Polymeric nanostructured material for high-density three-dimensional optical memory storage

2001 ◽  
Vol 90 (10) ◽  
pp. 5328-5334 ◽  
Author(s):  
Bradley J. Siwick ◽  
Olga Kalinina ◽  
Eugenia Kumacheva ◽  
R. J. Dwayne Miller ◽  
Jaan Noolandi
Keyword(s):  
Three Dimensional ◽  
Optical Memory ◽  
Nanostructured Material ◽  
High Density ◽  
Memory Storage

Photo-induced variation of magnetism in coordination polymers with ligand-based electron transfer

2021 ◽  
Author(s):  
Yan-Lei Lu ◽  
Wen-Long Lan ◽  
Wei Shi ◽  
Qionghua Jin ◽  
Peng Cheng
Keyword(s):  
Electron Transfer ◽  
Coordination Polymers ◽  
Optical Memory ◽  
High Density ◽  
Information Storage ◽  
Memory Devices ◽  
Storage Materials ◽  
Potential Applications ◽  
Induced Variation

Photo-induced variation of magnetism from ligand-based electron transfer have been extensively studied because of their potential applications in magneto-optical memory devices, light-responsive switches, and high-density information storage materials. In this...

Polymeric Thin Films for Electro-Optic Modulator and High Density Optical Memory Applications

1995 ◽  
Vol 392 ◽  
Author(s):  
Larry R. Dalton ◽  
Aaron W. Harper ◽  
Zhiyong Liang ◽  
Jingsong Zhu ◽  
Uzi Efron ◽  
...  
Keyword(s):  
Conformational Changes ◽  
Optical Waveguides ◽  
Optical Memory ◽  
High Density ◽  
Hole Burning ◽  
Spectral Hole Burning ◽  
Polymeric Thin Films ◽  
Buried Channel ◽  
Electro Optic ◽  
Memory Applications

AbstractChromophores capable of undergoing conformational changes when exposed to ultraviolet or visible light have been synthesized with functional groups permitting attachment to polymer matrices. One class of such chromophores, containing reactive functionalities at both ends of the chromophore, are referred to as double-end crosslinkable (DEC) chromophores. These chromophores are used in the synthesis of hardened nonlinear optically active lattices and in the fabrication of buried channel nonlinear optical waveguides by photoprocessing; development of such waveguides represents a critical step in the production of polymeric electro-optic modulators. Such chromophores are also crucial to the phenomena of laser-assisted poling (also known as photochemically-induced poling). Finally, these chromophores are attached to the surface of polystyrene beads permitting the realization of room temperature spectral hole burning exploiting morphology-dependent resonances. Such resonances provide the basis of wavelength coding for the development of high density optical memories.

scholarly journals Evidence of Three-Dimensional Asymmetries Seeded by High-Density Carbon-Ablator Nonuniformity in Experiments at the National Ignition Facility

2021 ◽  
Vol 126 (2) ◽  
Author(s):  
D. T. Casey ◽  
B. J. MacGowan ◽  
J. D. Sater ◽  
A. B. Zylstra ◽  
O. L. Landen ◽  
...  
Keyword(s):  
Three Dimensional ◽  
High Density ◽  
National Ignition Facility

scholarly journals Turn-off mode fluorescent norbornadiene-based photoswitches

2018 ◽  
Vol 20 (36) ◽  
pp. 23195-23201 ◽  
Author(s):  
Behabitu Ergette Tebikachew ◽  
Fredrik Edhborg ◽  
Nina Kann ◽  
Bo Albinsson ◽  
Kasper Moth-Poulsen
Keyword(s):  
Optical Memory ◽  
Memory Storage ◽  
Photochromic Molecules

To explore the potential of negative photochromic molecules for possible optical memory storage applications, we have here synthesized and studied a series of four norbornadiene–quadricyclane (NBD–QC) photoswitching molecules.

scholarly journals A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-Via and Solder Bumping Process

Metals ◽  
2021 ◽  
Vol 11 (10) ◽  
pp. 1664
Author(s):  
Do Hoon Cho ◽  
Seong Min Seo ◽  
Jang Baeg Kim ◽  
Sri Harini Rajendran ◽  
Jae Pil Jung
Keyword(s):  
High Speed ◽  
High Performance ◽  
New Technologies ◽  
Three Dimensional ◽  
High Density ◽  
Internal Stresses ◽  
Deep Reactive Ion Etching ◽  
Fifth Generation ◽  
Precise Understanding ◽  
Fabrication Defects

With the continuous miniaturization of electronic devices and the upcoming new technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation cellular networks (5G), etc., the electronics industry is achieving high-speed, high-performance, and high-density electronic packaging. Three-dimensional (3D) Si-chip stacking using through-Si-via (TSV) and solder bumping processes are the key interconnection technologies that satisfy the former requirements and receive the most attention from the electronic industries. This review mainly includes two directions to get a precise understanding, such as the TSV filling and solder bumping, and explores their reliability aspects. TSV filling addresses the DRIE (deep reactive ion etching) process, including the coating of functional layers on the TSV wall such as an insulating layer, adhesion layer, and seed layer, and TSV filling with molten solder. Solder bumping processes such as electroplating, solder ball bumping, paste printing, and solder injection on a Cu pillar are discussed. In the reliability part for TSV and solder bumping, the fabrication defects, internal stresses, intermetallic compounds, and shear strength are reviewed. These studies aimed to achieve a robust 3D integration technology effectively for future high-density electronics packaging.

Three-Dimensional Magneto-Optical Recording

2004 ◽  
Vol 834 ◽  
Author(s):  
Akiyoshi Itoh
Keyword(s):  
Storage System ◽  
Three Dimensional ◽  
Optical Recording ◽  
High Density ◽  
The Novel ◽  
National Project ◽  
3 Dimensional ◽  
Disk Storage ◽  
High Density Recording ◽  
New Type

ABSTRACTIn this report, the newly developed three-dimensional magneto-optical (MO) recording scheme and the experimental results are reported. A part of this work has been done as the national project of 3D-MO (3-dimensional MO) project. It started at September 1998 and ended March 2002 as a part of the national project “Nanometer-Scale Optical High Density Disk Storage System” and aimed at achieving 100 Gb/in2 in storage density. Three-dimensional MO recording is one of the prosperous candidates of next generation ultra high density recording. Magnetic amplifying MO system (MAMMOS) is employed for achieving the novel three-dimensional MO recording. Double-MAMMOS scheme consists of 2-recording layers of differing compensation temperature (Tcomp ) and one readout layer was proposed and discussed.With write/read test it is succeeded to show the results corresponding to a 100 Gb/in2 (50 Gb/in2 × 2) recording density. We also proposed and showed results of simulations of a new type of Double-MAMMOS in which the recording layers can hold quadri-valued information by single writing process.

scholarly journals Three-dimensional high-density co-culture with primary tenocytes induces tenogenic differentiation in mesenchymal stem cells

2011 ◽  
Vol 29 (9) ◽  
pp. 1351-1360 ◽  
Author(s):  
Philipp R. A. Schneider ◽  
Constanze Buhrmann ◽  
Ali Mobasheri ◽  
Ulrike Matis ◽  
Mehdi Shakibaei
Keyword(s):  
Stem Cells ◽  
Mesenchymal Stem Cells ◽  
Three Dimensional ◽  
High Density ◽  
Tenogenic Differentiation
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