Flexible h-BN foam sheets for multifunctional electronic packaging materials with ultrahigh thermostability

Soft Matter ◽  
2018 ◽  
Vol 14 (20) ◽  
pp. 4204-4212 ◽  
Author(s):  
Deul Kim ◽  
Artavazd Kirakosyan ◽  
Jae Woong Lee ◽  
Jong-Ryul Jeong ◽  
Jihoon Choi
Keyword(s):  
Thermal Conductivity ◽  
High Temperature ◽  
Network Structure ◽  
Electronic Packaging ◽  
Three Dimensional ◽  
Packaging Materials ◽  
Dimensional Network ◽  
Thermo Stability ◽  
Enhanced Thermal Conductivity

Flexible and robust h-BN foam sheets with a three-dimensional network structure exhibit a much enhanced thermal conductivity as well as thermo-stability at high temperature.

Fabrication of highly reliable joint based on Cu@Ni@Sn double-layer powder for high temperature application

2019 ◽  
Vol 2019 (HiTen) ◽  
pp. 000075-000084
Author(s):  
Hongyan Xu ◽  
Yaochun Shen ◽  
Yihua Hu ◽  
Jianqiang Li ◽  
Ju Xu
Keyword(s):  
High Temperature ◽  
Double Layer ◽  
Network Structure ◽  
Coating Layer ◽  
Three Dimensional ◽  
Transient Liquid Phase ◽  
Interfacial Structure ◽  
High Temperature Application ◽  
Dimensional Network ◽  
Temperature Application

Abstract A highly reliable three-dimensional network structure joint was fabricated based on Cu@Ni@Sn core-shell powder and transient liquid phase bonding (TLPB) technology for high temperature application. Cu@Ni@Sn joint is characterized by Cu metal particles embedded in the matrix of (Cu,Ni)6Sn5/Ni3Sn4 intermetallics (IMCs), low level of voiding is achieved, they can be reflowed at a low temperatures (<260°C), but reliably working at high temperature up to 415°C. Cu@Ni@Sn double-layer microparticles with different Sn layer and Ni layer thickness were fabricated and compressed as preform used for TLPB joint bonding, the microstructure and phase composition evolution for Cu@Sn and Cu@Ni@Sn system were comparatively studied during reflowing and aging process. Different kinds of interfacial structure designs were made, interfacial microscopic morphology was analyzed and compared under once and twice reflowing soldering process. Results indicated that Sn coating layer was completely consumed to form (Cu,Ni)6Sn5/Ni3Sn4 IMCs, Cu@Ni@Sn bondline have lower void rate and higher shear strength than that of Cu@Sn. The mechanism of Ni coating layer inhibit Cu atom diffusing towards Cu6Sn5 to form Cu3Sn was studied. The high reliable three-dimensional network structure joint based on Cu@Ni@Sn double-layer powder was fabricated for high temperature application.

scholarly journals Fabrication of Highly Reliable Joint Based on Cu/Ni/Sn Double-Layer Powder for High Temperature Application

2019 ◽  
Vol 16 (4) ◽  
pp. 188-195 ◽  
Author(s):  
Hongyan Xu ◽  
Yaochun Shen ◽  
Yihua Hu ◽  
Jianqiang Li ◽  
Ju Xu
Keyword(s):  
High Temperature ◽  
Double Layer ◽  
Network Structure ◽  
Void Ratio ◽  
Coating Layer ◽  
Three Dimensional ◽  
Interfacial Structure ◽  
High Temperature Application ◽  
Dimensional Network ◽  
Temperature Application

Abstract A highly reliable three-dimensional network structure joint was fabricated based on Cu/Ni/Sn powder with double-layer coatings and transient liquid phase bonding (TLPB) technology for high temperature application. The Cu/Ni/Sn joint is characterized by Cu metal particles embedded in the matrix of (Cu,Ni)6Sn5/Ni3Sn4 intermetallic compounds (IMCs), with a low void ratio, and can be reflowed at low temperatures (<260°C), but it can reliably work at a high temperature up to 415°C. Cu/Ni/Sn double-layer powders with different Sn layer and Ni layer thickness were was fabricated and compressed as preform used for TLPB joint bonding. The microstructure and phase composition evolution for Cu/Sn and Cu/Ni/Sn systems during reflow and aging were comparatively studied. Two kinds of interfacial structure designs were made, and corresponding interfacial microscopic morphology was analyzed and compared under once and twice reflow soldering processes. The results indicated that the Sn-coating layer was completely consumed to form (Cu,Ni)6Sn5/Ni3Sn4 IMCs, and the Cu/Ni/Sn joint had a lower void ratio and a higher shear strength than those of Cu/Sn. The mechanism of the Ni-coating layer inhibiting phase transformation was studied. The high reliable three-dimensional network structure joint based on Cu/Ni/Sn double-layer powder was fabricated for high temperature application.

scholarly journals Enhanced bacterial disinfection by CuI–BiOI/rGO hydrogel under visible light irradiation

