scholarly journals Preparation and characterization of novel naphthyl epoxy resin containing 4-fluorobenzoyl side chains for low-k dielectrics application

RSC Advances ◽  
2017 ◽  
Vol 7 (85) ◽  
pp. 53970-53976 ◽  
Author(s):  
Tianyi Na ◽  
Hao Jiang ◽  
Liang Zhao ◽  
Chengji Zhao
Keyword(s):  
Dielectric Constant ◽  
Dielectric Loss ◽  
Epoxy Resin ◽  
Epoxy Resins ◽  
Side Chains ◽  
The Novel ◽  
Lower Dielectric Constant ◽  
Low K

The novel naphthyl epoxy resin was synthesized and cured with MeHHPA. It showed significantly lower dielectric constant and dielectric loss than other commercial epoxy resins due to the introduction of fluorine on the side chains.

The Novel Diamine, Dianhydride, and Polyimide Based on Anthracene Core

2014 ◽  
Vol 1692 ◽  
Author(s):  
Eunhye Shin ◽  
Jong Chan Won ◽  
Byoung Gak Kim ◽  
Jae-Won Ka ◽  
Kwang-Suk Jang ◽  
...  
Keyword(s):  
Integrated Circuit ◽  
Information Technologies ◽  
Chemical Resistance ◽  
High Thermal Stability ◽  
Synthesis And Characterization ◽  
The Novel ◽  
Aromatic Polyimides ◽  
Lower Dielectric Constant ◽  
Low K

ABSTRACTThe lower dielectric constant (k) insulator is required for faster, smaller, and higher performance integrated circuit of the microprocessor and other advanced semiconductor devices that are so important to modern electronics and information technologies. Aromatic polyimides are among the candidate materials of low k due to their high thermal stability, mechanical strength and chemical resistance.In this work, we show an 2,6-di-tert-butyl-9,10-diphenylanthracene core based novel polyimide which has been designed to have the lower polar imide concentration compared to that of conventional polyimides as well as the synthesis and characterization of its constitutional units, diamine and dianhydride.

Study on Properties of Epoxy Resins Modified by Nano-Silica

2011 ◽  
Vol 71-78 ◽  
pp. 1005-1008
Author(s):  
Yu Fei Chen ◽  
Yi Yue Xiao ◽  
Shi Xia Li ◽  
Xu Zhang
Keyword(s):  
Dielectric Constant ◽  
Dielectric Loss ◽  
Epoxy Resin ◽  
Epoxy Resins ◽  
Decomposition Temperature ◽  
Inorganic Component ◽  
Nano Silica ◽  
Organic Precursor ◽  
Epoxy Resin Adhesive ◽  
Modified Epoxy

Organic precursor of EP/PU was prepared by epoxy resin which was polyurethane toughened, and then modified epoxy resin adhesive was synthesized using nano-silica as modifier. Microstructure of composite materials was observed by scanning electron microscopy (SEM), the results showed that the inorganic phase had good compatibility in polymer matrix, and polyurethane in epoxy resin have formed the "island structure". The mechanical properties, thermal stability and dielectric loss, dielectric constant of composites were investigated. The results indicated that doping of appropriate amount of nano-silica could improve mechanical property, shear strength and impact strength of 2wt% SiO2/EP-PU were increased 173% and 106.67%, than that of pre-doping of composite, respectively. Thermal decomposition temperature (Td) was increased, Tdof 2wt%SiO2/EP-PU was increased 8.1°C than that of pre-doped of material. Dielectric constant (ε) was as follows: was decreased with the increase of frequency, but increased with the increase of inorganic component, dielectric loss (tanδ) was increased with the increase of frequency and inorganic doping.

Bio-Based Epoxy Resins Derived From Eugenol With Low Dielectric Constant

2017 ◽  
Vol 139 (3) ◽  
Author(s):  
Yuan Liu ◽  
Jinyue Dai ◽  
Xiaoqing Liu ◽  
Jun Luo ◽  
Shusen You ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
Epoxy Resin ◽  
Epoxy Resins ◽  
Mechanical Analysis ◽  
Scanning Calorimetry ◽  
Chemical Structures ◽  
Low Dielectric ◽  
Lower Dielectric Constant ◽  
No Weight Loss ◽  
Nmr Properties

In this paper, a series of bio-based epoxy resins containing organic silicone were prepared from eugenol through a mild synthetic route. Then, 4,4′-diaminophenyl methane (DDM) was applied to cure these epoxy resins, and bisphenol A epoxy resin (DGEBA) was used as a control. The chemical structures of the synthesized resins were characterized by nuclear magnetic resonance (1H-NMR). Properties of the cured epoxy resins were investigated by dielectric test, differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), dynamic mechanical analysis (DMA), and scanning electron microscopy (SEM). Compared with DGEBA, the bio-based epoxy resin containing cyclic organic silicon structure exhibited a dramatically lower dielectric constant at both low and high frequencies (3.46, 1 kHz, room temperature). Moreover, the silicone-modified bio-based epoxy resins demonstrated no weight loss below 325 °C and higher residues at 800 °C than that of DGEBA.

