Picture-processing techniques for geometrical tolerance checking of integrated-circuit layouts

1980 ◽  
Vol 127 (1) ◽  
pp. 8
Author(s):  
J.R. Ullmann ◽  
H.H. Lafferty
Keyword(s):  
Integrated Circuit ◽  
Picture Processing ◽  
Processing Techniques

Design and Simulation of Pressure Sensor for Ocean Depth Measurements

2013 ◽  
Vol 313-314 ◽  
pp. 666-670 ◽  
Author(s):  
K.J. Suja ◽  
Bhanu Pratap Chaudhary ◽  
Rama Komaragiri
Keyword(s):  
Pressure Sensor ◽  
Integrated Circuit ◽  
Output Voltage ◽  
Pressure Sensors ◽  
Micro Electro Mechanical System ◽  
Constant Thickness ◽  
Piezoresistive Pressure Sensor ◽  
Wide Pressure Range ◽  
Processing Techniques ◽  
Wide Pressure

MEMS (Micro Electro Mechanical System) are usually defined as highly miniaturized devices combining both electrical and mechanical components that are fabricated using integrated circuit batch processing techniques. Pressure sensors are usually manufactured using square or circular diaphragms of constant thickness in the order of few microns. In this work, a comparison between circular diaphragm and square diaphragm indicates that square diaphragm has better perspectives. A new method for designing diaphragm of the Piezoresistive pressure sensor for linearity over a wide pressure range (approximately double) is designed, simulated and compared with existing single diaphragm design with respect to diaphragm deflection and sensor output voltage.

Hardware Efficient Hybrid Encoder for Video Surveillance Application

2020 ◽  
pp. 2150113
Author(s):  
Minesh Patel ◽  
Anand Darji
Keyword(s):  
Video Surveillance ◽  
Integrated Circuit ◽  
Video Processing ◽  
Signal To Noise Ratio ◽  
Scalable Video Coding ◽  
Video Codec ◽  
Available Bandwidth ◽  
Coding Efficiency ◽  
Cell Library ◽  
Processing Techniques

Extensive use of digital multimedia has led to the development of advance video processing techniques for development of multimedia applications. Application such as video surveillance requires 247 recording and streaming. So, the bandwidth and storage costs become significant. With introduction of video streaming over internet, where different kinds of end users request same content with different available bandwidth, it requires scalable video coding (SVC). These challenges can be overcome by developing new techniques to reduce redundancy in subsequent frames and to improve the coding efficiency. In this paper, overlapping weighted linear sum (OWLS) pre-processing method and its hardware architecture are proposed. It is implemented using field progrmmable gate array (FPGA) and the application specific integrated circuit (ASIC) is also developed using TSMC180nm technology standard cell library. Results show improvement in terms of power and area as compared to the existing work. In motion compensated temporal filtering (MCTF), wavelet transform is implemented by temporal filters. Architecture for 5/3 Lifting MCTF is also implemented and compared with baseline H.264 video codec. Simulation results show that the average peak signal to noise ratio (PSNR) improvement is 2.36[Formula: see text]dB. The MCTF design using 5/3 Lifting filter is synthesized for Virtex-5 FPGA and compared with the existing close-loop architecture with better performance.

The Contribution of Beam Processing to Present and Future Integrated Circuit Technologies

1983 ◽  
Vol 13 ◽  
Author(s):  
C Hill
Keyword(s):  
Pulse Laser ◽  
Present State ◽  
Integrated Circuit ◽  
Bipolar Transistor ◽  
Device Development ◽  
Processing Techniques ◽  
Doping Profiles ◽  
Controlled Doping ◽  
Circuit Technology ◽  
Base Structure

ABSTRACTA brief history and present state of beam processing techniques and applications to silicon integrated circuit technology are given. The viability of incorporating pulse-laser controlled doping profiles into the emitter-base structure of an advanced bipolar transistor is discussed. The areas of present I.C. technology which will constrain future device development are identified, and the contribution that beam processing can make in removing these constraints is discussed. The beam processing techniques most likely to be found in future I.C. technologies are described.

