Improving power factor and figure of merit of p-type CuSbSe2 via introducing Sb vacancies

2021 ◽  
Author(s):  
Tao Chen ◽  
Hongwei Ming ◽  
Xiaoying Qin ◽  
Chen Zhu ◽  
Lulu Huang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermoelectric Material ◽  
Power Factor ◽  
Figure Of Merit ◽  
Environment Friendly ◽  
Low Thermal Conductivity ◽  
P Type

As a thermoelectric material, p-type CuSbSe2 has attracted much attention due to its intrinsic low thermal conductivity and environment-friendly constituents. In this work, Sb deficient compounds CuSb1-xSe2 (x=0-0.12) are prepared...

High thermoelectric performance of superionic argyrodite compound Ag8SnSe6

2016 ◽  
Vol 4 (24) ◽  
pp. 5806-5813 ◽  
Author(s):  
Lin Li ◽  
Yuan Liu ◽  
Jiyan Dai ◽  
Aijun Hong ◽  
Min Zeng ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermoelectric Material ◽  
Power Factor ◽  
High Power ◽  
Figure Of Merit ◽  
Environmentally Friendly ◽  
Thermoelectric Performance ◽  
Low Thermal Conductivity ◽  
High Power Factor ◽  
High Figure

A good thermoelectric material usually has a high power factor and low thermal conductivity for high figure of merit (ZT), and is also environmentally friendly and economical.

High Effective Thermoelectrics Based on the Mg2Si-Mg2Sn Solid Solution

2011 ◽  
Vol 170 ◽  
pp. 286-292 ◽  
Author(s):  
Mikhail I. Fedorov ◽  
Vladimir K. Zaitsev ◽  
Grigory N. Isachenko
Keyword(s):  
Thermal Conductivity ◽  
Solid Solution ◽  
Carrier Concentration ◽  
Figure Of Merit ◽  
Practical Application ◽  
Environment Friendly ◽  
Dimensionless Figure Of Merit ◽  
Solution Energy ◽  
Wide Range ◽  
P Type

The complex study of the thermoelectric properties in solid solutions between compounds Mg2X (X=Si, Ge, Sn) was accomplished. Analysis of the features of band structure, thermal conductivity and electrical properties in the wide range of temperature and carrier concentration has shown that the most effective thermoelectric can be achieved in the Mg2Si-Mg2Sn solid solution. Energy spectrum and carrier concentration optimization, and, also, lattice thermal conductivity minimization allowed to establish the most effective compounds for the thermoelectrics of n- and p- type. Thermoelectrics with the maximum dimensionless figure of merit of more than 1.2 and average ZT0.9 (in the temperature range 300-800K) were obtained with developed synthesis and doping techniques. These materials are cheap, wide spread and environment friendly, have non-toxic initial components. It is very favorable for practical application.

scholarly journals Simultaneous improvement of power factor and thermal conductivity via Ag doping in p-type Mg3Sb2 thermoelectric materials

2017 ◽  
Vol 5 (10) ◽  
pp. 4932-4939 ◽  
Author(s):  
Lirong Song ◽  
Jiawei Zhang ◽  
Bo B. Iversen
Keyword(s):  
Thermal Conductivity ◽  
Power Factor ◽  
Thermoelectric Materials ◽  
Figure Of Merit ◽  
Ag Doping ◽  
P Type ◽  
Average Figure

Ag doping in Mg3Sb2 leads to an enhanced average figure-of-merit (zT) by simultaneously improving the power factor and thermal conductivity.

scholarly journals Two impurity energy level regulation leads to enhanced thermoelectric performance of Ag1−xCdxIn5Se8

RSC Advances ◽  
2017 ◽  
Vol 7 (21) ◽  
pp. 12719-12725 ◽  
Author(s):  
Xingchen Shen ◽  
Nusrat Shaheen ◽  
Aijuan Zhang ◽  
Dingfeng Yang ◽  
Wei Yao ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Electrical Conductivity ◽  
Energy Level ◽  
Thermoelectric Power ◽  
Thermoelectric Material ◽  
Power Factor ◽  
Electron Concentration ◽  
Thermoelectric Performance ◽  
Thermoelectric Power Factor ◽  
Low Thermal Conductivity

AgIn5Se8 is a promising thermoelectric material due to its low thermal conductivity. By incorporating Cd2+ ions at Ag+ lattice sites; the electron concentration is increased, resulting in greatly enhanced electrical conductivity, and a high thermoelectric power factor.

