Reversible immobilization of a protein to a gold surface through multiple host–guest interactions

2019 ◽  
Vol 7 (40) ◽  
pp. 6148-6155
Author(s):  
Dennis H. Schwarz ◽  
Walid A. M. Elgaher ◽  
Klaus Hollemeyer ◽  
Anna K. H. Hirsch ◽  
Gerhard Wenz
Keyword(s):  
Gold Surface ◽  
Specific Interactions ◽  
Reversible Immobilization

Monolayers were formed by specific interactions between adamantylated proteins (transferrin, lysozyme) and a β-cyclodextrin (β-CD) monolayer on a gold surface.

Fragment MO Calculations on Specific Interactions between AhR and TCDD for Beluga and Tern

2009 ◽  
Vol 10 ◽  
pp. 63-75
Author(s):  
Satoshi Miyagi ◽  
Eri Yoshikawa ◽  
Kenichi Dedachi ◽  
Satoshi Itoh ◽  
Mitsuko Ishihara-Sugano ◽  
...  
Keyword(s):  
Specific Interactions ◽  
Mo Calculations

Materials Characterization of Lead Free Compositions for Minimum Temperature SMT Processes at the SLI-Second Level Interconnect Solder Joint

2004 ◽  
Author(s):  
Norman J. Armendariz ◽  
Prawin Paulraj
Keyword(s):  
Solder Joint ◽  
Printed Circuit Board ◽  
Gold Surface ◽  
Circuit Board ◽  
Lead Free ◽  
Processing Temperature ◽  
The European Union ◽  
Printed Circuit ◽  
Higher Temperature ◽  
Tin Silver Copper

Abstract The European Union is banning the use of Pb in electronic products starting July 1st, 2006. Printed circuit board assemblies or “motherboards” require that planned CPU sockets and BGA chipsets use lead-free solder ball compositions at the second level interconnections (SLI) to attach to a printed circuit board (PCB) and survive various assembly and reliability test conditions for end-use deployment. Intel is pro-actively preparing for this anticipated Pb ban, by evaluating a new lead free (LF) solder alloy in the ternary Tin- Silver-Copper (Sn4.0Ag0.5Cu) system and developing higher temperature board assembly processes. This will be pursued with a focus on achieving the lowest process temperature required to avoid deleterious higher temperature effects and still achieve a metallurgically compatible solder joint. One primary factor is the elevated peak reflow temperature required for surface mount technology (SMT) LF assembly, which is approximately 250 °C compared to present eutectic tin/lead (Sn37Pb) reflow temperatures of around 220 °C. In addition, extended SMT time-above-liquidus (TAL) and subsequent cooling rates are also a concern not only for the critical BGA chipsets and CPU BGA sockets but to other components similarly attached to the same PCB substrate. PCBs used were conventional FR-4 substrates with organic solder preservative on the copper pads and mechanical daisychanged FCBGA components with direct immersion gold surface finish on their copper pads. However, a materials analysis method and approach is also required to characterize and evaluate the effect of low peak temperature LF SMT processing on the PBA SLI to identify the absolute limits or “cliffs” and determine if the minimum processing temperature and TAL could be further lowered. The SLI system is characterized using various microanalytical techniques, such as, conventional optical microscopy, scanning electron microscopy, energy dispersive spectroscopy and microhardness testing. In addition, the SLI is further characterized using macroanalytical techniques such as dye penetrant testing (DPT) with controlled tensile testing for mechanical strength in addition to disbond and crack area mapping to complete the analysis.

Influence of medium on alkaline hydrolysis of succinic acid monomethyl and monopropyl esters

1980 ◽  
Vol 45 (11) ◽  
pp. 2873-2882
Author(s):  
Vladislav Holba ◽  
Ján Benko
Keyword(s):  
Succinic Acid ◽  
Kinetic Parameters ◽  
Alkaline Hydrolysis ◽  
Specific Interactions ◽  
Nonaqueous Media ◽  
The Media ◽  
Kinetics Of ◽  
Hydrolysis Of

The kinetics of alkaline hydrolysis of succinic acid monomethyl and monopropyl esters were studied in mixed aqueous-nonaqueous media at various temperatures and ionic strengths. The results of measurements are discussed in terms of electrostatic and specific interactions between the reactants and other components of the reaction mixture. The kinetic parameters in the media under study are related to the influence of the cosolvent on the solvation sphere of the reactants.

A Comparative Study of Adsorption of Aliphatic Amines at a Gold Electrode

2005 ◽  
Vol 70 (12) ◽  
pp. 2027-2037 ◽  
Author(s):  
Teresa Łuczak
Keyword(s):  
Gibbs Energy ◽  
Comparative Study ◽  
Gold Electrode ◽  
Surface Coverage ◽  
Standard Gibbs Energy ◽  
Gold Surface ◽  
Experimental Dependence ◽  
Aliphatic Amines ◽  
Solvent Interactions ◽  
Amine Concentration

Adsorption of aliphatic amines (C1-C4) at the gold electrode was studied by tensammetry. It has been established that the experimental dependence between the gold surface coverage (Θ) and the bulk amine concentration (cA) fits satisfactorily both by the Frumkin and Flory-Huggins isotherms. The standard Gibbs energy of adsorption, ∆G°ad at Emax for Θ < 0.8 has been found to increase in the order methylamine < ethylamine < propylamine < butylamine. This is rationalised in terms of surface-adsorbate, adsorbate-adsorbate and adsorbate-solvent interactions.

Specific Interactions and Environment Flexibility Tune Protein Stability under Extreme Crowding

2021 ◽  
Author(s):  
Marina Katava ◽  
Guillaume Stirnemann ◽  
Maria Pachetti ◽  
Simone Capaccioli ◽  
Alessandro Paciaroni ◽  
...  
Keyword(s):  
Protein Stability ◽  
Specific Interactions
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