Surface-assisted dehydrogenative homocoupling and cyclodehydrogenation of mesityl groups on a copper surface

2017 ◽  
Vol 53 (65) ◽  
pp. 9151-9154 ◽  
Author(s):  
Xinli Leng ◽  
Yan Lu ◽  
Gang Feng ◽  
Zhongping Wang ◽  
Wei Li ◽  
...  
Keyword(s):  
Copper Surface ◽  
Ethylene Unit

A route via surface-assisted dehydrogenative homocoupling and cyclodehydrogenation of mesityl groups to form an ethylene unit and aromatic six-membered rings has been achieved.

scholarly journals Improved Copper–Epoxy Adhesion by Laser Micro- and Nano-Structuring of Copper Surface for Thermal Applications

Polymers ◽  
2021 ◽  
Vol 13 (11) ◽  
pp. 1721
Author(s):  
Mario Mora ◽  
Hippolyte Amaveda ◽  
Luis Porta-Velilla ◽  
Germán F. de la Fuente ◽  
Elena Martínez ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Bonding Strength ◽  
Copper Surface ◽  
Heat Sinks ◽  
Electrical Insulation ◽  
Cryogenic Temperatures ◽  
Shear Tests ◽  
Patterned Structures ◽  
Different Temperatures ◽  
Mechanical Tensile

The objective of this work is the enhancement of metal-to-metal bonding to provide high thermal conductivity together with electrical insulation, to be used as heat sinks at room and cryogenic temperatures. High thermal conductive metal (copper) and epoxy resin (Stycast 2850FT) were used in this study, with the latter also providing the required electrical insulation. The copper surface was irradiated with laser to induce micro- and nano-patterned structures that result in an improvement of the adhesion between the epoxy and the copper. Thus, copper-to-copper bonding strength was characterized by means of mechanical tensile shear tests. The effect of the laser processing on the thermal conductivity properties of the Cu/epoxy/Cu joint at different temperatures, from 10 to 300 K, is also reported. Using adequate laser parameters, it is possible to obtain high bonding strength values limited by cohesive epoxy fracture, together with good thermal conductivity at ambient and cryogenic temperatures.

Selective CO2 Electrochemical Reduction Enabled by a Tricomponent Copolymer Modifier on a Copper Surface

2021 ◽  
Vol 143 (7) ◽  
pp. 2857-2865
Author(s):  
Jianchun Wang ◽  
Tao Cheng ◽  
Aidan Q. Fenwick ◽  
Turki N. Baroud ◽  
Alonso Rosas-Hernández ◽  
...  
Keyword(s):  
Electrochemical Reduction ◽  
Copper Surface

In-Depth Investigation of Copper Surface Chemistry Modification by Ultrashort Pulsed Direct Laser Interference Patterning

Langmuir ◽  
2020 ◽  
Vol 36 (45) ◽  
pp. 13415-13425 ◽  
Author(s):  
Daniel W. Müller ◽  
Anne Holtsch ◽  
Sarah Lößlein ◽  
Christoph Pauly ◽  
Christian Spengler ◽  
...  
Keyword(s):  
Surface Chemistry ◽  
Copper Surface ◽  
Laser Interference ◽  
Direct Laser ◽  
Surface Chemistry Modification ◽  
Direct Laser Interference Patterning

Boiling Heat Transfer Properties of Copper Surface with Different Microstructures

2021 ◽  
pp. 124589
Author(s):  
Liying Wang ◽  
Yonghua Wang ◽  
Wen Cheng ◽  
Huadong Yu ◽  
Jinkai Xu
Keyword(s):  
Heat Transfer ◽  
Boiling Heat Transfer ◽  
Copper Surface ◽  
Transfer Properties
Sign in / Sign up

Export Citation Format

Share Document