Reducing threshold voltage shifts in amorphous silicon thin film transistors by hydrogenating the gate nitride prior to amorphous silicon deposition

1997 ◽  
Vol 71 (9) ◽  
pp. 1237-1239 ◽  
Author(s):  
Jun-Wei Tsai ◽  
Chun-Yao Huang ◽  
Ya-Hsiang Tai ◽  
Huang-Chung Cheng ◽  
Feng-Cheng Su ◽  
...  
1990 ◽  
Vol 192 ◽  
Author(s):  
Tetsu Ogawa ◽  
Sadayoshi Hotta ◽  
Horoyoshi Takezawa

ABSTRACTThrough the time and temperature dependence measurements on threshold voltage shifts (Δ VT) in amorphous silicon thin film transistors, it has been found that two separate instability mechanisms exist; within short stress time ranges Δ Vτ increases as log t and this behavior corresponds to charge trapping in SiN. On the other hand, in long stress time ranges Δ VT increases as t t/4 and can be explained by time-dependent creation of trap in a-Si.


1991 ◽  
Vol 30 (Part 1, No. 12B) ◽  
pp. 3719-3723 ◽  
Author(s):  
Ryoji Oritsuki ◽  
Toshikazu Horii ◽  
Akira Sasano ◽  
Ken Tsutsui ◽  
Toshiko Koizumi ◽  
...  

1984 ◽  
Vol 33 ◽  
Author(s):  
M. J. Powell

ABSTRACTAmorphous silicon thin film transistors have been fabricated with a number of different structures and materials. To date, the best performance is obtained with amorphous silicon - silicon nitride thin film transistors in the inverted staggered electrode structure, where the gate insulator and semiconductor are deposited sequentially by plasma enhanced chemical vapour deposition in the same growth apparatus.Localised electron states in the amorphous silicon are crucial in determining transistor performance. Conduction band states (Si-Si antibonding σ*) are broadened and localised in the amorphous network, and their energy distribution determines the field effect mobility. The silicon dangling bond defect is the most important deep localised state and their density determines the prethreshold current and hence the threshold voltage. The density of states is influenced by the gate insulator interface and there is probably a decreasing density of states away from this interface. The silicon dangling bond defect in the bulk amorphous silicon nitride also leads to a localised gap state, which is responsible for the observed threshold voltage instability.Other key material properties include the fixed charge densities associated with primary passivating layers placed on top of the amorphous silicon. The low value of the bulk density of states in the amorphous silicon layer increases the sensitivity of device characteristics to charge at the top interface.


2005 ◽  
Vol 87 (2) ◽  
pp. 023502 ◽  
Author(s):  
Shah M. Jahinuzzaman ◽  
Afrin Sultana ◽  
Kapil Sakariya ◽  
Peyman Servati ◽  
Arokia Nathan

1990 ◽  
Vol 192 ◽  
Author(s):  
M. Hack ◽  
W. B. Jackson ◽  
R. Lujan

ABSTRACTWe have developed a means to speed up the recovery of both the threshold voltage shift of hydrogenated amorphous silicon (a-Si:H) transistors and the Vx shift of high voltage a-Si devices. This is accomplished by placing a lightly doped compensated layer adjacent to the active layer in these transistors. This proximity recovery layer does not alter the initial characteristics of a-Si:H transistors and is completely process compatible with standard fabrication procedures.


2007 ◽  
Vol 46 (7A) ◽  
pp. 4042-4045 ◽  
Author(s):  
Chang-Wook Han ◽  
Min-Koo Han ◽  
Nack-Bong Choi ◽  
Chang-Dong Kim ◽  
Ki-Yong Kim ◽  
...  

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