Low-temperature nitridation of silicon surface using NH3-decomposed species in a catalytic chemical vapor deposition system

1997 ◽  
Vol 71 (10) ◽  
pp. 1371-1372 ◽  
Author(s):  
Akira Izumi ◽  
Hideki Matsumura
2000 ◽  
Vol 611 ◽  
Author(s):  
Akira Izumi ◽  
Hidekazu Sato ◽  
Hideki Matsumura

ABSTRACTThis paper reports a procedure for low-temperature nitridation of silicon dioxide (SiO2) surfaces using species produced by catalytic decomposition of NH3 on heated tungsten in catalytic chemical vapor deposition (Cat-CVD) system. The surface of SiO2/Si(100) was nitrided at temperatures as low as 200°C. X-ray photoelectron spectroscopy measurements revealed that incorporated N atoms are bound to Si atoms and O atoms and located top-surface of SiO2.


1999 ◽  
Vol 567 ◽  
Author(s):  
A. Izumi ◽  
S. Sohara ◽  
M. Kudo ◽  
H. Matsumura

ABSTRACTThis paper reports a procedure for low-temperature formation of silicon dioxide (SiO2) using a catalytic chemical vapor deposition (Cat-CVD) system. The surface of Si(100) is oxidized at temperatures as low as 200°C and a few nm SiO2 films are formed. Electrical and structural properties of the layers are investigated. It is found that breakdown electric field, leakage current and the density of intermediate oxidation states is comparable with thermally oxidized sample.


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