Fabrication and characterization of B-doped ZnO nanospheres synthesized on PET/ITO flexible substrates

RSC Advances ◽  
2016 ◽  
Vol 6 (85) ◽  
pp. 81965-81968
Author(s):  
Qi Yu ◽  
Taotao Ai ◽  
Liyun Jiang

B doped ZnO nanospheres have been fabricated on PET-ITO flexible substrates by hydrothermal technique.

2008 ◽  
Vol 1071 ◽  
Author(s):  
Koji Aizawa

AbstractCharacterization of 700-nm-thick poly(vinylidene fluoride/trifluoroethylene) [P(VDF/TrFE)]/TiO2/Al-doped ZnO (AZO) structures on a glass substrate were investigated. In this study, the sputtered TiO2 films as insulator were used for the reduction of leakage current. The leakage current density of the fabricated Pt/P(VDF/TrFE)/AZO and Pt/P(VDF/TrFE)/170-nm-thick TiO2/AZO structures were approximately 8.7 and 3.9 nA/cm2 at the applied voltage of 10 V, respectively. In the polarization vs. voltage characteristics, the fabricated Pt/P(VDF/TrFE)/TiO2/AZO structures showed hysteresis loops caused by ferroelectric polarization. The remnant polarization (2Pr) and coercive voltage (2Vc) measured from a saturated hysteresis loop at the frequency of 50 Hz were approximately 12 μC/cm2 and 105 V, respectively. These results suggest that the insertion of TiO2 film is available for reducing the gate leakage current without changing the ferroelectric properties.


2011 ◽  
Vol 32 (2) ◽  
pp. 154-158
Author(s):  
冯秋菊 FENG Qiu-ju ◽  
冯宇 FENG Yu ◽  
梁红伟 LIANG Hong-wei ◽  
王珏 WANG Jue ◽  
陶鹏程 TAO Peng-cheng ◽  
...  

2020 ◽  
Vol 167 (6) ◽  
pp. 067506 ◽  
Author(s):  
Yen-Lin Chu ◽  
Liang-Wen Ji ◽  
Yu-Jen Hsiao ◽  
Hao-Ying Lu ◽  
Sheng-Joue Young ◽  
...  

2010 ◽  
Vol 87 (11) ◽  
pp. 2097-2102 ◽  
Author(s):  
Seungju Chun ◽  
Kang-Soo Han ◽  
Ju-Hyeon Shin ◽  
Heon Lee ◽  
Donghwan Kim

2016 ◽  
Author(s):  
Abhisek Mishra ◽  
Saswat Mohapatra ◽  
Himanshu Sekhar Gouda ◽  
Udai P. Singh

2005 ◽  
Vol 128 (3) ◽  
pp. 236-245 ◽  
Author(s):  
Bivragh Majeed ◽  
Kieran Delaney ◽  
John Barton ◽  
Niall McCarthy ◽  
Sean C. O’Mathuna ◽  
...  

In this paper we describe the materials-related challenges in applying folded flex packaging technology to wireless sensor networks and propose solutions for implementing miniaturized 5mm cube platforms. The focus is to apply thin silicon stacking methods using thin flexible substrate interconnect and in particular to investigate the behavior of the selected materials. Both commercial and in-house polyimide substrates, in the thickness range 25μm down to 3μm (each with 4μm of sputtered copper) were analyzed for appropriate electrical, chemical, and mechanical properties. The characterization highlighted that in flex of thickness below 10μm, a dramatic decrease in stiffness occurs and the polyimide wrinkles due to stresses generated by the copper sputtering process. An evaluation determined that specific steps, such as polymer support ring formation, could be employed to eliminate impact of wrinkling on the process of developing the 5mm cube prototypes.


2020 ◽  
Vol 167 (2) ◽  
pp. 027522 ◽  
Author(s):  
Yen-Lin Chu ◽  
Liang-Wen Ji ◽  
Hao-Ying Lu ◽  
Sheng-Joue Young ◽  
I-Tseng Tang ◽  
...  

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