal conductivity due to the size effect and to the presence of dopant impurities. The model applies to temperatures above 300 K and the results are compared with experimental data for pure and doped silicon layers.


1999 ◽  
Vol 86 (3) ◽  
pp. 1552-1557 ◽  
Author(s):  
Chih Chen ◽  
J. S. Huang ◽  
C. N. Liao ◽  
K. N. Tu

2001 ◽  
Vol 40 (Part 1, No. 3B) ◽  
pp. 2013-2016 ◽  
Author(s):  
Antti Manninen ◽  
Jari Kauranen ◽  
Jukka Pekola ◽  
Alexander Savin ◽  
Martin Kamp ◽  
...  

2004 ◽  
Vol 84 (13) ◽  
pp. 2265-2267 ◽  
Author(s):  
Joerg Isenberg ◽  
Wilhelm Warta

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