Effect of heat treatment on structures and mechanical properties of electroless Ni–P–GO composite coatings

RSC Advances ◽  
2016 ◽  
Vol 6 (110) ◽  
pp. 109001-109008 ◽  
Author(s):  
Jibo Jiang ◽  
Haotian Chen ◽  
Liying Zhu ◽  
Wei Qian ◽  
Sheng Han ◽  
...  

In this work, graphene oxide (GO) was incorporated into a nickel phosphorus (Ni–P) alloy matrix by electroless plating.

2011 ◽  
Vol 694 ◽  
pp. 855-859
Author(s):  
Wan Chang Sun

As a new carbon material, carbon nanotubes have excellent mechanical properties and special tubular structure, CNTs can be used as a reinforce body to improve the hardness and tribological performance. In this paper, Ni-P-CNTs composite coatings were successfully co-deposited by electroless plating. The optimum plating process was determined, and the effects of CNTs and heat treatment on hardness of the composite coatings were investigated. The hardness of the composite coatings was greatly improved after heat treatment. Moreover, as the increase of CNT concentration in the plating bath, the micro-hardness of the coatings was also increased.


Author(s):  
T.A. Krylova ◽  
◽  
Y.A. Chumakov ◽  

The effect of heat treatment on the structure and properties of composite coatings based on chromium carbide with titanium carbide fabricated by non-vacuum electron beam cladding without has been studied. It was shown that tempering leads to a decrease in microhardness and wear resistance, which is associated with the decomposition of the austenitic structure with the formation of a soft ferrite-carbide structure. The post heat treatment tempering was showed to decrease of microhardness and wear resistance, which leads to the decomposition of the austenitic structure with the formation of a soft ferrite-carbide structure. The bulk quenching of coatings after tempering leads to an increase in microhardness comparable to the values of microhardness in the initial state after electron beam cladding, due to the formation of high hard martensite. The wear resistance of composite coatings after tempering is lower than after cladding due to brittle martensite, which is not able to hold solid carbide particles. The composite coatings obtained at the optimal processing conditions have a combination of improved properties and do not require additional heat treatment, resulting in structural changes, causing a decrease in mechanical properties.


2013 ◽  
Vol 2013 (1) ◽  
pp. 000061-000066
Author(s):  
M. Albarghouti ◽  
N. El Dahdah ◽  
G. Perosevic ◽  
S. Jain ◽  
J-M Papillon ◽  
...  

In this work we investigated the effect of Nickel (Ni) plating process on the Hydrogen (H) and moisture content of hermetic packages such as those used in optoelectronics. The work offers an explanation of moisture formation inside hermetic packages by showing that the problem arises from the electroless plating of Ni which is found to be inherently rich in H. The effects of the Ni plating process, baking, and Au thickness on the moisture and hydrogen content of hermetic packages were thoroughly explored. It was observed that baking the package components before sealing alleviates the problem of moisture formation inside the package but it doesn't fully eliminate it. It was only after changing the Ni plating process from electroless to electrolytic that the moisture problem actually disappeared. Our investigation showed that moisture formation inside hermetic packages is due to H evolution from the electroless Ni which eventually reacts with surface oxides to form H2O. SIMS analysis of electroless and electrolytic Ni showed that electroless Ni is around ten folds richer in H compared to its electrolytic counterpart. SIMS analysis also showed that H content in electroless Ni can be significantly reduced with heat treatment.


2014 ◽  
Vol 11 (2) ◽  
pp. 75-79 ◽  
Author(s):  
M. Albarghouti ◽  
N. El Dahdah ◽  
G. Perosevic ◽  
S. Jain ◽  
J.-M. Papillon ◽  
...  

In this work the effect of nickel (Ni) plating process on the hydrogen (H) and moisture content of hermetic packages such as those used in optoelectronics was investigated. The work offers an explanation of moisture formation inside hermetic packages by showing that the problem arises from the electroless plating of Ni, which is found to be inherently rich in H. The effects of the Ni plating process, baking, and Au thickness on the moisture and hydrogen content of hermetic packages were thoroughly explored. It was observed that baking the package components before sealing alleviates the problem of moisture formation inside the package but does not fully eliminate it. It was only after changing the Ni plating process from electroless to electrolytic that the moisture problem actually disappeared. This investigation showed that moisture formation inside hermetic packages is due to H evolution from the electroless Ni which eventually reacts with surface oxides to form H2O. SIMS analysis of electroless and electrolytic Ni showed that electroless Ni is around 10-fold richer in H compared with its electrolytic counterpart. SIMS analysis also showed that H content in electroless Ni can be significantly reduced with heat treatment.


2012 ◽  
Vol 472-475 ◽  
pp. 70-73
Author(s):  
Ya Xu Jin ◽  
Yu Ming Tian ◽  
Qiu Shu Li

Electroless nickel plating with potassium titanate whisker was co-deposited on medium carbon steel substrates. The microstructure of the composite coatings was investigated. The effect of aging temperature on the microstructure of the composite coatings was studied using X-ray diffraction. The results indicate that the composite coatings will turn into crystal state with increasing heat treatment temperature. Experimental results also show that a maximum hardness is achieved for the composite coating after heat treatment at 400°C for 1 hour. The corrosion resistance and tribological properties of the composite coatings are not inferior to those of electroless Ni-P coating.


2011 ◽  
Vol 464 ◽  
pp. 474-477
Author(s):  
Yan Hai Cheng ◽  
Zhen Cai Zhu ◽  
Zheng Tong Han

In the paper, different phosphorus content Ni-P coatings was prepared by electroless plating. The microstructural changes of electroless Ni-P coatings on both as-deposited condition and heat treatment were investigated by X-ray diffractometry (XRD). The relationship between microstructure of Ni-P coatings and phosphorus content and heat treatment temperature were discussed. This conclusion provided a good theoretical basis for Ni-P coating using for wear and corrosion resistances in the technology of MEMS.


2015 ◽  
Vol 642 ◽  
pp. 286-291
Author(s):  
Chang Shuo Chang ◽  
Kung Hsu Hou ◽  
Ming Der Ger ◽  
Chen Kuei Chung ◽  
Jen Fin Lin

In the present study, SiC reinforced particles were introduced to the Ni-P plating bath, and developed high SiC content composite coatings. Thin films nature properties and mechanical performances were evaluated well. The results showed that the Ni-P alloy embedded SiC particles formed a few cavities, and reduced coatings hardness and wear resistance in as-plated condition. After 400°C heat-treatment, Ni3P crystalline phase formed and reached the max hardness, and conducted excellent trybological performances. SiC particles were decoposited in 600°C and reacted with Ni to form Ni3Si and Ni5Si2, caused the decreasing in hardness.


2014 ◽  
Vol 988 ◽  
pp. 117-120
Author(s):  
Ya Min Li ◽  
Xing Zhang ◽  
Amin Wang ◽  
Hong Jun Liu

Ni-P-SiC composite coatings on the surface of ZL102 aluminum alloy were prepared by direct electroless plating. The structure and morphology of the coatings after heat treatment at 400 °C for 1 hour were analyzed by XRD and SEM. The bonding strength, hardness, corrosion resistance and wear resistance of the coatings were tested. The results show that the coatings structure is crystalline and the main crystal phase is Ni3P. The SiC particles are evenly distributed in the coatings. The coatings have uniform thickness, high bonding strength and high micro hardness (up to 1395.28 HV.2). It is also shown that the substrate corrosion resistance and wear resistance can be considerably improved after electroless plating.


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