STUDY OF DEFECTS IN a-Ge AND a-GeHxUSING SURFACE ACOUSTIC WAVE TECHNIQUE

1981 ◽  
Vol 42 (C4) ◽  
pp. C4-365-C4-368
Author(s):  
K. L. Bhatia ◽  
M.v. Haumeder ◽  
S. Hunklinger
Keyword(s):  
Acoustic Wave ◽  
Surface Acoustic Wave ◽  
Wave Technique

Mechanical Strength of Multilayered Dielectric Structures Measured by Laser-Pulse Generated Surface-Acoustic-Wave Technique

2005 ◽  
Author(s):  
Toshinori Takimura ◽  
Nobuhiro Hata ◽  
Takahiro Nakayama ◽  
Yoshinori Shishida ◽  
Ryotaro Yagi ◽  
...  
Keyword(s):  
Laser Pulse ◽  
Acoustic Wave ◽  
Mechanical Strength ◽  
Surface Acoustic Wave ◽  
Wave Technique ◽  
Dielectric Structures

Laser-Generated Surface Acoustic Wave Technique for Crack Monitoring – A Review

2013 ◽  
Vol 7 (2) ◽  
pp. 211-220 ◽  
Author(s):  
Kun Chen ◽  
◽  
Xing Fu ◽  
Dante J. Dorantes-Gonzalez ◽  
Yanning Li ◽  
...  
Keyword(s):  
Acoustic Wave ◽  
Surface Acoustic Wave ◽  
Acoustic Waves ◽  
Numerical Models ◽  
Surface Acoustic Waves ◽  
Detection Methods ◽  
Quantitative Detection ◽  
Quantitative Monitoring ◽  
Crack Monitoring ◽  
Wave Technique

In this paper, the principle of surface acoustic wave techniques and their application to the monitoring of cracks are presented and compared to other classic non-destructive techniques. A practical classification of methods regarding the excitation and detection of surface acoustic waves is enumerated, among them, laser-generated surface acoustic wave technique is carefully analyzed as a prospective technique, and two important detection methods using piezoelectric and light deflection are described. Then, the strategies and variables used in crack monitoring based on laser-generated surface acoustic wave technique are reviewed. To achieve the goal of quantitative detection of cracks, most researchers use numerical models and experiments to characterize main crack features. Discussions and prospective approaches for further quantitative monitoring of cracks are provided.

Influence of Grain Orientation on the Microstructural Characterization in Cu During (self)-Anneal using a Surface Acoustic wave Technique

2006 ◽  
Vol 914 ◽  
Author(s):  
Atsuko Sekiguchi ◽  
Kris Vanstreels ◽  
Steven DeMuynck ◽  
Jan D'Haen ◽  
Sywert H Brongersma
Keyword(s):  
Grain Size ◽  
Acoustic Wave ◽  
Surface Acoustic Wave ◽  
Grain Orientation ◽  
Copper Film ◽  
Microstructural Characterization ◽  
Grain Structure ◽  
Clear Correlation ◽  
Lower Porosity ◽  
Wave Technique

AbstractThis paper describes the influence of microstructure, or more specifically grain orientation and grain size, on the in-line monitoring of copper interconnect properties during (self)-anneal using surface acoustic wave spectroscopy (SAWS). In electroplated Cu after (self)-anneal the SAWS frequency is lower for samples annealed at higher temperature because of the lower porosity induced elasticity. In sputtered Cu, the SAWS frequency shows a clear correlation with grain size, which is induced by a strong re-orientation of the copper film from the as-deposited (111) texture (E=190 GPa) to a strongly (100) textured super grain structure (E=78GPa).

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