SnSe: a remarkable new thermoelectric material

2016 ◽  
Vol 9 (10) ◽  
pp. 3044-3060 ◽  
Author(s):  
Li-Dong Zhao ◽  
Cheng Chang ◽  
Gangjian Tan ◽  
Mercouri G. Kanatzidis
Keyword(s):  
Thermal Conductivity ◽  
Thermoelectric Material ◽  
Power Factor ◽  
High Power ◽  
Band Structures ◽  
Low Thermal Conductivity ◽  
High Power Factor

It is remarkable that SnSe exhibits complex band structures and strong anharmonic bonding, endowing it with a high power factor and low thermal conductivity.

scholarly journals Electronic Transport and Thermoelectric Properties of Te-Doped Tetrahedrites Cu12Sb4-yTeyS13

2021 ◽  
Vol 59 (8) ◽  
pp. 560-566
Author(s):  
Sung-Gyu Kwak ◽  
Go-Eun Lee ◽  
Il-Ho Kim
Keyword(s):  
Thermal Conductivity ◽  
Mechanical Alloying ◽  
Carrier Concentration ◽  
Power Factor ◽  
Hot Pressing ◽  
Hole Concentration ◽  
Secondary Phases ◽  
Low Thermal Conductivity ◽  
Seebeck Coefficients ◽  
P Type

Tetrahedrite is a promising thermoelectric material mainly due to its low thermal conductivity, a consequence of its complicated crystal structure. However, tetrahedrite has a high hole concentration; therefore, optimizing carrier concentration through doping is required to maximize the power factor. In this study, Te-doped tetrahedrites Cu12Sb4-yTeyS13 (0.1 ≤ y ≤ 0.4) were prepared using mechanical alloying and hot pressing. The mechanical alloying successfully prepared the tetrahedrites doped with Te at the Sb sites without secondary phases, and the hot pressing produced densely sintered bodies with a relative density >99.7%. As the Te content increased, the lattice constant increased from 1.0334 to 1.0346 nm, confirming the successful substitution of Te at the Sb sites. Te-doped tetrahedrites exhibited p-type characteristics, which were confirmed by the positive signs of the Hall and Seebeck coefficients. The carrier concentration decreased but the mobility increased with Te content. The electrical conductivity was relatively constant at 323–723 K, and decreased with Te substitution from 2.6 × 104 to 1.6 × 104 Sm-1 at 723 K. The Seebeck coefficient increased with temperature and Te content, achieving values of 184–204 μVK-1 at 723 K. The thermal conductivity was <1.0 Wm-1K-1, and decreased with increasing Te content. Cu12Sb3.9Te0.1S13 exhibited the highest dimensionless figure of merit (ZT = 0.80) at 723 K, achieving a high power factor (0.91 mWm-1K-2) and a low thermal conductivity (0.80 Wm-1K-1).

Nanostructured monoclinic Cu2Se as a near-room-temperature thermoelectric material

Nanoscale ◽  
2020 ◽  
Vol 12 (39) ◽  
pp. 20536-20542
Author(s):  
Jie Chen ◽  
Taoyi Liu ◽  
Deyu Bao ◽  
Bin Zhang ◽  
Guang Han ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermoelectric Material ◽  
Figure Of Merit ◽  
Room Temperature ◽  
Low Thermal Conductivity

Nanostructured monoclinic Cu2Se with low thermal conductivity shows a figure of merit of 0.72 at 380 K.

Sticky thermoelectric materials for flexible thermoelectric modules to capture low-temperature waste heat

MRS Advances ◽  
2020 ◽  
Vol 5 (10) ◽  
pp. 481-487 ◽  
Author(s):  
Norifusa Satoh ◽  
Masaji Otsuka ◽  
Yasuaki Sakurai ◽  
Takeshi Asami ◽  
Yoshitsugu Goto ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Low Temperature ◽  
Waste Heat ◽  
Air Cooling ◽  
Conductive Adhesives ◽  
Hot Plate ◽  
Low Thermal Conductivity ◽  
Te Modules ◽  
P Type ◽  
Flexible Thermoelectric

ABSTRACTWe examined a working hypothesis of sticky thermoelectric (TE) materials, which is inversely designed to mass-produce flexible TE sheets with lamination or roll-to-roll processes without electric conductive adhesives. Herein, we prepared p-type and n-type sticky TE materials via mixing antimony and bismuth powders with low-volatilizable organic solvents to achieve a low thermal conductivity. Since the sticky TE materials are additionally injected into punched polymer sheets to contact with the upper and bottom electrodes in the fabrication process, the sticky TE modules of ca. 2.4 mm in thickness maintained temperature differences of ca. 10°C and 40°C on a hot plate of 40 °C and 120°C under a natural-air cooling condition with a fin. In the single-cell resistance analysis, we found that 75∼150-µm bismuth powder shows lower resistance than the smaller-sized one due to the fewer number of particle-particle interfaces in the electric pass between the upper and bottom electrodes. After adjusting the printed wiring pattern for the upper and bottom electrodes, we achieved 42 mV on a hot plate (120°C) with the 6 x 6 module having 212 Ω in the total resistance. In addition to the possibility of mass production at a reasonable cost, the sticky TE materials provide a low thermal conductivity for flexible TE modules to capture low-temperature waste heat under natural-air cooling conditions with fins for the purpose of energy harvesting.

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