scholarly journals Effect of Trace Zn Addition on Interfacial Evolution in Sn-10Bi/Cu Solder Joints during Aging Condition

Materials ◽  
2019 ◽  
Vol 12 (24) ◽  
pp. 4240
Author(s):  
Qingfeng Wang ◽  
Hong Chen ◽  
Fengjiang Wang
Keyword(s):  
Interfacial Reaction ◽  
Thermal Aging ◽  
Solder Joints ◽  
Depressing Effect ◽  
Aging Condition ◽  
Obvious Effect ◽  
Cu Substrate ◽  
Zn Addition ◽  
Reliability Of Solder Joints ◽  
Interfacial Evolution

Excessive growth of intermetallic compounds (IMCs) during service affects the reliability of solder joints, so how to suppress the growth of IMC thickness at the interface in solder joints becomes a widespread concern. In this work, the interfacial reaction between Sn-10Bi solder and Cu substrate after thermal aging was investigated. Moreover, to depress the IMC growth at the interface, trace amounts of Zn was added into the Sn-10Bi solder, and the interfacial reactions of Sn-10Bi-xZn solders (x = 0.2, 0.5) and Cu substrate after thermal aging were studied in this paper. Compounds such as Cu6(Sn, Zn)5 and Cu5Zn8 were formed at the interface after adding trace amounts of Zn. The addition of 0.2 and 0.5 wt% Zn significantly inhibited the thickness growth of IMCs and the formation of Cu3Sn IMC at the interface of Sn-10Bi-0.2Zn/Cu and Sn-10Bi-0.5Zn/Cu during thermal aging. Therefore, the addition of trace Zn had an obvious effect on the interfacial reaction of Sn-10Bi/Cu solder joint. Interestingly, the evolution of IMC thickness in Sn-10Bi-0.5Zn/Cu solder joints was completely different from that in Sn-10Bi or Sn-10Bi-0.2Zn solder joints, in which the spalling of IMCs occurred. In order to explore the mechanisms on the depressing effect from the addition of trace Zn, the activation energy Q in solder joints during aging was calculated.

scholarly journals Ag3Sn Compounds Coarsening Behaviors in Micro-Joints

Materials ◽  
2018 ◽  
Vol 11 (12) ◽  
pp. 2509 ◽  
Author(s):  
Ye Tian ◽  
Ning Ren ◽  
Zhihua Zhao ◽  
Fengshun Wu ◽  
Suresh Sitaraman
Keyword(s):  
Kinetic Model ◽  
Thermal Shock ◽  
Thermal Aging ◽  
Experimental Validation ◽  
Flip Chip ◽  
Ostwald Ripening ◽  
Solder Joints ◽  
Critical Role ◽  
Growth Exponent ◽  
Reliability Of Solder Joints

As solder joints are being scaled down, intermetallic compounds (IMCs) are playing an increasingly critical role in the reliability of solder joints, and thereby an in-depth understanding of IMCs microstructure evolutions in micro-joints is of great significance. This study focused on coarsening behaviors of Ag3Sn compounds in Sn-3.0Ag-0.5Cu (SAC305) micro-joints of flip chip assemblies using thermal shock (TS) tests. The results showed that the Ag3Sn compounds grew and rapidly coarsened into larger ones as TS cycles increased. Compared with such coarsening behaviors during thermal aging, TS exhibited a significantly accelerating influence. This predominant contribution is quantitatively determined to be induced by strain-enhanced aging. Moreover, based on observations for Ag3Sn microstructure evolutions during TS cycling, one particular finding showed that there are two types of coarsening modes (i.e., Ostwald ripening and Necking coalescence) co-existing in the Ag3Sn coarsening process. The corresponding evolutions mechanism was elucidated in a combination of simulative analysis and experimental validation. Furthermore, a kinetic model of the Ag3Sn coarsening was established incorporating static aging and strain-enhanced aging constant, the growth exponent (n) was calculated to be 1.70, and the predominant coarsening mode was confirmed to be the necking coalescence.

Interfacial reaction, microstructure and hardness between graphene-coated Cu substrate and SAC305 solder doped with minor Ni during isothermal aging

2019 ◽  
Vol 33 (06) ◽  
pp. 1950060
Author(s):  
Shengli Li ◽  
Yang Liu ◽  
Hongming Cai ◽  
Hao Zhang ◽  
Fenglian Sun
Keyword(s):  
Aging Time ◽  
Solder Alloy ◽  
Interfacial Reaction ◽  
Isothermal Aging ◽  
Total Thickness ◽  
Aging Condition ◽  
Sac305 Solder ◽  
Cu Substrate ◽  
Cu Substrates ◽  
Solder Bulk

