Young’s modulus of a thin film determined from the peak shifts of its membrane modes

1992 ◽  
Vol 61 (17) ◽  
pp. 2024-2026 ◽  
Author(s):  
A. Fartash
Keyword(s):  
Thin Film ◽  
Young’S Modulus ◽  
Young's Modulus

Measurement of Young's Modulus and Poisson's Ratio of Thin Film by Combination of Bulge Test and Nano-Indentation

2008 ◽  
Vol 33-37 ◽  
pp. 969-974 ◽  
Author(s):  
Bong Bu Jung ◽  
Seong Hyun Ko ◽  
Hun Kee Lee ◽  
Hyun Chul Park
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Young’S Modulus ◽  
Poisson’S Ratio ◽  
Young's Modulus ◽  
Applied Pressure ◽  
Indentation Test ◽  
Poisson's Ratio ◽  
Bulge Test ◽  
Nano Indentation

This paper will discuss two different techniques to measure mechanical properties of thin film, bulge test and nano-indentation test. In the bulge test, uniform pressure applies to one side of thin film. Measurement of the membrane deflection as a function of the applied pressure allows one to determine the mechanical properties such as the elastic modulus and the residual stress. Nano-indentation measurements are accomplished by pushing the indenter tip into a sample and then withdrawing it, recording the force required as a function of position. . In this study, modified King’s model can be used to estimate the mechanical properties of the thin film in order to avoid the effect of substrates. Both techniques can be used to determine Young’s modulus or Poisson’s ratio, but in both cases knowledge of the other variables is needed. However, the mathematical relationship between the modulus and Poisson's ratio is different for the two experimental techniques. Hence, achieving agreement between the techniques means that the modulus and Poisson’s ratio and Young’s modulus of thin films can be determined with no a priori knowledge of either.

Determination of Mechanical Properties of Thin Film on Silicon Wafer

2003 ◽  
Author(s):  
Enboa Wu ◽  
Albert J. D. Yang ◽  
Ching-An Shao ◽  
C. S. Yen
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Thermal Expansion ◽  
Young’S Modulus ◽  
Silicon Wafer ◽  
Coefficient Of Thermal Expansion ◽  
Young's Modulus ◽  
Poisson Ratio ◽  
Bulk State

Nondestructive determination of Young’s modulus, coefficient of thermal expansion, Poisson ratio, and thickness of a thin film has long been a difficult but important issue as the film of micrometer order thick might behave differently from that in the bulk state. In this paper, we have successfully demonstrated the capability of determining all these four parameters at one time. This novel method includes use of the digital phase-shifting reflection moire´ (DPRM) technique to record the slope of wafer warpage under temperature drop condition. In the experiment, 1-um thick aluminum was sputtered on a 6-in silicon wafer. The convolution relationship between the measured data and the mechanical properties was constructed numerically using the conventional 3D finite element code. The genetic algorithm (GA) was adopted as the searching tool for search of the optimal mechanical properties of the film. It was found that the determined data for Young’s modulus (E), Coefficient of Thermal Expansion (CTE), Poisson ratio (ν), and thickness (h) of the 1.00 um thick aluminum film were 104.2Gpa, 38.0 ppm/°C, 0.38, and 0.98 um, respectively, whereas that in the bulk state were measured to be E=71.4 Gpa, CTE=23.0 ppm/°C, and ν=0.34. The significantly larger values on the Young’s modulus and the coefficient of thermal expansion determined by this method might be attributed to the smaller dislocation density due to the thin dimension and formation of the 5-nm layer of Al2O3 formed on top of the 1-um thick sputtered film. The Young’s Modulus and the Poisson ratio of this nano-scale Al2O3 film were then determined. Their values are consistent with the physical intuition of the microstructure.

Influence of annealing on microstructure & molecular orientation, thermal behaviour, mechanical properties and their correlations of uniaxially drawn iPP thin film

e-Polymers ◽  
2008 ◽  
Vol 8 (1) ◽  
Author(s):  
Sayant Saengsuwan
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Tensile Strength ◽  
Young’S Modulus ◽  
Thermal Behaviour ◽  
Annealing Time ◽  
Molecular Orientation ◽  
Young's Modulus ◽  
Crystal Thickness ◽  
Scanning Calorimetry

AbstractThe influence of annealing on the microstructure and molecular orientation, thermal behaviour and mechanical properties of uniaxially drawn iPP thin film was studied by wide-angle X-ray diffraction, differential scanning calorimetry and tensile testing, respectively. The correlations of mechanical and microstructural properties of annealed films were also examined. The transformation of smectic phase of iPP to the α-form was more pronounced with increasing annealing time and temperature. The true and apparent crystallinities and crystal thickness were strongly enhanced with annealing time and temperature. The relative molecular orientation tended to increase with annealing time. These results caused the significant improvement of modulus and tensile strength of the annealed films in both machine (MD) and transverse (TD) directions. The increases in MD-Young’s modulus and MD-tensile strength were well correlated with the increase in true crystallinity obtained in equatorial scans. Some relationship between the increase in crystal thickness and the increase in Young’s modulus in both MD and TD directions was also found.

Evaluation of Young's Modulus for Polymer Thin Film on Isotropic Substrate by ComplexV(z) Curve

2004 ◽  
Vol 43 (5B) ◽  
pp. 2920-2923 ◽  
Author(s):  
Masahiro Maebayashi ◽  
Tatsuro Matsuoka ◽  
Shinobu Koda ◽  
Ryuki Hashitani ◽  
Tomohiro Nishio ◽  
...  
Keyword(s):  
Thin Film ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Polymer Thin Film ◽  
Z Curve

An In Situ Measuring Method for Young's Modulus of a MEMS Film Base on Resonance Frequency

2012 ◽  
Vol 503 ◽  
pp. 308-311
Author(s):  
Han Chen ◽  
Hua Rong
Keyword(s):  
Thin Film ◽  
Resonance Frequency ◽  
Young’S Modulus ◽  
Circular Plate ◽  
Material Property ◽  
Young's Modulus ◽  
Measuring Method ◽  
Test Structure ◽  
Film Research

Large-scale measurement of material property is not suit for the MEMS thin-film. Research the in-situ measuring method for material property of the MEMS thin-film is urgently. A center-anchored circular plate is adopted as the test structure here. The resonance frequency of the circular plate is measured to extract the Young’s modulus of a MEMS thin-film. The accuracy of this non-contact in-situ measuring method has been verified by CoventorWare. The inferences of the stress gradient have been analyzed. The advantages of the test structure and the measuring method present here also have been discussed.

An Ultra-High Q Silicon Cantilever Resonator for Thin Film Internal Friction and Young's Modulus Measurements

2012 ◽  
Vol 184 ◽  
pp. 325-330 ◽  
Author(s):  
Thomas H. Metcalf ◽  
Xiao Liu
Keyword(s):  
Thin Film ◽  
Internal Friction ◽  
Young’S Modulus ◽  
Liquid Helium ◽  
Young's Modulus ◽  
Thermoelastic Damping ◽  
Low Background ◽  
Silicon Cantilever

An audiofrequency (8.5 kHz) cantilever resonator with an extremely low background internal friction (Q-1≈2×10-8) at liquid helium temperatures has been developed. Above 30 K, theQof the resonator is dominated by thermoelastic loss;Q-1is nearly exactly described by Zener’s formula for thermoelastic damping. Below 30 K,Q-1decreases monotonically with decreasing temperature, reaching a typical baseline ofQ-1=1.5×10-8at 400 mK.

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