Thermodynamic effects in depth profiling and ion‐beam mixing without invoking thermal spikes

1994 ◽  
Vol 64 (20) ◽  
pp. 2649-2651 ◽  
Author(s):  
Roger Kelly ◽  
Antonio Miotello
1994 ◽  
Vol 21 (6-7) ◽  
pp. 370-377 ◽  
Author(s):  
N. Laidani ◽  
L. Calliari ◽  
R. Kelly ◽  
A. Miotello

1990 ◽  
Vol 181 ◽  
Author(s):  
Seemi Kazmi ◽  
Roman V. Kruzelecky ◽  
David A. Thompson

ABSTRACTNi/Ge/Au and Ni/Ge/Pd contacts have been made on 1018 cm-3 n-type GaAs. The contacts were subjected to ion beam mixing through the metallization using 70-130 keV Se+ ions and subsequently subjected to rapid thermal annealing (RTA). These are compared with unimplanted contacts produced by RTA techniques on the same substrate. The specific contact resistance ,pc, has been measured for the two systems. In addition, the contacts have been studied using Auger depth profiling and SEM studies have been used to determine surface morphology. Values of pc ∽ 10-6 -10-7 ohm-cm2 have been measured. It is observed that ion beam mixing or the addition of a Ti overlayer (to the Ni/Ge/Au) improves the contact morphology.


1986 ◽  
Vol 69 ◽  
Author(s):  
D. Coulman ◽  
A. Turner

AbstractIt has been well established that sputtering artifacts such as ion beam mixing, preferential sputtering and cone formation ultimately limit interface resolution in Auger and ESCA depth profiling. We have conducted a comparision of the effect of sample rotation, and of the angle of incidence of the ion beam using one and two ion guns on interface resolution. Our investigation has concentrated on the interface resolution and detection of impurities at the various interfaces of a typical semiconductor metallization scheme [Al 700 nm/ TiW 100 nm/ Si02 100 nm/Si]. We have determined that in going from a standard sputtering geometry of a 67 degree tilt from the surface normal to 80 degrees one obtains a factor of five improvement in interface resolution. Sample rotation, on the other hand, was found to improve interface resolution by a factor of two at 67 degrees and to result in minor improvement at 80 degrees. The effect of two ion guns was found to have a negligible effect on the samples studied.


1996 ◽  
Vol 80 (5) ◽  
pp. 2702-2711 ◽  
Author(s):  
Émile J. Knystautas ◽  
Sergio Lo Russo ◽  
Roger Kelly ◽  
Antonio Miotello

Author(s):  
Mark Denker ◽  
Jennifer Wall ◽  
Mark Ray ◽  
Richard Linton

Reactive ion beams such as O2+ and Cs+ are used in Secondary Ion Mass Spectrometry (SIMS) to analyze solids for trace impurities. Primary beam properties such as energy, dose, and incidence angle can be systematically varied to optimize depth resolution versus sensitivity tradeoffs for a given SIMS depth profiling application. However, it is generally observed that the sputtering process causes surface roughening, typically represented by nanometer-sized features such as cones, pits, pyramids, and ripples. A roughened surface will degrade the depth resolution of the SIMS data. The purpose of this study is to examine the relationship of the roughness of the surface to the primary ion beam energy, dose, and incidence angle. AFM offers the ability to quantitatively probe this surface roughness. For the initial investigations, the sample chosen was <100> silicon, and the ion beam was O2+.Work to date by other researchers typically employed Scanning Tunneling Microscopy (STM) to probe the surface topography.


Author(s):  
A. K. Rai ◽  
R. S. Bhattacharya ◽  
M. H. Rashid

Ion beam mixing has recently been found to be an effective method of producing amorphous alloys in the binary metal systems where the two original constituent metals are of different crystal structure. The mechanism of ion beam mixing are not well understood yet. Several mechanisms have been proposed to account for the observed mixing phenomena. The first mechanism is enhanced diffusion due to defects created by the incoming ions. Second is the cascade mixing mechanism for which the kinematicel collisional models exist in the literature. Third mechanism is thermal spikes. In the present work we have studied the mixing efficiency and ion beam induced amorphisation of Ni-Ti system under high energy ion bombardment and the results are compared with collisional models. We have employed plan and x-sectional veiw TEM and RBS techniques in the present work.


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