Low angle grain boundary transport in YBa2Cu3O7−δ coated conductors

2000 ◽  
Vol 76 (13) ◽  
pp. 1755-1757 ◽  
Author(s):  
D. T. Verebelyi ◽  
D. K. Christen ◽  
R. Feenstra ◽  
C. Cantoni ◽  
A. Goyal ◽  
...  
2001 ◽  
Vol 11 (1) ◽  
pp. 3868-3871 ◽  
Author(s):  
P. Berghuis ◽  
D.J. Miller ◽  
D.H. Kim ◽  
K.E. Gray ◽  
R. Feenstra ◽  
...  

2001 ◽  
Vol 11 (1) ◽  
pp. 3872-3875 ◽  
Author(s):  
B. Holzapfel ◽  
L. Fernandez ◽  
F. Schindler ◽  
B. de Boer ◽  
N. Reger ◽  
...  

2018 ◽  
Vol 153 ◽  
pp. 205-213 ◽  
Author(s):  
Yan Wang ◽  
Helen M. Chan ◽  
Jeffrey M. Rickman ◽  
Martin P. Harmer

1998 ◽  
Vol 516 ◽  
Author(s):  
V. T. Srikar ◽  
C. V. Thompson

AbstractThe electromigration-induced transport properties of Cu in Al-Cu alloys, and their effect on electromigration lifetimes in interconnects with bamboo grain structures are not well understood. To isolate and study the mechanisms and kinetics of Cu diffusion and electromigration in interconnects for which grain boundary transport is not dominant, we have developed a test structure consisting of parallel Al single crystal lines, with every alternate line terminating in contact pads. Cu is locally added to the same regions in all the lines, and the effect of temperature and electric field can be simultaneously characterized by analyzing the Cu concentration profile measured using electron-probe microanalysis. Comparison of the calculated values of diffusivities with the diffusivity of Cu through the Al lattice, and through dislocation cores in Al, suggests that the path of diffusion of Cu in Al single crystals is along the Al/AlOx interface.


Nano Energy ◽  
2018 ◽  
Vol 43 ◽  
pp. 340-350 ◽  
Author(s):  
Juliane Mürter ◽  
Susann Nowak ◽  
Efi Hadjixenophontos ◽  
Yug Joshi ◽  
Guido Schmitz

2006 ◽  
Vol 88 (13) ◽  
pp. 132508 ◽  
Author(s):  
A. Palau ◽  
T. Puig ◽  
X. Obradors ◽  
R. Feenstra ◽  
A. A. Gapud ◽  
...  

2010 ◽  
Vol 81 (17) ◽  
Author(s):  
M. Weigand ◽  
S. C. Speller ◽  
G. M. Hughes ◽  
N. A. Rutter ◽  
S. Lozano-Perez ◽  
...  

2007 ◽  
Vol 1026 ◽  
Author(s):  
Volkan Ortalan ◽  
Miriam Herrera ◽  
David G. Morgan ◽  
Martin W. Rupich ◽  
Nigel D. Browning

AbstractThe spatial distribution of flux pinning centers in YBa2Cu3O7 (YBCO) coated conductors significantly affects the conductive properties. Nanoparticles acting as pinning centers can be intentionally introduced into the structure by chemical doping. In this study, a Dy-doped YBa2Cu3O7-x coated superconductor was investigated and the particle composition was found to be as (YsDy1-s)2Cu2O5 with s ∼0.6. A tomographic tilt series was acquired using a scanning transmission electron microscope (STEM) to determine the 3-D distribution of nanoparticles. In the investigated sample area, 71 particles were located with a particle size distribution ranging between 13 and 135 nm. The distribution uniformity and size of the particles appeared to be dependent on the grain boundary network structure. Large particles were observed to be located on grain boundaries indicating that fast grain boundary diffusion may determine the particle size.


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