The research status and challenges of shape memory polymer-based flexible electronics

2019 ◽  
Vol 6 (5) ◽  
pp. 931-944 ◽  
Author(s):  
Hui Gao ◽  
Jinrong Li ◽  
Fenghua Zhang ◽  
Yanju Liu ◽  
Jinsong Leng

This review summarizes the advances and challenges of shape memory polymer-based flexible electronic devices.

2017 ◽  
Vol 46 (22) ◽  
pp. 6764-6815 ◽  
Author(s):  
Lili Wang ◽  
Di Chen ◽  
Kai Jiang ◽  
Guozhen Shen

Materials based on biological materials are becoming increasingly competitive and are likely to be critical components in flexible electronic devices.


2016 ◽  
Vol 28 (22) ◽  
pp. 4166-4166 ◽  
Author(s):  
Matt Zarek ◽  
Michael Layani ◽  
Ido Cooperstein ◽  
Ela Sachyani ◽  
Daniel Cohn ◽  
...  

2020 ◽  
Vol 8 (23) ◽  
pp. 7772-7785 ◽  
Author(s):  
Qiming Yan ◽  
Meng Zhou ◽  
Heqing Fu

Flexible conductive adhesives are important materials for the next generation of flexible electronic devices.


2015 ◽  
Vol 28 (22) ◽  
pp. 4449-4454 ◽  
Author(s):  
Matt Zarek ◽  
Michael Layani ◽  
Ido Cooperstein ◽  
Ela Sachyani ◽  
Daniel Cohn ◽  
...  

Author(s):  
Ashante’ Allen ◽  
Andrew Cannon ◽  
William King ◽  
Samuel Graham

The development of processing methods for flexible electronic devices is seen as an enabling technology for the creation of a new array of semiconductor products. These devices have the potential be low cost, disposable, and can be applied to deformable or non-planar surfaces. While much effort has been put into the development of amorphous silicon and organic semiconductor technology for flexible devices, semiconductor nanomaterials are of interest due to their inherently flexibility, high transport mobilities, and their unique optoelectronic and piezoelectric properties. However, the synthesis of these materials directly onto polymer substrates is not feasible due to the high temperatures or harsh chemical environments under which they are synthesized. This challenge has limited the development of flexible electronics with semiconductor nanomaterial building blocks. A number of techniques which address the manufacturing concerns include solution based processing [1,2] as well as dry transfer techniques [3–5]. In general, dry transfer printing methods carry advantages over solution based processing as the need to address substrate-fluid compatibility is mitigated.


2021 ◽  
pp. 2001662
Author(s):  
Ryo Taguchi ◽  
Norihisa Akamatsu ◽  
Kohei Kuwahara ◽  
Kayoko Tokumitsu ◽  
Yoshiaki Kobayashi ◽  
...  

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