Traverse System for Experimental Characterization of Low Pressure Turbine Stages

2016 ◽  
Author(s):  
A. De Grassi ◽  
G. Mattioli ◽  
G. Angione ◽  
A. Ragnoni
Keyword(s):  
Low Pressure ◽  
Experimental Characterization ◽  
Low Pressure Turbine

Formation of low pressure striations in a krypton lamp, experimental characterization of the discharge: spectroscopic and electrical analysis

Optik ◽  
2021 ◽  
pp. 166339
Author(s):  
Fatima Nadia Haddou ◽  
Philippe Guillot ◽  
Ahmed Belasri ◽  
Thomas Maho ◽  
Bruno Caillier
Keyword(s):  
Low Pressure ◽  
Experimental Characterization ◽  
Electrical Analysis

scholarly journals Experimental and Numerical Characterization of Flow Through Highly Loaded Low-Pressure Turbine Cascade

2018 ◽  
Vol 34 (1) ◽  
pp. 27-39 ◽  
Author(s):  
Andreas Gross ◽  
Christopher R. Marks ◽  
Rolf Sondergaard ◽  
Philip S. Bear ◽  
J. Mitch Wolff
Keyword(s):  
Low Pressure ◽  
Turbine Cascade ◽  
Low Pressure Turbine ◽  
Numerical Characterization ◽  
Flow Through ◽  
Highly Loaded

Experimental Characterization of the Reliability of 3-Terminal Dual-Damascene Copper Interconnect Trees

2002 ◽  
Vol 716 ◽  
Author(s):  
C. L. Gan ◽  
C. V. Thompson ◽  
K. L. Pey ◽  
W. K. Choi ◽  
F. Wei ◽  
...  
Keyword(s):  
Stress Conditions ◽  
Experimental Characterization ◽  
Contact Lines ◽  
Tree Structures ◽  
Similar Test ◽  
Dual Damascene ◽  
Copper Interconnect ◽  
Test Conditions

AbstractElectromigration experiments have been carried out on simple Cu dual-damascene interconnect tree structures consisting of straight via-to-via (or contact-to-contact) lines with an extra via in the middle of the line. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigrationresistant overlayer in Cu technology, and the possibility of liner rupture at stressed vias lead to significant differences in tree reliabilities in Cu compared to Al.

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