RSC Advances ◽  
2021 ◽  
Vol 11 (33) ◽  
pp. 20446-20456
Author(s):  
Xi Ma ◽  
Ziwei Wang ◽  
Haoguo Yang ◽  
Yiqiu Zhang ◽  
Zizhong Zhang ◽  
...  
Keyword(s):  
Electron Transport ◽  
Visible Light ◽  
Network Structure ◽  
Visible Light Irradiation ◽  
Three Dimensional ◽  
Light Irradiation ◽  
Transport Capacity ◽  
Highly Efficient ◽  
Dimensional Network ◽  
Bacterial Disinfection

Compared with traditional layered graphene, graphene hydrogels have been used to construct highly efficient visible light-excited photocatalysts due to their particular three-dimensional network structure and efficient electron transport capacity.

scholarly journals Effect of Oat β-Glucan on the Rheological Characteristics and Microstructure of Set-Type Yogurt

Molecules ◽  
2021 ◽  
Vol 26 (16) ◽  
pp. 4752
Author(s):  
Xiaoqing Qu ◽  
Yuliya Nazarenko ◽  
Wei Yang ◽  
Yuanyang Nie ◽  
Yongsheng Zhang ◽  
...  
Keyword(s):  
Sensory Evaluation ◽  
Network Structure ◽  
Theoretical Basis ◽  
Fermentation Process ◽  
Three Dimensional ◽  
Rheological Characteristics ◽  
Fermentation Time ◽  
Spherical Aggregate ◽  
Dimensional Network ◽  
Solid Liquid

The oat β-glucan (OG) was added into set-type yogurt as a functional ingredient, in order to evaluate effects on the rheological characteristics and microstructure of set-type yogurt. When the OG concentration increased from 0 to 0.3%, the WHC gradually increased. At 0.3% OG, the set-type yogurt had the highest WHC of 94.67%. Additionally, the WHC continuously decreased, reaching the lowest WHC (about 80%) at 0.5% OG. When 0.3% OG was added, the highest score of sensory evaluation was about 85. The rheological result showed that the fermentation process went through the changes as follows: solid → liquid → solid → liquid. The addition of 0.3% OG decreased the fermentation time of set-type yogurt by about 16 min, making yogurt more inclined to be liquid. The acidity of set-type yogurt with OG was slightly higher. The result of microstructure showed that the addition of OG destroyed the three-dimensional network structure of yogurt, and some spherical aggregate particles could be clearly observed at 0.3% OG. Overall, this study provided a theoretical basis for the application of OG in set-type yogurt.

scholarly journals Advances in Liquid Crystalline Epoxy Resins for High Thermal Conductivity

Polymers ◽  
2021 ◽  
Vol 13 (8) ◽  
pp. 1302
Author(s):  
Younggi Hong ◽  
Munju Goh
Keyword(s):  
Thermal Conductivity ◽  
Network Structure ◽  
Epoxy Resins ◽  
Liquid Crystalline ◽  
Random Network ◽  
Three Dimensional ◽  
Heat Insulator ◽  
Liquid Crystalline Epoxy ◽  
Thermally Conductive ◽  
Substantial Interest

Epoxy resin (EP) is one of the most famous thermoset materials. In general, because EP has a three-dimensional random network, it possesses thermal properties similar to those of a typical heat insulator. Recently, there has been substantial interest in controlling the network structure of EP to create new functionalities. Indeed, the modified EP, represented as liquid crystalline epoxy (LCE), is considered promising for producing novel functionalities, which cannot be obtained from conventional EPs, by replacing the random network structure with an oriented one. In this paper, we review the current progress in the field of LCEs and their application to highly thermally conductive composite materials.

Chemical Stress Relaxation of NR Networks Prepared in the Swollen State

1986 ◽  
Vol 59 (4) ◽  
pp. 541-550 ◽  
Author(s):  
Kyung-Do Suh ◽  
Hidetoshi Oikawa ◽  
Kenkichi Murakami
Keyword(s):  
Stress Relaxation ◽  
Network Structure ◽  
Three Dimensional ◽  
Polymer Chains ◽  
Chemical Stress ◽  
Network Chain ◽  
Crosslinking Process ◽  
Dimensional Network ◽  
Chemical Relaxation ◽  
The Difference

Abstract From the experimental results of the present investigation, it is apparent that two kinds of networks which have a different three-dimensional network structure give quite different behavior of chemical stress relaxation, even if both networks have the same network chain density. The difference in three-dimensional network structure for the two kinds of rubber arises from the degree of entanglement, which changes with the concentration of the polymer chains prior to the crosslinking process. The direct cause of chemical relaxation is due to the scission of network chains by degradation, whereas the total relaxation is caused by the change of geometrical conformation of network chains. This then casts doubt on the basic concept of chemorheology which is represented by Equation 2.

Constructing Three-dimensional Nano-crystalline Diamond Network within Polymer Composites for Enhanced Thermal Conductivity

Nanoscale ◽  
2021 ◽  
Author(s):  
Shaoyang Xiong ◽  
Yue Qin ◽  
Linhong Li ◽  
Guoyong Yang ◽  
Maohua Li ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Thermal Performance ◽  
Thermal Transport ◽  
High Performance ◽  
Rapid Development ◽  
Electronic Devices ◽  
Three Dimensional ◽  
Nano Crystalline ◽  
Enhanced Thermal Conductivity

In order to meet the requirement of thermal performance with the rapid development of high-performance electronic devices, constructing a three-dimensional thermal transport skeleton is an effective method for enhancing thermal...

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