Synthesis of compact and highly selective filters via metamaterial-inspired coplanar waveguide line technologies

2010 ◽  
Vol 4 (8) ◽  
pp. 1098 ◽  
Author(s):  
A.L. Borja ◽  
J. Carbonell ◽  
V.E. Boria ◽  
J. Cascón ◽  
D. Lippens
Keyword(s):  
Coplanar Waveguide ◽  
Waveguide Line

scholarly journals Highly Versatile Coplanar Waveguide Line With Electronically Reconfigurable Bandwidth and Propagation Characteristics

2017 ◽  
Vol 65 (1) ◽  
pp. 128-135 ◽  
Author(s):  
Leticia Martinez Cano ◽  
Alejandro L. Borja ◽  
Vicente E. Boria ◽  
Angel Belenguer
Keyword(s):  
Coplanar Waveguide ◽  
Propagation Characteristics ◽  
Waveguide Line

Microwave Tunable Devices Composed of Coplanar Waveguide Line with (Ba0.6,Sr0.4)TiO3/Au/Cr/(Ba0.6,Sr0.4)TiO3Sandwich Structure

2008 ◽  
Vol 47 (9) ◽  
pp. 7500-7504 ◽  
Author(s):  
Minoru Noda ◽  
Shigeyuki Watanabe ◽  
Kousuke Seki ◽  
Takeshi Kanashima ◽  
Masanori Okuyama
Keyword(s):  
Coplanar Waveguide ◽  
Waveguide Line

Dual Band Paper Substrate CPW Antenna for Wireless Applications

2019 ◽  
Vol 8 (9S3) ◽  
pp. 605-608
Keyword(s):  
Reflection Coefficient ◽  
Mobile Communication ◽  
Coplanar Waveguide ◽  
Dual Band ◽  
Antenna Feed ◽  
Paper Substrate ◽  
Frequency Bands ◽  
Wireless Applications

In this paper, a 15* 80 sized antenna is designed over a paper substrate to test its flexible properties. The proposed antenna feed by a grounded coplanar waveguide(GCPW) is stimulated and the measured results show the operating Dual Band of the antenna cover(3.34-3.62 GHz) and (5.92-6.24 GHz) with the reflection coefficient |S11|< -15dB.These frequency bands operate over SHF bands and hence supports Fixed Mobile Communication and WLAN applications.

Full-wave analysis of shielded coplanar waveguide short-end

1990 ◽  
Vol 26 (19) ◽  
pp. 1615 ◽  
Author(s):  
G. Bartolucci ◽  
J. Piotrowski
Keyword(s):  
Coplanar Waveguide ◽  
Wave Analysis ◽  
Full Wave ◽  
Full Wave Analysis

Erratum: Full-wave analysis of shielded coplanar waveguide short-end

1990 ◽  
Vol 26 (22) ◽  
pp. 1922
Author(s):  
G. Bartolocci ◽  
J. Piotrowski
Keyword(s):  
Coplanar Waveguide ◽  
Wave Analysis ◽  
Full Wave ◽  
Full Wave Analysis

Coplanar waveguide transmission lines and high Q inductors on CMOS grade silicon using photoresist and polyimide

1999 ◽  
Vol 35 (22) ◽  
pp. 1957 ◽  
Author(s):  
G. Ternent ◽  
S. Ferguson ◽  
Z. Borsosfoldi ◽  
K. Elgaid ◽  
T. Lohdi ◽  
...  
Keyword(s):  
Transmission Lines ◽  
Coplanar Waveguide ◽  
High Q ◽  
Grade Silicon ◽  
Waveguide Transmission

scholarly journals A RF Redundant TSV Interconnection for High Resistance Si Interposer

Micromachines ◽  
2021 ◽  
Vol 12 (2) ◽  
pp. 169
Author(s):  
Mengcheng Wang ◽  
Shenglin Ma ◽  
Yufeng Jin ◽  
Wei Wang ◽  
Jing Chen ◽  
...  
Keyword(s):  
Millimeter Wave ◽  
High Frequency ◽  
High Performance ◽  
Rapid Development ◽  
Coplanar Waveguide ◽  
Equivalent Circuit Model ◽  
High Resistivity ◽  
Performance Requirements ◽  
Wave Radar ◽  
Interconnect Design

Through Silicon Via (TSV) technology is capable meeting effective, compact, high density, high integration, and high-performance requirements. In high-frequency applications, with the rapid development of 5G and millimeter-wave radar, the TSV interposer will become a competitive choice for radio frequency system-in-package (RF SIP) substrates. This paper presents a redundant TSV interconnect design for high resistivity Si interposers for millimeter-wave applications. To verify its feasibility, a set of test structures capable of working at millimeter waves are designed, which are composed of three pieces of CPW (coplanar waveguide) lines connected by single TSV, dual redundant TSV, and quad redundant TSV interconnects. First, HFSS software is used for modeling and simulation, then, a modified equivalent circuit model is established to analysis the effect of the redundant TSVs on the high-frequency transmission performance to solidify the HFSS based simulation. At the same time, a failure simulation was carried out and results prove that redundant TSV can still work normally at 44 GHz frequency when failure occurs. Using the developed TSV process, the sample is then fabricated and tested. Using L-2L de-embedding method to extract S-parameters of the TSV interconnection. The insertion loss of dual and quad redundant TSVs are 0.19 dB and 0.46 dB at 40 GHz, respectively.

Sign in / Sign up

Export Citation Format

Share Document