Up Close: MIT's Ceramics Manufacturing and Process Integration Laboratory

MRS Bulletin ◽  
1987 ◽  
Vol 12 (7) ◽  
pp. 91-94
Author(s):  
Richard L. Pober ◽  
Elizabeth A. Thomson
Keyword(s):  
Integrated Circuit ◽  
Manufacturing Systems ◽  
New Technologies ◽  
Process Integration ◽  
Basic Research ◽  
Massachusetts Institute Of Technology ◽  
Short Period ◽  
Manufacturing Productivity ◽  
Institute Of Technology ◽  
Processing Techniques

In a relatively short period of time ceramics have become the key elements to a variety of new technologies, including integrated circuit substrates, artificial limbs, turbocharger rotors, and, of course, superconductors. By and large, however, they have not met their potential. Though advances in basic research are responsible for the breakthroughs so far, no extensive work has been done to establish the manufacturing paradigms necessary for the production of reliable, reproducible materials.The new Ceramics Manufacturing and Process Integration Laboratory (CMPIL) at the Massachusetts Institute of Technology was conceived to address this need. As a logical extension of the science-based Ceramics Processing Research Laboratory (CPRL), also at MIT, the CMPIL will “test” fundamental ideas as they relate to ceramics manufacturing. The goal is to create a hands-on “research factory,” complete with manufactured product, to make an impact on manufacturing productivity and teach students, staff, and visiting scientists the principles that control ceramics manufacturing systems. Other thrusts include developing innovative processing techniques and collecting operating data that will ultimately be transferred to industry.

Picture processing techniques applied to autoradiographic studies of visual cortex

1986 ◽  
Vol 15 (4) ◽  
pp. 269-280 ◽  
Author(s):  
Eugene Switkes ◽  
Roger B.H. Tootell ◽  
Martin S. Silverman ◽  
Russell De Valois
Keyword(s):  
Visual Cortex ◽  
Picture Processing ◽  
Processing Techniques

Fabrication of Robust Nano-Signatures for Identification of Authentic Electronic Components and Counterfeit Avoidance

2017 ◽  
Vol 26 (03) ◽  
pp. 1740006 ◽  
Author(s):  
Kiarash Ahi ◽  
Abdiel Rivera ◽  
Anas Mazadi ◽  
Mehdi Anwar
Keyword(s):  
Supply Chain ◽  
Integrated Circuit ◽  
Similarity Index ◽  
Structural Similarity ◽  
Global Supply Chain ◽  
Electronic Components ◽  
Structural Similarity Index ◽  
Novel Approach ◽  
Similarity Indices ◽  
Processing Techniques

In this paper, a novel approach for marking integrated circuit packages with authentication nanosignatures is introduced. In this work, the signatures patterns are fabricated using electron beam lithography. Moreover, the robustness of these signatures against aging and humidity is investigated. A recipe comprising image processing techniques and measurement of similarity indices has been developed. These signatures are proposed to be fabricated at the manufacturer side of the supply chain. Then, they are decoded at the consumer end. Thus, robustness against ambient environment and aging is a requirement for these signatures to survive in the global supply chain. Calculated Mean Square Error and Structural SIMilarity Index confirmed that the reflected patterns of the signatures remain unchanged against aging and humidity.

Process Integration issues for Interlevel Dielectric Materials for Sub-quarter Micron Silicon Integrated Circuits

1998 ◽  
Vol 511 ◽  
Author(s):  
Vijay Parihar ◽  
R. Singh
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
Process Integration ◽  
Dielectric Materials ◽  
New Approach ◽  
Interlayer Dielectric ◽  
Low Dielectric ◽  
Silicon Integrated Circuits ◽  
Processing Techniques ◽  
Low K

ABSTRACTThe continued miniaturization towards sub-quarter micron feature size mandates the search for low dielectric constant interlayer dielectric materials. A large number of materials and processing techniques has been suggested, but so far none of the proposed dielectric materials as well as processing techniques have been integrated into standard integrated circuit processing. In this paper, a new approach has been formulated for integration of low-k dielectric materials for future integrated circuits.

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