Plasma deposition of a stable SiO
x
‐like layer on copper surface for enhanced pool boiling heat transfer performance: A combination of microstructures and wetting properties
2020 ◽
Vol 114
◽
pp. 104587
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2019 ◽
Vol 153
◽
pp. 168-180
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2018 ◽
Vol 10
(3)
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