Advanced multilayer thick‐film technology and TFMS, CPW, and SIW up to 180 GHz for cost‐effective ceramic‐based circuits and modules

2018 ◽  
Vol 12 (7) ◽  
pp. 1064-1071 ◽  
Author(s):  
Kamal K. Samanta
Keyword(s):  
Thick Film ◽  
Cost Effective ◽  
Thick Film Technology

Handbook of Thick Film Technology

1976 ◽  
Vol 22 (11-12) ◽  
pp. 791
Author(s):  
R. Naylor
Keyword(s):  
Thick Film ◽  
Thick Film Technology

scholarly journals Piezoelectric Thick Film Deposition via Powder/Granule Spray in Vacuum: A Review

Actuators ◽  
2020 ◽  
Vol 9 (3) ◽  
pp. 59
Author(s):  
Deepak Rajaram Patil ◽  
Venkateswarlu Annapureddy ◽  
J. Kaarthik ◽  
Atul Thakre ◽  
Jun Akedo ◽  
...  
Keyword(s):  
Thick Film ◽  
Thick Films ◽  
Cost Effective ◽  
Aerosol Deposition ◽  
Ceramic Coatings ◽  
Film Deposition ◽  
Energy Harvesters ◽  
Ceramic Films ◽  
Dense Ceramic ◽  
Processing Techniques

Conventional thin-film processing techniques remain inadequate for obtaining superior dense ceramic thick films. The incompatibility of ceramic films prepared via other methods, such as screen printing, spin coating, and sputtering, is a major obstacle in the fabrication of thick film-based ceramic electronic components. The granule spray in vacuum (GSV) processes and aerosol deposition (AD) are important coating approaches for forming dense ceramic thick films featuring nanoscale crystallite structures at room temperature, which offer excellent material properties and facilitate cost-effective production. AD ceramic coatings require the acceleration of solid-state submicron ceramic particles via gas streams with a velocity of a few hundred meters per second, which are then wedged onto a substrate. This process is economical and particularly useful for the fabrication of piezoelectric thick film-based microactuators, energy harvesters, sensors, and optoelectronic devices. More recently, the GSV technique was improved to achieve more uniform and homogeneous film deposition after AD. This review article presents a detailed overview of the AD and GSV processes for piezoelectric thick films in terms of recent scientific and technological applications.

Sensor applications of thick-film technology

1988 ◽  
Vol 135 (4) ◽  
pp. 77 ◽  
Author(s):  
J.E. Brignell ◽  
N.M. White ◽  
A.W.J. Cranny
Keyword(s):  
Thick Film ◽  
Sensor Applications ◽  
Thick Film Technology

The application of thick-film technology in C-MEMS

2007 ◽  
Vol 19 (4) ◽  
pp. 363-368 ◽  
Author(s):  
Darko Belavic ◽  
Marko Hrovat ◽  
Janez Holc ◽  
Marina Santo Zarnik ◽  
Marija Kosec ◽  
...  
Keyword(s):  
Thick Film ◽  
Thick Film Technology

Spain — Thick-film technology

1995 ◽  
Vol 10 (9-10) ◽  
pp. vi
Author(s):  
Valerie M. Owen
Keyword(s):  
Thick Film ◽  
Thick Film Technology
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