scholarly journals Correction: Carbon nanotube-copper exhibiting metal-like thermal conductivity and silicon-like thermal expansion for efficient cooling of electronics

Nanoscale ◽  
2019 ◽  
Vol 11 (4) ◽  
pp. 2089-2089
Author(s):  
Chandramouli Subramaniam ◽  
Yuzuri Yasuda ◽  
Satoshi Takeya ◽  
Seisuke Ata ◽  
Ayumi Nishizawa ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Carbon Nanotube ◽  
Cooling Of Electronics

Correction for ‘Carbon nanotube-copper exhibiting metal-like thermal conductivity and silicon-like thermal expansion for efficient cooling of electronics’ by Chandramouli Subramaniam and Kenji Hata et al., Nanoscale, 2014, 6, 2669–2674.

Carbon nanotube-copper exhibiting metal-like thermal conductivity and silicon-like thermal expansion for efficient cooling of electronics

Nanoscale ◽  
2014 ◽  
Vol 6 (5) ◽  
pp. 2669-2674 ◽  
Author(s):  
Chandramouli Subramaniam ◽  
Yuzuri Yasuda ◽  
Satoshi Takeya ◽  
Seisuke Ata ◽  
Ayumi Nishizawa ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Thermal Expansion ◽  
Thermal Properties ◽  
Carbon Nanotube ◽  
Cooling Of Electronics

A composite that synergistically combines the best thermal properties of carbon nanotubes and copper is developed for efficient cooling of microelectronics.

scholarly journals Optimization of the composition in a composite material for microelectronics application using the Ising model

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Yoshihiko Imanaka ◽  
Toshihisa Anazawa ◽  
Fumiaki Kumasaka ◽  
Hideyuki Jippo
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Ising Model ◽  
Specific Gravity ◽  
Simulated Annealing Algorithm ◽  
Optimization Problems ◽  
Industrial Applications ◽  
Thermal Dissipation ◽  
Materials Informatics ◽  
Combinatorial Optimization Problems

AbstractTailored material is necessary in many industrial applications since material properties directly determine the characteristics of components. However, the conventional trial and error approach is costly and time-consuming. Therefore, materials informatics is expected to overcome these drawbacks. Here, we show a new materials informatics approach applying the Ising model for solving discrete combinatorial optimization problems. In this study, the composition of the composite, aimed at developing a heat sink with three necessary properties: high thermal dissipation, attachability to Si, and a low weight, is optimized. We formulate an energy function equation concerning three objective terms with regard to the thermal conductivity, thermal expansion and specific gravity, with the composition variable and two constrained terms with a quadratic unconstrained binary optimization style equivalent to the Ising model and calculated by a simulated annealing algorithm. The composite properties of the composition selected from ten constituents are verified by the empirical mixture rule of the composite. As a result, an optimized composition with high thermal conductivity, thermal expansion close to that of Si, and a low specific gravity is acquired.

scholarly journals Mechanical and thermal expansion properties of aligned carbon nanotube reinforced epoxy composites

2019 ◽  
Vol 6 (3) ◽  
pp. 19-00012-19-00012 ◽  
Author(s):  
Keiichi SHIRASU ◽  
Itaru TAMAKI ◽  
Go YAMAMOTO ◽  
Toshiyuki HASHIDA
Keyword(s):  
Thermal Expansion ◽  
Carbon Nanotube ◽  
Epoxy Composites

Measurement of the thermal conductivity of a water-based single-wall carbon nanotube colloidal suspension with a modified 3- ω method

2009 ◽  
Vol 20 (31) ◽  
pp. 315706 ◽  
Author(s):  
Tae Y Choi ◽  
Mohammad H Maneshian ◽  
Boseon Kang ◽  
Won S Chang ◽  
Chang S Han ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotube ◽  
Colloidal Suspension ◽  
Single Wall Carbon Nanotube ◽  
Single Wall Carbon ◽  
Water Based
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