Finite element modelling of the thermal stress field during processing of VLSI multilevel structures
Keyword(s):
2000 ◽
Vol 87
(11)
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pp. 1289-1299
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Keyword(s):
Keyword(s):
1993 ◽
Vol 30
(3)
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pp. A165
Keyword(s):
2013 ◽
Vol 444-445
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pp. 1422-1426