This study investigated the influences of Cu, high temperature-treated Cu (H-Cu) and graphene-coated Cu (G-Cu) substrates on interfacial reaction, microstructure and hardness of Sn-3.0g-0.5Cu (SAC305) solder alloy. Intermetallic compound (IMC) layer evolution and mechanical property of Sn-3.0g-0.5Cu-0.3Ni (SAC305-0.3Ni) solder joints were also studied under different aging duration. A continuous scallop-like IMC layer was observed at SAC305/Cu, SAC305/H-Cu, SAC305/G-Cu interfaces during reflow and isothermal aging. After adding Ni in the SAC305-0.3Ni solder alloy, the roughness of IMC layer on Cu, H-Cu substrates increased. In contrast, the addition of Ni had a limited impact on the roughness of IMC layer on G-Cu substrates. The total thickness of IMC layer grew as aging time increases, proportionated to the square root of aging duration. The addition of Ni in the solder alloy promoted the growth of IMC layer on Cu and H-Cu substrates, but it was restrained on G-Cu substrate. The amount of the IMC phases in SAC305 and SAC305-0.3Ni solder bulks on the three substrates increased significantly as aging time prolonged. Thus, the hardness of SAC305 and SAC305-0.3Ni solder bulks on the three substrates rose. The addition of Ni in the solder bulks on the three substrates sharply enhanced the formation of [Formula: see text]-Sn phases and increased the quantity of the IMCs. Consequently, the hardness of SAC305-0.3Ni solder bulks was higher than that of SAC305 solder bulk on the three substrates under same aging condition. In addition, the graphene-coated layer on G-Cu substrate could improve the hardness of SAC305 and SAC305-0.3Ni solder bulks.

Retardation of thermomigration-induced Cu substrate consumption in Pb-free solder joints by Zn addition

2017 ◽  
Vol 695 ◽  
pp. 1436-1443 ◽  
Author(s):  
Y. Zhong ◽  
N. Zhao ◽  
H.T. Ma ◽  
W. Dong ◽  
M.L. Huang
Keyword(s):  
Solder Joints ◽  
Substrate Consumption ◽  
Cu Substrate ◽  
Zn Addition ◽  
Free Solder

scholarly journals Crystallographic Characteristic Effect of Cu Substrate on Serrated Cathode Dissolution in Cu/Sn–3.0Ag–0.5Cu/Cu Solder Joints during Electromigration

Materials ◽  
2021 ◽  
Vol 14 (10) ◽  
pp. 2486
Author(s):  
Wu Yue ◽  
Chao Ding ◽  
HongBo Qin ◽  
ChengGong Gong ◽  
JunXi Zhang
Keyword(s):  
First Principles ◽  
Solder Joints ◽  
Electron Backscatter Diffraction ◽  
First Principles Calculation ◽  
Dissolution Behavior ◽  
Cu Substrate ◽  
Crystallographic Characteristic ◽  
Calculation Results ◽  
Reliability Of Solder Joints ◽  
Characteristic Effect

The crystallographic characteristic effect of Cu substrate on cathode dissolution behavior in line-type Cu/Sn–3.0Ag–0.5Cu (SAC305)/Cu solder joints during electromigration (EM) was investigated by scanning electron microscope (SEM), electron backscatter diffraction (EBSD), and first-principles calculations. The SEM and EBSD results show that the crystallographic characteristic of Cu substrate is crucial to cathode dissolution behavior under a direct current of 1.5 × 104 A/cm2 at 125 °C ± 2 °C. When the (001) plane of copper grain adjacent to the Cu3Sn/Cu interface is perpendicular or nearly perpendicular to the current direction, local cathode dissolution tips are easily formed, whereas the (111) plane remains mostly undissolved, which finally leads to the inhomogeneous cathode serrated dissolution in the substrate. The first-principles calculation results reveal that the different surface energies and energy barriers of the different crystallographic planes of Cu grains in the substrate are responsible for the local cathode dissolution tips. Adjusting the copper grain in a substrate to a crystal plane or direction that is difficult to dissolve during EM is a promising method for improving the reliability of solder joints in the future.

scholarly journals Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Jianguo Cui ◽  
Keke Zhang ◽  
Di Zhao ◽  
Yibo Pan
Keyword(s):  
Shear Strength ◽  
Thermal Cycling ◽  
Solder Joints ◽  
High Reliability ◽  
Sharp Decrease ◽  
Thermal Shock Test ◽  
Shear Properties ◽  
Equivalent Time ◽  
Ultrasonic Assisted ◽  
Reliability Of Solder Joints

AbstractThrough ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu (x = 0, 0.05, 0.1) soldering test and − 40 to 125 °C thermal shock test, the microstructure and shear properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the SEM, EDS and XRD. The results show that the Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints with high quality and high reliability can be obtained by ultrasonic assistance. When the ultrasonic vibration power is 88 W, the ultrasonic-assisted Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joints exhibits the optimized performance. During the thermal cycling process, the shear strength of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had a linear relationship with the thickness of interfacial intermetallic compound (IMC). Under the thermal cycling, the interfacial IMC layer of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints consisted of (Cu,Ni)6Sn5 and Cu3Sn. The thickness of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints was linearly related to the square root of equivalent time. The growth of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had an incubation period, and the growth of IMC was slow within 300 cycles. And after 300 cycles, the IMC grew rapidly, the granular IMC began to merge, and the thickness and roughness of IMC increased obviously, which led to a sharp decrease in the shear strength of the solder joints. The 0.05 wt% Ni could inhibit the excessive growth of IMC, improve the shear strength of solder joints and improve the reliability of solder joints. The fracture mechanism of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints changed from the ductile–brittle mixed fracture in the solder/IMC transition zone to the brittle fracture in the interfacial IMC.

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