Direct integration of ferroelectric La–Sr–Co–O/Pb–Nb–Zr–Ti–O/La–Sr–Co–O capacitors on silicon with conducting barrier layers

1996 ◽  
Vol 68 (10) ◽  
pp. 1350-1352 ◽  
Author(s):  
A. M. Dhote ◽  
S. Madhukar ◽  
W. Wei ◽  
T. Venkatesan ◽  
R. Ramesh ◽  
...  
Keyword(s):  
Direct Integration ◽  
Barrier Layers

The Correlation of Adhesion Strength with Barrier Structure in Cu Metallization

2003 ◽  
Vol 766 ◽  
Author(s):  
A. Sekiguchi ◽  
J. Koike ◽  
K. Ueoka ◽  
J. Ye ◽  
H. Okamura ◽  
...  
Keyword(s):  
Thin Films ◽  
Adhesion Strength ◽  
Nitrogen Concentration ◽  
Scratch Test ◽  
Barrier Structure ◽  
Barrier Layers ◽  
Cu Metallization ◽  
Microstructure Observation ◽  
Sputter Deposited ◽  
Sulfur Containing

AbstractAdhesion strength in sputter-deposited Cu thin films on various types of barrier layers was investigated by scratch test. The barrier layers were Ta1-xNx with varied nitrogen concentration of 0, 0.2, 0.3, and 0.5. Microstructure observation by TEM indicated that each layer consists of mixed phases of β;-Ta, bcc-TaN0.1, hexagonal-TaN, and fcc-TaN, depending on the nitrogen concentration. A sulfur- containing amorphous phase was also present discontinuously at the Cu/barrier interfaces in all samples. Scratch test showed that delamination occurred at the Cu/barrier interface and that the overall adhesion strength increased with increasing the nitrogen concentration. A good correlation was found between the measured adhesion strength and the composing phases in the barrier layer.

Barrier layers and tropical Atlantic SST biases in coupled GCMs

2008 ◽  
Author(s):  
W. -P. Breugem ◽  
P. Chang ◽  
C. J. Jang ◽  
J. Mignot ◽  
W. Hazeleger
Keyword(s):  
Tropical Atlantic ◽  
Barrier Layers

The thioamidation of gem-dibromoalkenes in an aqueous medium

2021 ◽  
Vol 19 (11) ◽  
pp. 2473-2480
Author(s):  
Jigarkumar K. Vankar ◽  
Ankush Gupta ◽  
Jaydeepbhai P. Jadav ◽  
Shankara H. Nanjegowda ◽  
Guddeangadi N. Gururaja
Keyword(s):  
Aqueous Medium ◽  
Direct Integration ◽  
Amine Groups

The direct integration of sulphur and amine groups with 1,1-dibromoalkenes for thioamide synthesis has been achieved in an aqueous medium.

Atomic Layer Deposited Materials as Barrier Layers for Preservation of Nb Superconductivity in Multilayered Thin-Film Structures

2021 ◽  
pp. 1-1
Author(s):  
Vaibhav Gupta ◽  
Mark L. Adams ◽  
John A. Sellers ◽  
Noah Niedzwiecki ◽  
Nick Rush ◽  
...  
Keyword(s):  
Thin Film ◽  
Atomic Layer ◽  
Multilayered Thin Film ◽  
Barrier Layers

Direct integration of the third-order two point and multipoint Robin type boundary value problems

2021 ◽  
Vol 182 ◽  
pp. 411-427
Author(s):  
Nadirah Mohd Nasir ◽  
Zanariah Abdul Majid ◽  
Fudziah Ismail ◽  
Norfifah Bachok
Keyword(s):  
Boundary Value Problems ◽  
Boundary Value ◽  
Direct Integration ◽  
Third Order ◽  
The Third ◽  
Type Boundary

Failure mechanisms of PVD Ta and ALD TaN barrier layers for Cu contact applications

2007 ◽  
Vol 84 (11) ◽  
pp. 2669-2674 ◽  
Author(s):  
C. Zhao ◽  
Zs. Tőkei ◽  
A. Haider ◽  
S. Demuynck
Keyword(s):  
Failure Mechanisms ◽  
Barrier Layers
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