New method to improve the adhesion strength of tungsten thin film on silicon by W2N glue layer

1992 ◽  
Vol 61 (5) ◽  
pp. 537-539 ◽  
Author(s):  
Yong Tae Kim ◽  
Chang Woo Lee ◽  
Suk‐Ki Min
Keyword(s):  
Thin Film ◽  
Adhesion Strength ◽  
New Method

Annealing in water vapor as a new method for improvement of silicon thin film properties

2006 ◽  
Vol 352 (9-20) ◽  
pp. 955-958 ◽  
Author(s):  
S. Honda ◽  
A. Fejfar ◽  
J. Kočka ◽  
T. Yamazaki ◽  
A. Ogane ◽  
...  
Keyword(s):  
Thin Film ◽  
Water Vapor ◽  
New Method ◽  
Silicon Thin Film ◽  
Film Properties

Thin film electrode: a new method for the fabrication of submicrometer band electrodes

1991 ◽  
Vol 36 (5-6) ◽  
pp. 763-771 ◽  
Author(s):  
B.J. Seddon ◽  
M.J. Eddowes ◽  
A. Firth ◽  
A.E. Owen ◽  
H.H.J. Girault
Keyword(s):  
Thin Film ◽  
New Method ◽  
Film Electrode ◽  
Thin Film Electrode

Measurement of thermal expansion coefficient of substrate GGG and its epitaxial layer YIG

1999 ◽  
Vol 14 (1) ◽  
pp. 2-4 ◽  
Author(s):  
Rui-sheng Liang ◽  
Feng-chao Liu
Keyword(s):  
Thin Film ◽  
Thermal Expansion ◽  
Single Crystal ◽  
Thermal Expansion Coefficient ◽  
Epitaxial Layer ◽  
Expansion Coefficient ◽  
Linear Thermal Expansion ◽  
New Method ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients

A new method is used in measuring the linear thermal expansion coefficients in composite consisting of a substrate Gd3Ga2Ga3O12 (GGG) and its epitaxial layer Y3Fe2Fe3O12 (YIG) within the temperature range 13.88 °C–32.50 °C. The results show that the thermal expansion coefficient of GGG in composite is larger than that of the GGG in single crystal; the thermal expansion coefficient of thick film YIG is also larger than that of thin film. The results also show that the thermal expansion coefficient of a composite consisting of film and its substrate can be measured by using a new method.

Interfacial Fracture Toughness of a Plasma Sprayed Hydroxyapatite Coating Used for Orthopedic Implants

1998 ◽  
Vol 550 ◽  
Author(s):  
Y. Sugimura ◽  
M. Spector
Keyword(s):  
Fracture Toughness ◽  
Elastic Modulus ◽  
Adhesion Strength ◽  
Unit Area ◽  
Interfacial Fracture ◽  
Orthopedic Implants ◽  
New Method ◽  
Aqueous Environment ◽  
Interfacial Fracture Toughness ◽  
Plasma Sprayed

AbstractThis study introduces a new method for evaluating the adhesion strength of a coating on a substrate. The interfacial fracture toughness, Γi is used to assess the work per unit area required to separate an interface. Γi is measured for the as-received specimens of hydroxyapatite plasma sprayed on Ti-6A1-4V substrate. Calculation of the interfacial fracture toughness requires that the elastic modulus of the coating to be known. The Young's modulus of the plasma sprayed hydroxyapatite is assessed using a bend test. The effect of aqueous environment on the interfacial fracture toughness is also investigated.

A new method to characterize the TBC's thermal barrier effect using single-layer thin film thermocouples

2020 ◽  
Author(s):  
Zhonglin Ji ◽  
Franklin L. Duan ◽  
Haotian Weng ◽  
Ziyi Xie ◽  
Baowen Zhang ◽  
...  
Keyword(s):  
Thin Film ◽  
Single Layer ◽  
New Method ◽  
Thermal Barrier ◽  
Barrier Effect ◽  
Thin Film Thermocouples ◽  
Layer Thin Film

Tack of Pressure-Sensitive Tape

1957 ◽  
Vol 30 (3) ◽  
pp. 847-853 ◽  
Author(s):  
Franklin S. C. Chang
Keyword(s):  
Adhesion Strength ◽  
Contact Surface ◽  
Point Of View ◽  
New Method ◽  
Depression Effect ◽  
Paper Surface ◽  
Pressure Sensitive ◽  
The One ◽  
Limiting Value

Abstract A new method has been found, as a result of this investigation, for measuring the tack of pressure-sensitive tape, which is simple and precise enough for practical purposes. By using this method, tack testing yields reproducible quantitative records in lieu of the ambiguous descriptive results from the empirical finger test. In light of the fact that, of the tapes made with the same adhesive, the one with crepe paper gave lower tack than the one made of flat paper, surface of contact must be one of the factors determining tack. Any pressure applied on the tape after the tape is put on the testing panel would, to a certain extent, increase the contact surface, hence, the force required to peel the tape from the panel. The stiffness of paper, through the depression effect, would have the same effect on the peeling force, in this case, the adhesion strength. Since tack is defined to be free of added pressure and depression effect, this explains the independence of tack and dependence of adhesion strength on stiffness of paper. Fom this point of view, one may consider tack as the limiting value of adhesion strength.

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