Application of a high speed, low temperature infrared pyrometer in pulsed power experiments

2001 ◽  
Vol 72 (7) ◽  
pp. 3008-3012 ◽  
Author(s):  
David Partouche-Sebban ◽  
David B. Holtkamp ◽  
R. Richard Bartsch ◽  
Huan Lee ◽  
Gerald G. Schmitt
Keyword(s):  
Low Temperature ◽  
High Speed ◽  
Pulsed Power ◽  
Infrared Pyrometer

Low-temperature f.e.t. for low-power high-speed logic

1977 ◽  
Vol 13 (6) ◽  
pp. 156 ◽  
Author(s):  
H. Rees ◽  
G.S. Sanghera ◽  
R.A. Warriner
Keyword(s):  
Low Temperature ◽  
Low Power ◽  
High Speed

scholarly journals Research on Performance Test System of Space Harmonic Reducer in High Vacuum and Low Temperature Environment

Machines ◽  
2020 ◽  
Vol 9 (1) ◽  
pp. 1
Author(s):  
Jing Wang ◽  
Zhihua Wan ◽  
Zhurong Dong ◽  
Zhengguo Li
Keyword(s):  
Low Temperature ◽  
High Speed ◽  
Performance Test ◽  
High Reliability ◽  
High Vacuum ◽  
Test System ◽  
Low Noise ◽  
Speed Ratio ◽  
Space Harmonic ◽  
Temperature Environment

The harmonic reducer, with its advantages of high precision, low noise, light weight, and high speed ratio, has been widely used in aerospace solar wing deployment mechanisms, antenna pointing mechanisms, robot joints, and other precision transmission fields. Accurately predicting the performance of the harmonic reducer under various application conditions is of great significance to the high reliability and long life of the harmonic reducer. In this paper, a set of automatic harmonic reducer performance test systems is designed. By using the CANOpen bus interface to control the servo motor as the drive motor, through accurately controlling the motor speed and rotation angle, collecting the angle, torque, and current in real time, the life cycle test of space harmonic reducer was carried out in high vacuum and low temperature environment on the ground. Then, the collected data were automatically analyzed and calculated. The test data of the transmission accuracy, backlash, and transmission efficiency of the space harmonic reducer were obtained. It is proven by experiments that the performance data of the harmonic reducer in space work can be more accurately obtained by using the test system mentioned in this paper, which is convenient for further research on related lubricating materials.

An Experimental Investigation of the Auto-Ignition Properties of Two C5 Esters: Methyl Butanoate and Butyl Methanoate

2007 ◽  
Author(s):  
Stephen M. Walton ◽  
Carlos Perez ◽  
Margaret S. Wooldridge
Keyword(s):  
Low Temperature ◽  
High Speed ◽  
Combustion Engine ◽  
Low Temperature Combustion ◽  
Moderate Pressure ◽  
Molecular Weights ◽  
Auto Ignition ◽  
Methyl Butanoate ◽  
Temperature Combustion ◽  
Time Histories

Ignition studies of two small esters were performed using a rapid compression facility (RCF). The esters (methyl butanoate and butyl methanoate) were chosen to have matching molecular weights, and C:H:O ratios, while varying the lengths of the constituent alkyl chains. The effect of functional group size on ignition delay time was investigated using pressure time-histories and high speed digital imaging. The mixtures studied covered a range of conditions relevant to oxygenated fuels and fuel additives, including bio-derived fuels. Low temperature and moderate pressure conditions were selected for study due to their relevance to advanced low temperature combustion strategies, and internal combustion engine conditions. The results are discussed in terms of the reaction pathways affecting the ignition properties.

Study on Bonding Properties of Copper and Aluminum in Nano Scale Using Molecular Dynamics Simulation

2012 ◽  
Vol 152-154 ◽  
pp. 183-187 ◽  
Author(s):  
Quang Cherng Hsu ◽  
Yen Yu Cheng ◽  
Bao Hsin Liu
Keyword(s):  
High Temperature ◽  
Low Temperature ◽  
Bonding Strength ◽  
High Speed ◽  
Tensile Force ◽  
Pure Aluminum ◽  
Pure Copper ◽  
Dynamics Simulation ◽  
Low Speed ◽  
Speed Condition

According to MD simulation results, pressing depth between two bonding materials will affect bonding strength. Alloy material (Al0.9Cu0.1) had void defect phenomenon in low bonding speed condition because the increasing chance of atom migration which will result in low bonding strength. High tensile speed causes material fracture phenomena happen earlier than low speed. Material stress in low speed is smaller than in high speed. Fracture morphology of material is different in different tensile speed. In low speed condition, material can be stretched thinner than in high speed condition. Material in high temperature has greater kinetic energy than low temperature; therefore, material in high temperature has better formability and behaves larger tensile strain than low temperature. For pure aluminum, when temperature raises to 900K which is close to melting point (933K), its crystal structure is no longer belongs to F.C.C. structure, so bonding strength is weaker than low temperature. Large size material has larger contact area than small size material; therefore, the tensile force and tensile strength of the former are larger than the latter. The order of bonding strength for these three materials is: binary alloy > pure copper > pure aluminum.

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