The effect of surface nucleation on the evolution of crystalline microstructure during solid phase crystallization of amorphous Si films on SiO2

1997 ◽  
Vol 71 (21) ◽  
pp. 3063-3065 ◽  
Author(s):  
Myung-Kwan Ryu ◽  
Seok-Min Hwang ◽  
Tae-Hoon Kim ◽  
Ki-Bum Kim ◽  
Seok-Hong Min
Keyword(s):  
Solid Phase ◽  
Solid Phase Crystallization ◽  
Surface Nucleation ◽  
Amorphous Si ◽  
Si Films ◽  
Crystalline Microstructure ◽  
Effect Of Surface

Copper-Enhanced Solid Phase Crystallization of Amorphous Silicon Films

1996 ◽  
Vol 424 ◽  
Author(s):  
Dong Kyun Sohn ◽  
Dae Gyu Moon ◽  
Byung Tae Ahn
Keyword(s):  
Solid Phase ◽  
Copper Ions ◽  
Crystallization Time ◽  
Solid Phase Crystallization ◽  
New Process ◽  
Low Temperature Crystallization ◽  
Amorphous Si ◽  
Si Films ◽  
Fractal Size ◽  
Temperature Crystallization

AbstractLow-temperature crystallization of amorphous Si (a-Si) films was investigated by adsorbing copper ions on the surface of the films. The copper ions were adsorbed by spincoating of Cu solution. This new process lowered the crystallization temperature and reduced crystallization time of a-Si films. For 1000 ppm solution, the a-Si film was partly crystallized down to 500°C in 20 h and almost completely crystallized at 530°C in 20 h. The adsorbed Cu on the surface acted as a seed of crystalline and caused fractal growth. The fractal size was varied from 10 to 200 prm, depending on the Cu concentration in solution. But the grain size of the films was about 400 nm, which was similar to that of intrinsic films crystallized at 600°C.

Solid Phase Crystallization of LPCVD Amorphous Si Films by Nucleation Interface Control

1996 ◽  
Vol 448 ◽  
Author(s):  
Eui-Hoon Hwang ◽  
Jae-Sang Ro
Keyword(s):  
Grain Size ◽  
Incubation Time ◽  
Solid Phase ◽  
Composite Films ◽  
Deposition Condition ◽  
Solid Phase Crystallization ◽  
Interface Control ◽  
Amorphous Si ◽  
Si Films ◽  
Deposition Conditions

AbstractA novel method for the fabrication of poly-Si films with a large grain size is reported using solid phase crystallization (SPC) of LPCVD amorphous Si films by nucleation interface control. The reference films used in this study were 1000 Ǻ -thick a-Si films deposited at 500°C at a total pressure of 0.35 Torr using Si2H6/He. Since the deposition condition changes the incubation time, i.e. nucleation rate, and since nucleation occurs dominantly at a-Si/SiO2 interface, we devised the following deposition techniques for the first time in order to obtain the larger gain size. A very thin a-Si layer (~ 50 Ǻ) with the deposition conditions having long incubation time is grown first and then the reference films (~ 950 Ǻ) are grown successively. Various composite films with different combinations were tested. The crystallization kinetics of composite films was observed to be determined by the deposition conditions of a thin a-Si layer at the a-Si/SiO2 interface. Nucleation interface was also observed to be modified by interrupted gas supply resulting in the enhancement of the grain size.

Solid Phase Crystallization (SPC) Behavior of Amorphous Si Bilayer Films with Different Concentration of Oxygen: Surface vs. Interface-nucleation

2000 ◽  
Vol 621 ◽  
Author(s):  
Myung-Kwan Ryu ◽  
Jang-Yeon Kwon ◽  
Ki-Bum Kim
Keyword(s):  
Oxygen Concentration ◽  
Solid Phase ◽  
Film Surface ◽  
Single Layer ◽  
Bilayer Structure ◽  
Solid Phase Crystallization ◽  
Bilayer Films ◽  
Surface Nucleation ◽  
Amorphous Si ◽  
Oxygen Surface

ABSTRACTSolid-phase crystallization (SPC) behavior of a-Si film [a-Si(II)] in which oxygen concentration (CO) is higher at the a-Si/SiO2 interface (CO=5×1021/cm3) than at the film surface (CO=3×1020/cm3) has been investigated. The results were also compared with that of a-Si single layer [a- Si(I), 600 Å] with CO=3×1020/cm3. It has been found that the interface-nucleation was suppressed in the a-Si(II) and the surface-nucleation occurred to make a poly-Si/a-Si (300 Å/300Å) bilayer structure. Many equiaxial grains with sizes of 1∼2 [.proportional]m were formed in the surface- nucleated poly-Si layer. Compared with the results of conventional SPC poly-Si (600 Åthick) in which elliptical grains with sizes of 0.5∼1 [.proportional]m were formed by the interface (a-Si/SiO2)- nucleation, we concluded that the poly-Si/a-Si bilayer scheme is a method to improve the microstructure of SPC poly-Si film.

