Characterization of GaAs-based n-n and p-n interface junctions prepared by direct wafer bonding

2002 ◽  
Vol 92 (12) ◽  
pp. 7544-7549 ◽  
Author(s):  
Frank Shi ◽  
Kuo-Lih Chang ◽  
John Epple ◽  
Chao-Feng Xu ◽  
K. Y. Cheng ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Direct Wafer Bonding

Characterization of Si pn junctions fabricated by direct wafer bonding in ultra-high vacuum

1998 ◽  
Vol 72 (9) ◽  
pp. 1095-1097 ◽  
Author(s):  
K. D. Hobart ◽  
M. E. Twigg ◽  
F. J. Kub ◽  
C. A. Desmond
Keyword(s):  
Wafer Bonding ◽  
High Vacuum ◽  
Ultra High Vacuum ◽  
Direct Wafer Bonding ◽  
Pn Junctions

Advanced Characterization of a Direct Wafer Bonding-compatible Germanium Exfoliation Process

2013 ◽  
Vol 50 (7) ◽  
pp. 331-340
Author(s):  
I. P. Ferain ◽  
X. Kou ◽  
C. Moulet-Ventosa ◽  
M. S. Goorsky ◽  
C. Colinge
Keyword(s):  
Wafer Bonding ◽  
Advanced Characterization ◽  
Direct Wafer Bonding

Characterization of germanium/silicon p–n junction fabricated by low temperature direct wafer bonding and layer exfoliation

2012 ◽  
Vol 100 (9) ◽  
pp. 092102 ◽  
Author(s):  
Farzan Gity ◽  
Ki Yeol Byun ◽  
Ko-Hsin Lee ◽  
Karim Cherkaoui ◽  
John M. Hayes ◽  
...  
Keyword(s):  
Low Temperature ◽  
Wafer Bonding ◽  
Direct Wafer Bonding ◽  
Germanium Silicon

High Precision Low Temperature Direct Wafer Bonding Technology for Wafer-Level 3D ICs Manufacturing

2016 ◽  
Vol 75 (9) ◽  
pp. 345-353 ◽  
Author(s):  
F. Kurz ◽  
T. Plach ◽  
J. Suss ◽  
T. Wagenleitner ◽  
D. Zinner ◽  
...  
Keyword(s):  
Low Temperature ◽  
High Precision ◽  
Wafer Bonding ◽  
Wafer Level ◽  
3D Ics ◽  
Direct Wafer Bonding ◽  
Bonding Technology

Low temperature GaAs/Si direct wafer bonding

2000 ◽  
Vol 36 (7) ◽  
pp. 677 ◽  
Author(s):  
M. Alexe ◽  
V. Dragoi ◽  
M. Reiche ◽  
U. Gösele
Keyword(s):  
Low Temperature ◽  
Wafer Bonding ◽  
Direct Wafer Bonding ◽  
Low Temperature Gaas

Point defects generated by direct-wafer bonding of silicon

2002 ◽  
Vol 31 (2) ◽  
pp. 113-118 ◽  
Author(s):  
L. Dózsa ◽  
B. Szentpáli ◽  
D. Pasquariello ◽  
K. Hjort
Keyword(s):  
Point Defects ◽  
Wafer Bonding ◽  
Direct Wafer Bonding

New Generation of Structures Obtained by Direct Wafer Bonding of Processed Wafers

2019 ◽  
Vol 3 (6) ◽  
pp. 79-90 ◽  
Author(s):  
Bernard Aspar ◽  
Chrystelle Lagahe-Blanchard ◽  
Nicolas Sousbie ◽  
Jacques Margail ◽  
H. Moriceau
Keyword(s):  
Wafer Bonding ◽  
Direct Wafer Bonding ◽  
New Generation
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