Waveguide coupling efficiency in thin-film homogeneous lenses

1990 ◽  
Vol 137 (4) ◽  
pp. 255 ◽  
Author(s):  
P. Jiang ◽  
W. Zhang ◽  
P.J.R. Laybourn
2021 ◽  
Vol 12 (1) ◽  
Author(s):  
Sebastien Boissier ◽  
Ross C. Schofield ◽  
Lin Jin ◽  
Anna Ovvyan ◽  
Salahuddin Nur ◽  
...  

AbstractExtinction spectroscopy is a powerful tool for demonstrating the coupling of a single quantum emitter to a photonic structure. However, it can be challenging in all but the simplest of geometries to deduce an accurate value of the coupling efficiency from the measured spectrum. Here we develop a theoretical framework to deduce the coupling efficiency from the measured transmission and reflection spectra without precise knowledge of the photonic environment. We then consider the case of a waveguide interrupted by a transverse cut in which an emitter is placed. We apply that theory to a silicon nitride waveguide interrupted by a gap filled with anthracene that is doped with dibenzoterrylene molecules. We describe the fabrication of these devices, and experimentally characterise the waveguide coupling of a single molecule in the gap.


2011 ◽  
Vol 98 (3) ◽  
pp. 031107 ◽  
Author(s):  
Amir Hosseini ◽  
Xiaochuan Xu ◽  
David N. Kwong ◽  
Harish Subbaraman ◽  
Wei Jiang ◽  
...  

2012 ◽  
Vol 44 (3) ◽  
pp. 679-682 ◽  
Author(s):  
Huaixi Chen ◽  
Yishen Qiu ◽  
Gaoming Li ◽  
Hao Zhang ◽  
Qun Chen

2008 ◽  
Vol 16 (25) ◽  
pp. 20803 ◽  
Author(s):  
H. Tao ◽  
Junfeng Song ◽  
Qing Fang ◽  
Mingbin Yu ◽  
Guoqiang Lo ◽  
...  

2011 ◽  
Vol 189-193 ◽  
pp. 2456-2461
Author(s):  
Sheng Ching Wang ◽  
Chiou Lin Liou ◽  
Hsi Hsun Tsai

Thin film based passive optical components assembled with a stainless steel tube via soldering is investigated under a packaging procedure. Finite element analysis is utilized to simulate the packaging procedure in the present study. Mismatch of the coefficient of thermal expansion among various components could induce residual stress over the assembly structure. Coupled thermal-elastoplastic analysis is adopted to predict the plastic deformation of the structure under the solidification process of solder joints. This post-solder-deformation could deteriorate the associated coupling efficiency due to the mis-alignment of the optical fibers. Temperature-dependent mechanical properties of the solder joint are employed in the simulations. Both two-dimensional plane strain and three-dimensional solid models are implemented into the analysis for comparisons. In order to improve the fiber alignment, and thus the coupling efficiency, a three-point bending device is externally loaded on the structure. Unloading procedure is subsequently performed to evaluate the ultimate deformed shape of the structure. Measurements of the insertion loss will be conducted using a power meter in the near future, while a correlation between the coupling efficiency and the fiber alignment can then be expected.


2015 ◽  
Vol 5 (1) ◽  
pp. 052099 ◽  
Author(s):  
Ravi S. Hegde ◽  
Hong Son Chu ◽  
Kiansoo Ong ◽  
Lakshmi Kanta Bera ◽  
Ching Eng Png

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