scholarly journals Toward on-board microchip synthesis of CdSe vs. PbSe nanocrystalline quantum dots as a spectral decoy for protecting space assets

Author(s):  
Job Nijhuis ◽  
Quy Don Tran ◽  
Nam Nghiep Tran ◽  
Toan Dinh ◽  
Hoang-Phuong Phan ◽  
...  

Fabrication of the reaction chamber using silicon carbide. (A) A schematic sketch of the fabrication flow; (B) a photograph of a transparent 6 inch SiC-on-glass wafer; (C) the surface morphology of the SiC film.

2005 ◽  
Vol 274 (3-4) ◽  
pp. 387-393 ◽  
Author(s):  
Akihiro Matsuse ◽  
Nicolas Grandjean ◽  
Benjamin Damilano ◽  
Jean Massies

2014 ◽  
Vol 05 (04) ◽  
pp. 177-182
Author(s):  
Yuepeng Song ◽  
Dongsheng Gao ◽  
Hyoung Seop Kim ◽  
Cuiqin Qu ◽  
Jie Kang ◽  
...  

2019 ◽  
Vol 942 ◽  
pp. 77-86
Author(s):  
Alexander Gradoboev ◽  
Ksenia Orlova ◽  
Anastasiya V. Simonova

The most common technological solution for increasing the light efficiency of the LEDs based upon AlGaInP heterostructures are discussed in the paper. The creation of LEDs with the inclusion of quantum wells and quantum dots in the active region, removing the original base and placing the LED on a new substrate, the replacement of the absorbent substrate by the reflective, using light-reflective surfaces such as Bragg reflectors or a mirror base (substrate), the list of new based materials for the LEDs based upon AlGaInP heterostructures as same as sapphire, glass, gallium phosphide, silicon and silicon carbide are presented. Therefore, new advanced methods of emission power are emerging.


2019 ◽  
Vol 19 (5) ◽  
pp. 557-562
Author(s):  
Yi Wang ◽  
Xiang Guo ◽  
Jiemin Wei ◽  
Chen Yang ◽  
Zijiang Luo ◽  
...  

2011 ◽  
Vol 276 ◽  
pp. 21-25
Author(s):  
S.O. Gordienko ◽  
A. Nazarov ◽  
A.V. Rusavsky ◽  
A.V. Vasin ◽  
N. Rymarenko ◽  
...  

This paper presents an analysis of the electrical characteristics of the amorphous silicon carbide films deposited on the SiO2/Si substrate. Aspects of RF plasma treatment on electrical and structural characteristics of a-SiC film are discussed. It is demonstrated that the dominant mechanism of current transport in the a-SiC thin film is determined by variable-range hopping conductivity at the Fermi level. Studies of the a-SiC film at temperatures from 300 K to 600 K also indicate that silicon carbide is a perspective material for fabrication of temperature sensor.


2014 ◽  
Vol 14 (7) ◽  
pp. 5266-5271 ◽  
Author(s):  
Alireza Samavati ◽  
Zulkafli Othaman ◽  
Shadab Dabagh ◽  
Sib Krishna Ghoshal

2015 ◽  
Vol 821-823 ◽  
pp. 468-471 ◽  
Author(s):  
Yuki Mori ◽  
Mieko Matsumura ◽  
Hirotaka Hamamura ◽  
Toshiyuki Mine ◽  
Akio Shima ◽  
...  

The mechanism of dielectric breakdown of oxide on step-bunching of 4H-silicon carbide (SiC) was investigated. Comparing the surface morphology obtained before forming metal-oxide-semiconductor (MOS) capacitor and optical emission on the capacitor under electrical stress, it was cleared that current concentrates on step-bunching and it often caused preferential dielectric breakdown. Based on TEM analysis and the observation of time dependence of emission under the stress, a new model was proposed to explain the dielectric breakdown on step-bunching.


2015 ◽  
Vol 12 (12) ◽  
pp. 30-33
Author(s):  
Kailash Hamal ◽  
Armila Rajbhandari ◽  
Gobinda Gyawali ◽  
Soo Wohn Lee

Nickel-Silicon Carbide (Ni-SiC) composite has been prepared by electrochemical codeposition technique. Nickel sulfamate bath was used along with grain modifier saccharine and cationic surfactant cetyltrimetylammonium bromide (CTAB). The effect of stirring rate was systematically studied and optimized to get well dispersed SiC particles in appropriate amount. Mixed crystalline phase with reinforced [2 1 1] crystal orientation was obtained by XRD analysis. The result revealed that, 250 revolutions per minute (rpm) is optimum stirring rate for the electrochemical codeposition of Ni–SiC. Coating prepared at 250 rpm showed highest microhardness and lowest coefficient of friction with better surface morphology and well distributed nano SiC particles.Scientific World, Vol. 12, No. 12, September 2014, page 30-33       


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