Digital simulation of faulted e.h.v. transmission lines with particular reference to very-high-speed protection

1976 ◽  
Vol 123 (4) ◽  
pp. 353 ◽  
Author(s):  
A.T. Johns ◽  
R.K. Aggarwal
1981 ◽  
Vol 8 (1-2) ◽  
pp. 91-98
Author(s):  
Tamio Saito ◽  
Yoshikatsu Fukumoto

Multi-layer 2 mil line technology has been increasingly required for VLSI and very high speed logic devices. This technology makes it possible to shorten the length of interconnection lines between VLSI silicon chips. Thus the signal propagation delay on the transmission lines can be minimized.Multi-layer 2 mil line technology research history, the new method and usages are discussed in this paper.


Author(s):  
C. O. Jung ◽  
S. J. Krause ◽  
S.R. Wilson

Silicon-on-insulator (SOI) structures have excellent potential for future use in radiation hardened and high speed integrated circuits. For device fabrication in SOI material a high quality superficial Si layer above a buried oxide layer is required. Recently, Celler et al. reported that post-implantation annealing of oxygen implanted SOI at very high temperatures would eliminate virtually all defects and precipiates in the superficial Si layer. In this work we are reporting on the effect of three different post implantation annealing cycles on the structure of oxygen implanted SOI samples which were implanted under the same conditions.


Alloy Digest ◽  
2019 ◽  
Vol 68 (10) ◽  

Abstract YSS HAP72 is a powder metallurgy high-speed tool steel with a very high wear resistance. This datasheet provides information on composition, hardness, and bend strength. It also includes information on high temperature performance. Filing Code: TS-779. Producer or source: Hitachi Metals America Ltd.


1992 ◽  
Author(s):  
Timothy J. Salo ◽  
John D. Cavanaugh ◽  
Michael K. Spengler
Keyword(s):  

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