Correlation Between Annealing Temperature and Crystallinity of Si Films Prepared by Thermal Plasma Jet Crystallization Technique

2006 ◽  
Vol 910 ◽  
Author(s):  
Hirotaka Kaku ◽  
Seiichiro Higashi ◽  
Tatsuya Okada ◽  
Hideki Murakami ◽  
Seiichi Miyazaki
Keyword(s):  
Phase Transformation ◽  
Thermal Plasma ◽  
Crystalline State ◽  
Annealing Temperature ◽  
Solid Phase ◽  
Plasma Jet ◽  
Solid Phase Crystallization ◽  
Thermal Plasma Jet ◽  
Amorphous Si ◽  
Si Films

AbstractTransient reflectivity of amorphous Si (a-Si) films during thermal plasma jet (TPJ) irradiation has been measured to characterize the phase transformation in millisecond time domain. The a-Si films first transform to crystalline by solid phase crystallization (SPC) followed by melting of the film, and then solidifies to the final crystalline state. By increasing the SPC temperature from about 1100 K to 1300 K, the duration of phase transformation decreases from about 1 ms to 100 μs. The crystallinity of the SPC films is improved not only by annealing the films at a high temperature but also annealing them with longer duration.

Uniform Poly-Si TFTs for AMOLEDs Using Field-Enhanced Rapid Thermal Annealing

2007 ◽  
Vol 124-126 ◽  
pp. 447-450 ◽  
Author(s):  
Hyoung June Kim
Keyword(s):  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Thin Film Transistors ◽  
Solid Phase ◽  
Radiative Heating ◽  
Solid Phase Crystallization ◽  
Glass Substrates ◽  
Grain Structures ◽  
Amorphous Si ◽  
Si Thin Film

Polycrystalline Si thin film transistors (TFTs) have been fabricated through solid phase crystallization using field-enhanced rapid thermal annealing (FE-RTA) system. The system consists of inline furnace modules for preheating and cooling of the glass substrates and a process module for rapid radiative heating combined with alternating magnetic field induction. The FE-RTA system enables crystallization of amorphous Si at high throughputs without any glass damages. While the typical grain structures of poly-Si by FE-RTA are similar to those of solid phase crystallization, the residual amorphous Si and intragranular defects are reduced.

Raman Spectroscopy of Si Nanocrystals in Nanocrystalline Si Superlattices: Size, Shape and Crystallographic Orientation

2000 ◽  
Vol 638 ◽  
Author(s):  
G. F. Grom ◽  
P. M. Fauchet ◽  
L. Tsybeskov ◽  
J. P. McCaffrey ◽  
H. J. Labbé ◽  
...  
Keyword(s):  
Raman Spectroscopy ◽  
Crystallographic Orientation ◽  
Phonon Scattering ◽  
Solid Phase ◽  
Structural Parameters ◽  
Device Fabrication ◽  
Interface Roughness ◽  
Solid Phase Crystallization ◽  
Si Nanocrystals ◽  
Amorphous Si

AbstractWe use Raman spectroscopy to study the size, shape and crystallographic orientation of silicon nanocrystals formed by solid phase crystallization of amorphous Si/SiO2 superlattices (SLs) grown by radio-frequency sputtering. The first and second Raman peaks broadening, their relative positions and intensities indicate the presence of nanoscale Si objects with a degree of disorder (grain boundaries) and strain (Si/SiO2 interfaces). Shapes of Si nanocrystals sandwiched between SiO2 layers strongly influence the Si/SiO2 interface roughness, which is inferred from the intensities of folded acoustic phonon scattering. The averaged crystallographic orientation of Si nanocrystals is determined by polarized Raman analysis. The laterally elongated nanocrystals exhibit <111> preferred crystallographic orientation along the SL axis due to orientation-dependent crystallization rates. These results demonstrate that control over Si nanocrystals structural parameters has been achieved and that solid phase crystallization of nanometer-thick amorphous Si films remains one of the most promising techniques for Si-based nanoelectronic device fabrication.

Enhancement of lateral solid phase epitaxial growth in evaporated amorphous Si films by phosphorus implantation

1985 ◽  
Vol 46 (3) ◽  
pp. 268-270 ◽  
Author(s):  
Hiroshi Yamamoto ◽  
Hiroshi Ishiwara ◽  
Seijiro Furukawa
Keyword(s):  
Epitaxial Growth ◽  
Solid Phase ◽  
Amorphous Si ◽  
Si Films

Solid-phase crystallization of high-quality Si films on SiO2 by local Ge-insertion

2004 ◽  
Vol 451-452 ◽  
pp. 489-492 ◽  
Author(s):  
I. Tsunoda ◽  
K. Nagatomo ◽  
A. Kenjo ◽  
T. Sadoh ◽  
M. Miyao
Keyword(s):  
Solid Phase ◽  
Solid Phase Crystallization ◽  
High Quality ◽  
Si Films
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