Elastic modulus of amorphous boron suboxide thin films studied by theoretical and experimental methods

2003 ◽  
Vol 93 (2) ◽  
pp. 940-944 ◽  
Author(s):  
Denis Music ◽  
Ulrich Kreissig ◽  
Valeriu Chirita ◽  
Jochen M. Schneider ◽  
Ulf Helmersson
Keyword(s):  
Thin Films ◽  
Elastic Modulus ◽  
Experimental Methods ◽  
Amorphous Boron ◽  
Boron Suboxide

Elastic modulus-density relationship for amorphous boron suboxide thin films

2003 ◽  
Vol 76 (2) ◽  
pp. 269-271 ◽  
Author(s):  
D. Music ◽  
U. Kreissig ◽  
Zs. Czigány ◽  
U. Helmersson ◽  
J.M. Schneider
Keyword(s):  
Thin Films ◽  
Elastic Modulus ◽  
Amorphous Boron ◽  
Boron Suboxide ◽  
Density Relationship

Compositional and phase dependence of elastic modulus of crystalline and amorphous Hf1-xZrxO2 thin films

2021 ◽  
Vol 118 (10) ◽  
pp. 102901
Author(s):  
Shelby S. Fields ◽  
David H. Olson ◽  
Samantha T. Jaszewski ◽  
Chris M. Fancher ◽  
Sean W. Smith ◽  
...  
Keyword(s):  
Thin Films ◽  
Elastic Modulus ◽  
Phase Dependence

Direct Comparison of Three Buckling-Based Methods to Measure the Elastic Modulus of Nanobiocomposite Thin Films

2021 ◽  
Author(s):  
Taylor C. Stimpson ◽  
Daniel A. Osorio ◽  
Emily D. Cranston ◽  
Jose M. Moran-Mirabal
Keyword(s):  
Thin Films ◽  
Elastic Modulus

Determining the elastic modulus of thin films using a buckling-based method: computational study

2009 ◽  
Vol 42 (17) ◽  
pp. 175506 ◽  
Author(s):  
Xiu-Peng Zheng ◽  
Yan-Ping Cao ◽  
Bo Li ◽  
Xi-Qiao Feng ◽  
Hanqing Jiang ◽  
...  
Keyword(s):  
Thin Films ◽  
Elastic Modulus ◽  
Computational Study

Impact of Surface-Modified Nanoparticles on Glass Transition Temperature and Elastic Modulus of Polymer Thin Films

2007 ◽  
Vol 40 (22) ◽  
pp. 7755-7757 ◽  
Author(s):  
Jong-Young Lee ◽  
Kristin E. Su ◽  
Edwin P. Chan ◽  
Qingling Zhang ◽  
Todd Emrick ◽  
...  
Keyword(s):  
Thin Films ◽  
Glass Transition ◽  
Elastic Modulus ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Polymer Thin Films ◽  
Surface Modified ◽  
Surface Modified Nanoparticles

Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging

2012 ◽  
Vol 52 (11) ◽  
pp. 2677-2684 ◽  
Author(s):  
Andrej Ivankovic ◽  
Kris Vanstreels ◽  
Daniel Vanderstraeten ◽  
Guy Brizar ◽  
Renaud Gillon ◽  
...  
Keyword(s):  
Elastic Modulus ◽  
Experimental Methods ◽  
Molding Compounds ◽  
Ic Packaging

Growth, Structural and Mechanical Characterization and Reliability of Chemical Vapor Deposited Co and Co3O4 Thin Films as Candidate Materials for Sensing Applications

2011 ◽  
Vol 495 ◽  
pp. 108-111 ◽  
Author(s):  
Vasiliki P. Tsikourkitoudi ◽  
Elias P. Koumoulos ◽  
Nikolaos Papadopoulos ◽  
Costas A. Charitidis
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Elastic Modulus ◽  
Data Storage ◽  
Mechanical Stability ◽  
Chemical Vapor ◽  
Magnetic Sensors ◽  
Functional Coatings ◽  
Sensing Applications ◽  
Chemical Vapor Deposited

The adhesion and mechanical stability of thin film coatings on substrates is increasingly becoming a key issue in device reliability as magnetic and storage technology driven products demand smaller, thinner and more complex functional coatings. In the present study, chemical vapor deposited Co and Co3O4thin films on SiO2and Si substrates are produced, respectively. Chemical vapor deposition is the most widely used deposition technique which produces thin films well adherent to the substrate. Co and Co3O4thin films can be used in innovative applications such as magnetic sensors, data storage devices and protective layers. The produced thin films are characterized using nanoindentation technique and their nanomechanical properties (hardness and elastic modulus) are obtained. Finally, an evaluation of the reliability of each thin film (wear analysis) is performed using the hardness to elastic modulus ratio in correlation to the ratio of irreversible work to total work for a complete loading-unloading procedure.

scholarly journals Structural and Mechanical Properties of Nanostructured C-Ag Thin Films Synthesized by Thermionic Vacuum Arc Method

2018 ◽  
Vol 2018 ◽  
pp. 1-10 ◽  
Author(s):  
Rodica Vladoiu ◽  
Aurelia Mandes ◽  
Virginia Dinca-Balan ◽  
Vilma Bursikova
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Mechanical Properties ◽  
Elastic Modulus ◽  
Silicon Substrate ◽  
Vacuum Arc ◽  
Average Roughness ◽  
Thermionic Vacuum Arc ◽  
Induced Aggregation ◽  
Ag Film

Nanostructured C-Ag thin films of 200 nm thickness were successfully synthesized by the Thermionic Vacuum Arc (TVA) method. The influence of different substrates (glass, silicon wafers, and stainless steel) on the microstructure, morphology, and mechanical properties of nanostructured C-Ag thin films was characterized by High-Resolution Transmission Electron Microscopy (HRTEM), Scanning Electron Microscopy (SEM), Atomic Force Microscopy (AFM), and TI 950 (Hysitron) nanoindenter equipped with Berkovich indenter, respectively. The film’s hardness deposited on glass (HC-Ag/Gl = 1.8 GPa) was slightly lower than in the case of the C-Ag film deposited on a silicon substrate (HC-Ag/Si = 2.2 GPa). Also the apparent elastic modulus Eeff was lower for C-Ag/Gl sample (Eeff = 100 GPa) than for C-Ag/Si (Eeff = 170 GPa), while the values for average roughness are Ra=2.9 nm (C-Ag/Si) and Ra=10.6 (C-Ag/Gl). Using the modulus mapping mode, spontaneous and indentation-induced aggregation of the silver nanoparticles was observed for both C-Ag/Gl and C-Ag/Si samples. The nanocomposite C-Ag film exhibited not only higher hardness and effective elastic modulus, but also a higher fracture resistance toughness to the silicon substrate compared to the glass substrate.

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