Monomode, nonleaky planar waveguides in a Nd3+-doped silicate glass produced by silicon ion implantation at low doses

2002 ◽  
Vol 92 (6) ◽  
pp. 2959-2961 ◽  
Author(s):  
Feng Chen ◽  
Ke-Ming Wang ◽  
Xue-Lin Wang ◽  
Xi-Shan Li ◽  
Qing-Ming Lu ◽  
...  
2003 ◽  
Vol 94 (7) ◽  
pp. 4708-4710 ◽  
Author(s):  
Feng Chen ◽  
Xue-Lin Wang ◽  
Shi-Ling Li ◽  
Gang Fu ◽  
Ke-Ming Wang ◽  
...  

2020 ◽  
Vol 49 (4) ◽  
pp. 423001-423001
Author(s):  
吕婧妍 Jing-yan Lü ◽  
郭海涛 Hai-tao GUO ◽  
徐君 Jun XU ◽  
刘春晓 Chun-xiao LIU

2018 ◽  
Vol 57 (01) ◽  
pp. 1 ◽  
Author(s):  
Yue Wang ◽  
Xiao-Liang Shen ◽  
Rui-Lin Zheng ◽  
Hai-Tao Guo ◽  
Peng Lv ◽  
...  

2006 ◽  
Vol 88 (1) ◽  
pp. 011114 ◽  
Author(s):  
Yi Jiang ◽  
Ke-Ming Wang ◽  
Xue-Lin Wang ◽  
Chuan-Lei Jia ◽  
Lei Wang ◽  
...  

2002 ◽  
Vol 202 (1-2) ◽  
pp. 86-91 ◽  
Author(s):  
Feng Chen ◽  
Xue-Lin Wang ◽  
Qing-Ming Lu ◽  
Gang Fu ◽  
Shi-Ling Li ◽  
...  

1991 ◽  
Vol 240 ◽  
Author(s):  
J. P. de Souza ◽  
D. K. Sadana

ABSTRACTThis review emphasizes controlled shallow doping of GaAs by ion implantation for state-of-art GaAs IC technology. Electrical activation behavior of Si+ and SiF+ implanted GaAs after RTA under capless and PECVD Si3N4-capped conditions will be compared. It will be demonstrated that a remarkable improvement (> 20 %) both in carrier activation and as well mobility can be achieved by co-implanting low doses (< 1013 cm−2 of Al+ into n-dopant (including Si, Se and Te) implanted GaAs and subsequently annealing the material under capless RTA conditions. The maximum improvement in the electrical results with Al+ co-implants occurs for doses (e.g. < 1013 cm−2 for 30 keV Si+) which are used for fabricating shallow channels for submicron GaAs MESFETs. Complex dopant-annealing environment interactions during a buried p layer formation (using either Mg+ or Be+) will be discussed.


2004 ◽  
Vol 85 (9) ◽  
pp. 1457-1459 ◽  
Author(s):  
Xue-Lin Wang ◽  
Feng Chen ◽  
Ke-Ming Wang ◽  
Qing-Ming Lu ◽  
Ding-Yu Shen ◽  
...  

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