Thermal stability of polycrystalline silicon/metal oxide interfaces

2002 ◽  
Vol 81 (22) ◽  
pp. 4157-4158 ◽  
Author(s):  
A. Callegari ◽  
E. Gousev ◽  
T. Zabel ◽  
D. Lacey ◽  
M. Gribelyuk ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Metal Oxide ◽  
Polycrystalline Silicon ◽  
Oxide Interfaces ◽  
Thermal Stability Of

A Study on Thermal Stability of CoSi2Employing Novel Fine-Grained Polycrystalline Silicon/CoSi2/Si (001) System

2001 ◽  
Vol 40 (Part 1, No. 11) ◽  
pp. 6307-6310
Author(s):  
Jong-Uk Bae ◽  
Dong Kyun Sohn ◽  
Ji-Soo Park ◽  
Chang Hee Han ◽  
Jin Won Park ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Polycrystalline Silicon ◽  
Fine Grained ◽  
Thermal Stability Of

scholarly journals Case Study about the Energy Absorption Capacity of Metal Oxide Varistors with Thermal Coupling

Energies ◽  
2019 ◽  
Vol 12 (3) ◽  
pp. 536 ◽  
Author(s):  
Flaviu Frigura-Iliasa ◽  
Sorin Musuroi ◽  
Ciprian Sorandaru ◽  
Doru Vatau
Keyword(s):  
Thermal Stability ◽  
Metal Oxide ◽  
Thermal Activation ◽  
Absorption Capacity ◽  
Technical Solution ◽  
Thermal Coupling ◽  
Thermal Exchange ◽  
Surge Arresters ◽  
Thermal Stability Of

Metal oxide varistors are applied today inside modern surge arresters for overvoltage protection for all voltage levels. Their main issue is the thermal activation of their crossing current, which could lead to complete destruction by thermal runaway. This article presents a new technological solution developed in order to increase the thermal stability of metal oxide varistors. It consists in connecting in parallel two or more similar varistors (for dividing their current), having a thermal coupling between them (for equalizing their temperatures and forcing them to act together and simultaneously as much as possible). Starting from a finite element computer model performed for each situation (varistor standalone or parallel), up to real measurements, the thermal stability of the equipment was analyzed in permanent and impulse regime. Experiments were carried out in the same conditions. Experimental data obtain from two disk varistors corresponds very well to simulations, proving that parallel connection of varistors, combined with a thermal exchange between them is an efficient technical solution for thermal stability improvement, even if not apparently economically justified.

Thermal Stability of CoSi2 on Single Crystal and Polycrystalline Silicon

1990 ◽  
Vol 182 ◽  
Author(s):  
J. R. Phillips ◽  
P. Revesz ◽  
J. O. Olowolafe ◽  
J. W. Mayer
Keyword(s):  
Electron Microscopy ◽  
Thermal Stability ◽  
Single Crystal ◽  
Polycrystalline Silicon ◽  
Sheet Resistivity ◽  
X Ray ◽  
Resistivity Measurements ◽  
Silicide Layer ◽  
Thermal Stability Of ◽  
Scanning Electron

AbstractThe thermal stability of Co silicide on single crystal and polycrystalline Si has been investigated. Co films were evaporated onto (100) Si and undoped polycrystalline Si and annealed in vacuum. Resulting silicide films were examined using Rutherford backscattering spectroscopy, scanning electron microscopy, electron—induced x—ray spectroscopy, and sheet resistivity measurements. We find that CoSi2 on single crystal (100) Si remains stable through 1000ºC. In contact with undoped polycrystalline Si, intermixing begins at temperatures as low as 650ºC for 30min annealing. The Co silicide and Si layers are intermixed after 750ºC 30min annealing, giving islands of Si surrounded by silicide material, with both components extending from the surface down to the underlying oxide layer. The behavior of CoSi2 contrasts with results reported for TiSi2 which agglomerates on single crystal Si around 900ºC but is stable on polycrystalline silicon as high as 800ºC. Resistivity measurements show that the Co silicide remained interconnected despite massive incursion by Si into the silicide layer.

Role of Metal Oxide Nanomaterials on Thermal Stability of 1,3,6-Trinitrocarbazole

2016 ◽  
Vol 41 (5) ◽  
pp. 912-918 ◽  
Author(s):  
Seied Mahdi Pourmortazavi ◽  
Mehdi Rahimi-Nasrabadi ◽  
Hossein Rai ◽  
Abbas Besharati-Seidani ◽  
Abdollah Javidan
Keyword(s):  
Thermal Stability ◽  
Metal Oxide ◽  
Metal Oxide Nanomaterials ◽  
Thermal Stability Of

ROLE OF MOLYBDENUM TRIOXIDE ON THERMAL STABILITY OF POLYANILINE NANOCOMPOSITE

2012 ◽  
Vol 11 (03) ◽  
pp. 1250025
Author(s):  
P. SUJA PREMA RAJINI ◽  
R. MURUGESAN ◽  
S. PERUMAL
Keyword(s):  
Thermal Stability ◽  
Weight Loss ◽  
Particle Size ◽  
Metal Oxide ◽  
Molybdenum Trioxide ◽  
Spectral Studies ◽  
Average Particle ◽  
Weight Loss Step ◽  
The Third ◽  
Thermal Stability Of

Molybdenum trioxide (MoO3) grains were coated with conducting organic polymer of polyaniline. The as-prepared nanocomposite samples were characterized by Fourier transformed infrared (FTIR) spectra, X-ray diffraction (XRD) and Thermogravimetry (TGA). The XRD curves shows that, [Formula: see text] have high crystallinity due to the presence of large number of sharp peaks. From the XRD pattern the particle size is evaluated by using Debye-Scherrer's formula and the average particle size of [Formula: see text] and [Formula: see text] nanocomposites are found to be 46 and 32 nm, respectively. This is clearly observed that the condensed particle size of nanocomposite materials is due to the insertion of metal oxide of molybdenum. The incorporation of metal oxide of MoO3 in polyaniline (Pani) is confirmed by FTIR spectral studies. After de-doping, the characteristic peaks of Pani for all the Pani materials are almost same. This is due to the leaching of metal oxide of MoO3 from Pani. From these observations it is noted that doping–dedoping can also take place in inorganic metal oxides. The thermogram showed a three-step degradation process. The first weight loss step was due to the removal of physisorbed water molecules and moisture. The second minor weight loss step was associated with the removal of dopant from Pani backbone and the slight degradation of benzenoid structure of Pani and their thermal stability is enhanced. The third weight loss step was ascribed to the degradation of quinoid form of Pani. This confirmed the thermal stability of [Formula: see text] nanocomposite system. After degradation above 1000°C, the Pani with MoO3 showed a remaining weight of 8%. This confirmed that incorporation of metal oxide in the Pani nanocomposites is 8%. The enhancement of thermal stability is due to the intercalation of Pani chains into MoO3 in first two step degradation, which is further supported by FTIR and XRD reports. The third step degradation of Pani with MoO3 nanocomposite is loosely bound in organic and inorganic part. Therefore, the organic part is easily decomposed.

Surge Discharge Capability and Thermal Stability of a Metal Oxide Surge Arrester

1983 ◽  
Vol PAS-102 (2) ◽  
pp. 282-289 ◽  
Author(s):  
M. Kan ◽  
S. Nishiwaki ◽  
T. Sato ◽  
S. Kojima ◽  
S. Yanabu
Keyword(s):  
Thermal Stability ◽  
Metal Oxide ◽  
Thermal Stability Of
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