Synthesis and Characterization of Liquefied Corn Barn-Based Epoxy Resins

2011 ◽  
Vol 236-238 ◽  
pp. 116-119
Author(s):  
Wen Ming Zhang ◽  
Yu Cang Zhang ◽  
De Feng Zhao
Keyword(s):  
Epoxy Resin ◽  
Epoxy Resins ◽  
Raw Materials ◽  
Thermal And Mechanical Properties ◽  
Reaction Conditions ◽  
Good Thermal Stability ◽  
Molecular Weights ◽  
Biomass Materials ◽  
Adhesive Shear Strength

The liquefied corn barn-based epoxy resin (LCBER) was synthesised through the glycidyl etherification reaction from liquefied corn barn (LCB) had having groups of bound phenol and epichlorohydrine under alkali conditions. The average molecular weights of LCBER in various reaction conditions were examined. The extreme high molecular weight portion of LCBER-30 was obtained using LCB at 30 min as raw materials. The epoxy functionality of LCBER was controlled by the amount of bound phenol in LCB. LCBER was cured with polyamide-650 (PA-650) and the thermal and mechanical properties were evaluated. Comparing to the petroleum-based bisphenol-A type epoxy resin (DGEBA), LCBER presented higher adhesive shear strength and good thermal stability. These suggested that LCBER would be more suitable to glue biomass materials.

Thermal and Dielectric Properties of Inorganic-Organic Nanocomposites Involving Epoxy Resin and Polyhedral Oligomeric Silsesquioxanes

2012 ◽  
Vol 476-478 ◽  
pp. 665-669 ◽  
Author(s):  
Li Yang ◽  
Miao Yin ◽  
Xiu Yun Li ◽  
Han Bing Ma
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Dielectric Properties ◽  
Bisphenol A ◽  
Epoxy Resin ◽  
Functional Groups ◽  
Epoxy Matrix ◽  
Epoxy Resins ◽  
Diglycidyl Ether ◽  
Polyhedral Oligomeric Silsesquioxanes

In this paper, a type of nanoporous polyhedral oligomeric silisesquioxanes (POSS) containing eight functional groups have been synthesized and mixed with diglycidyl ether of bisphenol A (DGEBA) to form epoxy resin networks with nanostructures. The cured octa(aminophenyl) silsesquioxane (1c-POSS) and DGEBA system inherently possesses higher thermal stability and higher char yield than the control epoxy resins. Furthermore, the dielectric constant of the 1c-POSS/DGEBA material (4.36) is substantially lower than that of the neat epoxy resins (4.64) as a consequence the presence of nanoporous POSS cubes in the epoxy matrix.

Low k Film Etch in Applied Materials eMxP+ Chamber

1998 ◽  
Vol 544 ◽  
Author(s):  
Melissa Yu ◽  
Hongching Shan ◽  
Ashley Taylor
Keyword(s):  
Dielectric Constant ◽  
Etch Rate ◽  
Process Conditions ◽  
Plasma Etch ◽  
Absolute Value ◽  
Lower Dielectric Constant ◽  
Profile Control ◽  
Etch Stop ◽  
Anisotropic Etch ◽  
Low K

ABSTRACTThe materials with lower dielectric constant ( low k ) have been attracting attention recently because the low k material has the potential to be used in place of SiO2 in ULSI. In this work, we focused on evaluating organic low k material performance with plasma etch in the Applied Material's eMxP+ anisotropic etch chamber. The films studied were Dow Chemical BCB and Silk, Allied Signal Flare 2.0, and Du Pont FPI. The feature sizes of the wafer s were 0.25 to 1 micron trenches. Du Pont FPI resulted in the highest achieved etch rate of more than lum/min, followed by BCB, and Flare. The microloading study indicated that the etch rate microloading is less than 10% between lum and 0.25 urn feature sizes, which suggests that the chance of etch stop for a high aspect ratio features will be small. The profile could vary from bowing to vertical, to tapering by using different process conditions, mainly by temperature. The FP1 profile was more tapered than those of BCB and Flare when the same process was used to etch the same type of patterned wafer having these three different low k films. The detailed study showed that the trend of etch rate and profile for BCB and Flare film etch were similar, but that the absolute value for profile, as well as the trend of etch rate uniformity and profile were somewhat different. In conclusion, low k materials can be etched in AMAT traditional dielectric chamber (eMxP+) with a good etch rate and profile control.

