Printed circuit board (PCB) model using the thin-wire method to compute conducted EMI in power electronic systems

1998 ◽  
Vol 3 (2) ◽  
pp. 169-181 ◽  
Author(s):  
C. Labarre ◽  
Ph. Petit ◽  
F. Costa ◽  
C. Gautier
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Electronic Systems ◽  
Power Electronic ◽  
Thin Wire ◽  
Printed Circuit ◽  
Wire Method ◽  
Conducted Emi

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

scholarly journals Research on Small Square PCB Rogowski Coil Measuring Transient Current in the Power Electronics Devices

Sensors ◽  
2019 ◽  
Vol 19 (19) ◽  
pp. 4176 ◽  
Author(s):  
Chaoqun Jiao ◽  
Juan Zhang ◽  
Zhibin Zhao ◽  
Zuoming Zhang ◽  
Yuanliang Fan
Keyword(s):  
Power Electronics ◽  
Printed Circuit Board ◽  
Electronic Devices ◽  
Rogowski Coil ◽  
Bipolar Transistors ◽  
Circuit Board ◽  
Power Electronic ◽  
Insulated Gate Bipolar Transistors ◽  
Printed Circuit ◽  
Internal Structures

With the development of China’s electric power, power electronics devices such as insulated-gate bipolar transistors (IGBTs) have been widely used in the field of high voltages and large currents. However, the currents in these power electronic devices are transient. For example, the uneven currents and internal chip currents overshoot, which may occur when turning on and off, and could have a great impact on the device. In order to study the reliability of these power electronics devices, this paper proposes a miniature printed circuit board (PCB) Rogowski coil that measures the current of these power electronics devices without changing their internal structures, which provides a reference for the subsequent reliability of their designs.

scholarly journals A Study on the Radiated Susceptibility of Printed Circuit Boards and the Effects of Via Fencing

Electronics ◽  
2021 ◽  
Vol 10 (5) ◽  
pp. 539
Author(s):  
Ryan P. Tortorich ◽  
William Morell ◽  
Elizabeth Reiner ◽  
William Bouillon ◽  
Jin-Woo Choi
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Ground Plane ◽  
Circuit Board ◽  
Electronic Systems ◽  
Coupling Mechanism ◽  
Electromagnetic Modeling ◽  
Printed Circuit ◽  
Edge Radiation ◽  
Area Of Concern

Because modern electronic systems are likely to be exposed to high intensity radiated fields (HIRF) environments, there is growing interest in understanding how electronic systems are affected by such environments. Backdoor coupling in particular is an area of concern for all electronics, but there is limited understanding about the mechanisms behind backdoor coupling. In this work, we present a study on printed circuit board (PCB) backdoor coupling and the effects of via fencing. Existing work focuses on ideal stackups and indicates that edge radiation is significantly reduced by via fencing. In this study, both full wave electromagnetic modeling and experimental verification are used to investigate both ideal and practical PCB stackups. In the ideal scenario, we find that via fencing substantially reduces coupling, which is consistent with prior work on emissions. In the practical scenario, we incorporate component footprints and traces which naturally introduce openings in the top ground plane. Both simulation and experimental data indicate that via fencing in the practical scenario does not substantially mitigate coupling, suggesting that PCB edge coupling is not the dominant coupling mechanism, even at varying angles of incidence and polarization.

scholarly journals Integrated multilayer stretchable printed circuit boards paving the way for deformable active matrix

2019 ◽  
Vol 10 (1) ◽  
Author(s):  
Shantonu Biswas ◽  
Andreas Schoeberl ◽  
Yufei Hao ◽  
Johannes Reiprich ◽  
Thomas Stauden ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Electronic Systems ◽  
Active Matrix ◽  
Surface Mount ◽  
Manufacturing Method ◽  
Printed Circuit ◽  
Elastomeric Matrix ◽  
Vertical Interconnect

Abstract Conventional rigid electronic systems use a number of metallization layers to route all necessary connections to and from isolated surface mount devices using well-established printed circuit board technology. In contrast, present solutions to prepare stretchable electronic systems are typically confined to a single stretchable metallization layer. Crossovers and vertical interconnect accesses remain challenging; consequently, no reliable stretchable printed circuit board (SPCB) method has established. This article reports an industry compatible SPCB manufacturing method that enables multilayer crossovers and vertical interconnect accesses to interconnect isolated devices within an elastomeric matrix. As a demonstration, a stretchable (260%) active matrix with integrated electronic and optoelectronic surface mount devices is shown that can deform reversibly into various 3D shapes including hemispherical, conical or pyramid.

Vibration Modeling and Sensitivity Analysis of Printed Circuit Board

2012 ◽  
Vol 226-228 ◽  
pp. 345-350
Author(s):  
Fei Xu ◽  
Chuan Ri Li ◽  
Tong Min Jiang ◽  
Long Tao Liu
Keyword(s):  
Fundamental Frequency ◽  
Printed Circuit Board ◽  
Orthogonal Design ◽  
Circuit Board ◽  
Electronic Systems ◽  
Mechanical Shock ◽  
Design Guideline ◽  
Printed Circuit ◽  
Factors Analysis ◽  
Fem Method

Various failures in electronic systems, particularly in the connections between the printed circuit board (PCB) and components, are due to mechanical shock and vibration. The vibration characteristic of a plug-in PCB in an airborne electronic case (AEC) was studied first by finite element modeling (FEM) and experimental techniques. The coupling method and torsional spring elements were used in FEM to better simulate the PCB’s realistic boundary condition. A reasonable correlation between simulation and test results was obtained. Since the fundamental frequency is one of the most important dynamic characteristics of PCB, the orthogonal design and variance analysis, as well as FEM method, were discussed subsequently to investigate the effects of different factors. Analysis results demonstrate a good correlation with current studies. Finally, a general design guideline was presented to maximize the PCB’s fundamental frequency.

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