Facile method for fabricating low dielectric constant polyimide fibers with hyperbranched polysiloxane

2017 ◽  
Vol 5 (11) ◽  
pp. 2818-2825 ◽  
Author(s):  
Jie Dong ◽  
Cairan Yang ◽  
Yang Cheng ◽  
Tingting Wu ◽  
Xin Zhao ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Stability ◽  
Dielectric Constant ◽  
High Performance ◽  
Low Dielectric Constant ◽  
Excellent Thermal Stability ◽  
Low Dielectric ◽  
Polyimide Fibers ◽  
Hyperbranched Polysiloxane ◽  
Radar Wave

High-performance fibers with a low dielectric constant and good mechanical properties as well as excellent thermal stability are in demand for the next generation of advanced radar-wave-transparent composites.

Epoxy/benzoxazinyl POSS nanocomposite resin with low dielectric constant and excellent thermal stability

2020 ◽  
Vol 138 (8) ◽  
pp. 49887
Author(s):  
Xiaodan Li ◽  
Jiacheng Feng ◽  
Shuai Zhang ◽  
Ying Tang ◽  
Xinyu Hu ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Low Dielectric Constant ◽  
Excellent Thermal Stability ◽  
Low Dielectric

A novel approach to prepare graphene oxide/soluble polyimide composite films with a low dielectric constant and high mechanical properties

RSC Advances ◽  
2014 ◽  
Vol 4 (93) ◽  
pp. 51117-51125 ◽  
Author(s):  
Wei-Hao Liao ◽  
Shin-Yi Yang ◽  
Sheng-Tsung Hsiao ◽  
Yu-Sheng Wang ◽  
Shin-Ming Li ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Dielectric Constant ◽  
Graphene Oxide ◽  
High Performance ◽  
Composite Films ◽  
Low Dielectric Constant ◽  
Low Dielectric ◽  
Novel Approach ◽  
Soluble Polyimide

This study proposes a facile, practical and effective approach to prepare high-performance graphene oxide (GO)/soluble polyimide (SPI) composite films through a dissolved and dispersed strategy.

Preparation and Properties of MWCNTs/ PBO Membrane by Electrospinning

2014 ◽  
Vol 577 ◽  
pp. 58-61
Author(s):  
Rong Rong Hao ◽  
Jun Hong Jin ◽  
Sheng Lin Yang
Keyword(s):  
Mechanical Properties ◽  
Mechanical Property ◽  
Thermal Stability ◽  
Dielectric Constant ◽  
Low Dielectric Constant ◽  
Thermal Cyclization ◽  
Low Dielectric ◽  
Submicron Scale ◽  
Fiber Membranes ◽  
Pbo Fiber

Polybenzoxazole (PBO) fiber membranes with submicron-scale diameter were fabricated from the polyhydroxyamide (PHA) precursor by electrospinning and thermal cyclization processes. In order to improve the strength of the membrane MWCNTs was blended with PHA in the mixture solvent of dimethylacetamide (DMAc) and THF. The morphology, thermal stability, mechanical properties and dielectric constant of MWCNTs / PHA and MWCNTs / PBO membranes were characterized. For MWCNTs/PBO membranes, improved mechanical property and low dielectric constant could be achieved.

The characterization and preparation of porous low dielectric films using various cyclodextrins as template materials

2003 ◽  
Vol 766 ◽  
Author(s):  
Jin-Heong Yim ◽  
Jung-Bae Kim ◽  
Hyun-Dam Jeong ◽  
Yi-Yeoul Lyu ◽  
Sang Kook Mah ◽  
...  
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Dielectric Constant ◽  
Pore Structure ◽  
Pore Diameter ◽  
Dielectric Films ◽  
Low Dielectric Constant ◽  
Cyclodextrin Derivatives ◽  
Low Dielectric ◽  
Low K

AbstractPorous low dielectric films containing nano pores (∼20Å) with low dielectric constant (<2.2), have been prepared by using various kinds of cyclodextrin derivatives as porogenic materials. The pore structure such as pore size and interconnectivity can be controlled by changing functional groups of the cyclodextrin derivatives. We found that mechanical properties of porous low-k thin film prepared with mCSSQ (modified cyclic silsesquioxane) precursor and cyclodextrin derivatives were correlated with the pore interconnection length. The longer the interconnection length of nanopores in the thin film, the worse the mechanical properties of the thin film (such as hardness and modulus) even though the pore diameter of the films were microporous (∼2nm).

Curing Process Window and Thermal Stability of Porous MSQ-Based Low-Dielectric-Constant Materials

2004 ◽  
Vol 151 (6) ◽  
pp. F146 ◽  
Author(s):  
Shou-Yi Chang ◽  
Tzu-Jen Chou ◽  
Yung-Cheng Lu ◽  
Syun-Ming Jang ◽  
Su-Jien Lin ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Low Dielectric Constant ◽  
Process Window ◽  
Curing Process ◽  
Low Dielectric ◽  
Low Dielectric Constant Materials ◽  
Thermal Stability Of

Deposition of Fluorinated Amorphous Carbon Thin Films with Low Dielectric Constant and Thermal Stability

2000 ◽  
Vol 612 ◽  
Author(s):  
Sang-Soo Han ◽  
Byeong-Soo Bae
Keyword(s):  
Thin Films ◽  
Thermal Stability ◽  
Dielectric Constant ◽  
Amorphous Carbon ◽  
Inductively Coupled Plasma ◽  
Gas Flow ◽  
Stable Condition ◽  
Flow Rate Ratio ◽  
Low Dielectric Constant ◽  
Low Dielectric

AbstractFluorinated amorphous carbon (a-C:F) thin films were deposited by inductively coupled plasma enhanced chemical vapor deposition (ICP-CVD) with increasing CF4:CH4 gas flow rate ratio, and then annealed with increasing annealing temperature (100, 200, 300, and 400.). We have found the reduction mechanism of the dielectric constant and the thermally stable condition for the a-C:F films. On the basis of the results, the optimal condition to satisfy both the low dielectric constant and the thermal stability is followed as; the a-C:F films have to have the compatible F content to make a compromise between the two properties; the C-Fx bonding configuration has to exist as a form of C-F2 & C-F3 instead of C-F; The films should be somewhat cross-linked structure.

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