Influence of Doped Mn, Cu, Ni and Fe on Electrical Properties of SrTiO3 Ceramics

2009 ◽  
Vol 79-82 ◽  
pp. 1603-1606 ◽  
Author(s):  
Ning Zhang Wang ◽  
Sha Sha ◽  
Yu Tian Ma
Keyword(s):  
Dielectric Constant ◽  
Electrical Properties ◽  
Dielectric Loss ◽  
Nonlinear Coefficient ◽  
Lower Dielectric Constant ◽  
Sintering Conditions

MnCO3, CuO, NiO and Fe2O3 doped SrTiO3 multifunction ceramics were fabricated firstly. The microstructure and electrical properties were investigated. The results show that MnCO3 doped ceramic and CuO doped ceramic possess relative higher resistivity (ρ),nonlinear coefficient (α), varistor voltage (V1mA) and relative lower dielectric constant (ε),dielectric loss (tgδ) in contrast with NiO doped ceramic and Fe2O3 doped ceramic with the same contents under the same sintering conditions. The electrical properties among the ceramics doped are different due to the different behaviors of Mn,Cu,Ni and Fe acceptor dopants during the sintering course.

scholarly journals The Effects of TDI on Selected Properties of Ester Epoxy Alkyd Varnish

2020 ◽  
Vol 36 (4) ◽  
Author(s):  
Nguyen Trung Thanh
Keyword(s):  
Dielectric Constant ◽  
Electrical Properties ◽  
Dielectric Loss ◽  
Heat Resistance ◽  
Epoxy Resin ◽  
Breakdown Voltage ◽  
Toluene Diisocyanate

This article presents the effects of toluene diisocyanate (TDI) on electrical properties of ester epoxy alkyd varnish. Through testing on breakdown voltage, dielectric constant, block resistivity, Tang (Tg) dielectric loss, the electrical properties of varnish were investigated. When TDI amount increased from to 4 - 10 (w/100w of epoxy resin), the breakdown voltage increased from 21.78 to 65.69 KV/mm. With TDI of 8 - 10 w/w, the dielectric constant was the best, about 2.78 - 3.02. With TDI of 8 w/w, the block resistivity was 6.8.1014 W.cm and Tg dielectric loss was 0.0069. The article also presents the effect of TDI on solvent- and heat resistance of the varnish.

scholarly journals Preparation and Characterization of DOPO-Functionalized MWCNT and Its High Flame-Retardant Performance in Epoxy Nanocomposites

Polymers ◽  
2020 ◽  
Vol 12 (3) ◽  
pp. 613 ◽  
Author(s):  
Liqiang Gu ◽  
Chen Qiu ◽  
Jianhui Qiu ◽  
Youwei Yao ◽  
Eiichi Sakai ◽  
...  
Keyword(s):  
Heat Release ◽  
Flame Retardant ◽  
Epoxy Resin ◽  
Epoxy Resins ◽  
Phosphorus Content ◽  
Co2 Production ◽  
Peak Heat Release Rate ◽  
Multi Walled Carbon Nanotubes ◽  
Walled Carbon Nanotubes

In this work, functionalized multi-walled carbon nanotubes (MWCNT) were synthesized by the reaction between acylated MWCNT and 10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (ODOPB). The obtained MWCNT-ODOPB was well dispersed into epoxy resins together with aluminum diethylphosphinate (AlPi) to form flame-retardant nanocomposites. The epoxy resin nanocomposite with phosphorus content of 1.00 wt % met UL 94 V-0 rating, exhibited LOI value of 39.5, and had a higher Tg compared to neat epoxy resin, which indicates its excellent flame retardant performance. These experimental results indicated that MWCNT-ODOPB was a compatible and efficient flame retardant for epoxy resins. Moreover, cone calorimeter analysis showed that the peak heat release rate (pHRR), total heat release (THR) values, and CO2 production profiles of the composites decreased with an increase in the additional amount of phosphorus.

Characterization and dielectric properties of sodium fluoride doped talc

Clay Minerals ◽  
2014 ◽  
Vol 49 (4) ◽  
pp. 551-558
Author(s):  
S. Gümüştas ◽  
K. Köseoğlu ◽  
E. E. Yalçinkaya ◽  
M. Balcan
Keyword(s):  
Dielectric Constant ◽  
Dielectric Properties ◽  
Dielectric Loss ◽  
Firing Temperature ◽  
Room Temperature ◽  
Dielectric Measurements ◽  
Frequency Range ◽  
Detailed Characterization ◽  
Circuit Element

AbstractThe purpose of this paper is to determine the effect of NaF and firing temperature on the dielectric properties (dielectric constant and dielectric loss) of talc, which is used in the electrical and electronic industries as a circuit element. A detailed characterization of the samples was made by XRD, FTIR, SEM and TG-DTG methods. Dielectric measurements were performed in the frequency range from 1 MHz to 80 MHz at room temperature. The dielectric constant value increased with an increase in firing temperature due to the removal of polarizable compounds from the talc structure. The higher dielectric constant values were obtained by addition of NaF. The dielectric loss of NaF doped talc decreased with the increase of firing temperature and increased with the increase of the amount of NaF.

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