A UHV‐compatible thin‐film stress‐measuring apparatus based on the cantilever beam principle

1990 ◽  
Vol 61 (12) ◽  
pp. 3859-3862 ◽  
Author(s):  
R. Koch ◽  
H. Leonhard ◽  
G. Thurner ◽  
R. Abermann
Keyword(s):  
Thin Film ◽  
Cantilever Beam ◽  
Film Stress ◽  
Measuring Apparatus ◽  
Thin Film Stress ◽  
Stress Measuring

Effect of Thickness and Annealing on Stress in Tantalum and Tantalum Nitride Thin Film Hard Coatings

1996 ◽  
Vol 436 ◽  
Author(s):  
Ranjana Saha ◽  
Rama B. Inturi ◽  
John A. Barnard
Keyword(s):  
Thin Film ◽  
Hard Coatings ◽  
Tantalum Nitride ◽  
Film Stress ◽  
Thin Film Stress ◽  
Stress Measuring ◽  
Long Term Performance ◽  
Term Performance ◽  
The Relationship

AbstractAn understanding of the relationship between stress and the other properties of thin films is extremely useful in the design of hard coatings for long term performance. In our earlier study, sputtered Ta and Ta(N) films were found to exhibit promising hard coating properties. For example, nano hardness as high as 30 GPa was observed in the nitride (pN2 = 0.100 mTorr) films. In this work, we study the variation in the stress in these films with respect to film thickness and annealing. Films in six different thicknesses (50, 250, 350, 500, 750, and 1000 nm) were deposited on oxide coated Si (111) wafers. Stresses in the films in the as-deposited state and as a function of temperature (300°C) were determined using a thin film stress measuring unit.

scholarly journals Controlling Thin-Film Stress and Wrinkling during Perovskite Film Formation

2018 ◽  
Vol 3 (6) ◽  
pp. 1225-1232 ◽  
Author(s):  
Kevin A. Bush ◽  
Nicholas Rolston ◽  
Aryeh Gold-Parker ◽  
Salman Manzoor ◽  
Jakob Hausele ◽  
...  
Keyword(s):  
Thin Film ◽  
Film Formation ◽  
Film Stress ◽  
Thin Film Stress
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