Thermal management applied laminar composites with SiC nanowires enhanced interface bonding strength and thermal conductivity

Nanoscale ◽  
2019 ◽  
Vol 11 (34) ◽  
pp. 15836-15845 ◽  
Author(s):  
Jing Chang ◽  
Qiang Zhang ◽  
Yingfei Lin ◽  
Puzhen Shao ◽  
Yinyin Pei ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
Bonding Strength ◽  
Interface Bonding ◽  
Pressure Infiltration ◽  
Laminar Composites ◽  
Sic Nanowires ◽  
Interface Bonding Strength ◽  
Infiltration Method

Thermal management applied laminar composites with enhanced interface bonding strength and thermal conductivity were fabricated through a pressure infiltration method.

Research Progress of Interface on Diamond/Copper Composites for Thermal Management

2014 ◽  
Vol 788 ◽  
pp. 680-688
Author(s):  
Peng Peng Wang ◽  
Hong Guo ◽  
Xi Min Zhang ◽  
Fa Zhang Yin ◽  
Ye Ming Fan ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
Research Progress ◽  
Interface Bonding ◽  
Pressure Infiltration ◽  
Interface Control ◽  
Low Thermal Expansion ◽  
Composite Interface ◽  
Johnson Model ◽  
Copper Composite

Diamond/Copper composite (Diamond/Cu) is a kind of ideal thermal management material, with high thermal conductivity and low thermal expansion. While the interface control is the center of the Diamond/Cu composites design. This paper summarizes the relevant studies on Diamond/Cu composite interface, including the researches of author’s group and other researchers. In addition, the prospect of research is mainly elaborated from following three parts: using carbide elements to control and improve the diamond/Cu composite interface bonding; the introduction of the research on Diamond/Cu composite interface with technologies of powder metallurgy, high temperature and high pressure process, spark plasma sintering and pressure infiltration; studying the thermal conductivity of Diamond/Cu composite by SThM analysis and testing technology and the Hasselman-Johnson model. The results show that controlling and improving the quality of Diamond/Cu composite interface bonding can improve the performance and stability of the composite.

Thermal Shock Behavior and Bonding Strength of MoSi2-BaO-Al2O3-SiO2 Gradient Porous Coating with Polymethyl Methacrylate Addition for Porous Fibrous Insulations

2018 ◽  
Vol 281 ◽  
pp. 493-498
Author(s):  
Ya Yu Su ◽  
Xiao Lei Li ◽  
Hui Jie Tang ◽  
Zhi Hao Zhao ◽  
Jian He
Keyword(s):  
Porous Structure ◽  
Thermal Shock ◽  
Bonding Strength ◽  
Thermal Shock Resistance ◽  
Porous Coating ◽  
Bonding Layer ◽  
Interface Bonding ◽  
Shock Resistance ◽  
Thermal Shock Behavior ◽  
Interface Bonding Strength

In order to improve the thermal shock behavior of high temperature resistant coating on porous fibrous referactory insulations, the MoSi2-BaO-Al2O3-SiO2(MoSi2-BAS) gradient porous coatings were designed by preparing a dense surface layer and a porous bonding layer with the method of brushing and subsequent sintering at 1773 K. The porous bonding layer was obtained by adding polymethyl methacrylate (PMMA) as pore former. As the content of PMMA increases, the MoSi2-BAS coatings changed from a dense structure into a gradient porous structure. The interface bonding strength and thermal shock resistance of the MoSi2-BAS coatings were investigated. The result shows that the as-prepared coating with gradient porous structure exhibited excellent thermal shock resistance, which remained gradient structure without cracking after thermal cycling 100 times between 1773 K and room temperature. And the interface bonding strength of the gradient porous coating reached 1.5±0.08 Mpa, which was much better than that of the dense coating.

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