scholarly journals Simplified implementation of millimetre‐wave zero‐bias detector for an accurate detection in six‐port‐based receivers

2020 ◽  
Vol 56 (1) ◽  
pp. 13-15
Author(s):  
C. Hannachi ◽  
M.E. Romaric ◽  
S.O. Tatu ◽  
K. Wu
1993 ◽  
Vol 29 (21) ◽  
pp. 1879 ◽  
Author(s):  
D. Wake ◽  
N.G. Walker ◽  
I.C. Smith
Keyword(s):  

2004 ◽  
Vol 40 (5) ◽  
pp. 343 ◽  
Author(s):  
V.T. Vo ◽  
Z.R. Hu ◽  
K.L. Koon ◽  
C.N. Dharmasiri ◽  
S.C. Subramaniam ◽  
...  

1991 ◽  
Vol 69 (3-4) ◽  
pp. 180-184 ◽  
Author(s):  
Hsien-Ching Huang ◽  
Arvind Swarup ◽  
Richard Henderson

A low-parasitic-capacitance beam-lead Schottky diode has been developed for millimetre-wavelength mixer applications from 30–110 GHz. It has a novel structure that incorporates a polyimide film to support the beam leads and the GaAs active area. Typical devices have an ideality factor of 1.12, a parasitic capacitance of 10 fF, a zero-bias-junction capacitance of 20 fF, a series resistance of 2.5 Ω, and hence a figure of merit cutoff frequency of over 3 THz. Diodes tested in production mixers at 36 GHz have yielded a conversion loss of 5.14 dB. The devices, fabricated by repeatable production techniques, are mechanically rugged and suitable for qualification to space and defence standards.


1997 ◽  
Vol 90 (3) ◽  
pp. 495-497
Author(s):  
CLAUDIO ESPOSTI ◽  
FILIPPO TAMASSIA ◽  
CRISTINA PUZZARINI ◽  
RICCARDO TARRONI ◽  
ZDENEK ZELINGER

1997 ◽  
Vol 92 (2) ◽  
pp. 229-236 ◽  
Author(s):  
M. HEPP ◽  
R. GENDRIESCH ◽  
I. PAK ◽  
Y.A. KURITSYN ◽  
F. LEWEN ◽  
...  

1989 ◽  
Vol 136 (6) ◽  
pp. 487
Author(s):  
S.T. Peng ◽  
S.J. Xu ◽  
F.K. Schwering
Keyword(s):  

2003 ◽  
Vol 783 ◽  
Author(s):  
Charles E Free

This paper discusses the techniques that are available for characterising circuit materials at microwave and millimetre wave frequencies. In particular, the paper focuses on a new technique for measuring the loss tangent of substrates at mm-wave frequencies using a circular resonant cavity. The benefits of the new technique are that it is simple, low cost, capable of good accuracy and has the potential to work at high mm-wave frequencies.


2018 ◽  
Vol 1 (1) ◽  
pp. 236-247
Author(s):  
Divya Srivastava ◽  
Rajitha B. ◽  
Suneeta Agarwal

Diseases in leaves can cause the significant reduction in both quality and quantity of agricultural production. If early and accurate detection of disease/diseases in leaves can be automated, then the proper remedy can be taken timely. A simple and computationally efficient approach is presented in this paper for disease/diseases detection on leaves. Only detecting the disease is not beneficial without knowing the stage of disease thus the paper also determine the stage of disease/diseases by quantizing the affected of the leaves by using digital image processing and machine learning. Though there exists a variety of diseases on leaves, but the bacterial and fungal spots (Early Scorch, Late Scorch, and Leaf Spot) are the most prominent diseases found on leaves. Keeping this in mind the paper deals with the detection of Bacterial Blight and Fungal Spot both at an early stage (Early Scorch) and late stage (Late Scorch) on the variety of leaves. The proposed approach is divided into two phases, in the first phase, it identifies one or more disease/diseases existing on leaves. In the second phase, amount of area affected by the disease/diseases is calculated. The experimental results obtained showed 97% accuracy using the proposed approach.


Author(s):  
P. Larré ◽  
H. Tupin ◽  
C. Charles ◽  
R.H. Newton ◽  
A. Reverdy

Abstract As technology nodes continue to shrink, resistive opens have become increasingly difficult to detect using conventional methods such as AVC and PVC. The failure isolation method, Electron Beam Absorbed Current (EBAC) Imaging has recently become the preferred method in failure analysis labs for fast and highly accurate detection of resistive opens and shorts on a number of structures. This paper presents a case study using a two nanoprobe EBAC technique on a 28nm node test structure. This technique pinpointed the fail and allowed direct TEM lamella.


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