Improved lateral heat spreading performance for polyvinylidene fluoride composite film comprising silver nanowire in light-emitting diode

RSC Advances ◽  
2016 ◽  
Vol 6 (42) ◽  
pp. 35884-35891 ◽  
Author(s):  
Zhao Li ◽  
Li Zhang ◽  
Rong Qi ◽  
Fan Xie ◽  
Shuhua Qi
Keyword(s):  
Heat Sink ◽  
Polyvinylidene Fluoride ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Silver Nanowire ◽  
Transfer Property ◽  
Light Emitting ◽  
Thermal Transfer ◽  
Heat Spreading ◽  
Lateral Heat

Silver nanowire (AgNW) attracts great attention as a heat dissipation material due to its excellent thermal transfer property which exceeds most traditional heat sink materials.

scholarly journals Correction: Improved lateral heat spreading performance for polyvinylidene fluoride composite film comprising silver nanowire in light-emitting diode

RSC Advances ◽  
2019 ◽  
Vol 9 (2) ◽  
pp. 738-738
Author(s):  
Zhao Li ◽  
Li Zhang ◽  
Rong Qi ◽  
Fan Xie ◽  
Shuhua Qi
Keyword(s):  
Composite Film ◽  
Polyvinylidene Fluoride ◽  
Light Emitting Diode ◽  
Silver Nanowire ◽  
Light Emitting ◽  
Heat Spreading ◽  
Lateral Heat

Correction for ‘Improved lateral heat spreading performance for polyvinylidene fluoride composite film comprising silver nanowire in light-emitting diode’ by Zhao Li et al., RSC Adv., 2016, 6, 35844–35891.

Numerical Analysis for Thermal Performance of High Power Multi-Chip LED Packaging

2010 ◽  
Vol 139-141 ◽  
pp. 1433-1437
Author(s):  
Kai Lin Pan ◽  
Jiao Pin Wang ◽  
Jing Liu ◽  
Guo Tao Ren
Keyword(s):  
High Power ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Three Dimensional ◽  
Junction Temperature ◽  
Light Emitting ◽  
Die Attach ◽  
Dissipation Model ◽  
Key Issues

Heat dissipation and cost are the key issues for light-emitting diode (LED) packaging. In this paper, based on the thermal resistance network model of LED packaging, three-dimensional heat dissipation model of high power multi-chip LED packaging is developed and analyzed with the application of finite element method. Temperature distributions of the current multi-chip LED packaging model are investigated systematically under the different materials of the chip substrate, die attach, and/or different structures of the heat sink and fin. The results show that the junction temperature can be decreased effectively by increasing the height of the heat sink, the width of the fin, and the thermal conductivity of the chip substrate and die attach materials. The lower cost and higher reliability for LED source can be obtained through reasonable selection of materials and structure parameters of the LED lighting system.

A three-dimensional thermal analysis for cooling a square Light Emitting Diode by Multiwalled Carbon Nanotube-nanofluid-filled in a rectangular microchannel

2021 ◽  
Vol 13 (11) ◽  
pp. 168781402110599
Author(s):  
Mohamed Bechir Ben Hamida ◽  
Mohammed A. Almeshaal ◽  
Khalil Hajlaoui
Keyword(s):  
Heat Sink ◽  
Heat Dissipation ◽  
Cooling System ◽  
Light Emitting Diode ◽  
Three Dimensional ◽  
Junction Temperature ◽  
Engine Oil ◽  
Inlet Temperature ◽  
Rectangular Microchannel ◽  
Light Emitting

The aim of this paper is to ensure proper thermal management in order to remove and dissipate the heat produced by a square Light Emitting Diode (LED), as well as to ensure stable and safe operation by reducing the junction temperature. For this, we developed a three-dimensional code, time-dependent that solves the systems of equations for the mass, momentum, and energy using Comsol Multiphysics. After validation of this numerical 3D code, the thermal performance of a LED cooling system with three nanofluids such as MWCNT-Water, MWCNT-Ethylene Glycol, and MWCNT-Engine oil is studied numerically into account of aggregation effect. Several parameters such as: the power of the LED lamp, the inlet temperature and velocity of nanofluid, the length of the heat sink, and the length of the microchannel have been varied in order to find an optimal condition allowing a good heat dissipation from the LED chip to the heat sink. It was concluded that the use of MWCNT-Water in the microchannel is the best nanofluid that can cool the heat sink. In addition, the increase of velocity inlet of the coolant in the microchannel, the length of the heat sink, and the microchannel length while the decrease of the inlet temperature of nanofluid in the microchannel are an important factors allowing the decrease of the junction temperature of the square LED lamp.

Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
Xin Li ◽  
Xu Chen ◽  
Guo-Quan Lu
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Temperature Cycling ◽  
Fluorescent Light ◽  
Light Sources ◽  
Light Emitting ◽  
Die Attach ◽  
Nanosilver Paste ◽  
Interconnection Material

As a solid electroluminescent source, white light emitting diode (LED) has entered a practical stage and become an alternative to replace incandescent and fluorescent light sources. However, due to the increasing integration and miniaturization of LED chips, heat flux inside the chip is also increasing, which puts the packaging into the position to meet higher requirements of heat dissipation. In this study, a new interconnection material—nanosilver paste is used for the LED chip packaging to pursue a better optical performance, since high thermal conductivity of this material can help improve the efficiency of heat dissipation for the LED chip. The bonding ability of this new die-attach material is evaluated by their bonding strength. Moreover, high-power LED modules connected with nanosilver paste, Sn3Ag0.5Cu solder, and silver epoxy are aged under hygrothermal aging and temperature cycling tests. The performances of these LED modules are tested at different aging time. The results show that LED modules sintered with nanosilver paste have the best performance and stability.

scholarly journals Thermal performance of heat sink with fluid pockets for high power light emitting diode

2017 ◽  
Vol 14 (4) ◽  
pp. 4846-4862
Author(s):  
Sangmesh ◽  
◽  
Gopalakrishna Keshava Narayana ◽  
Manjunath Shiraganhalli Honnaiah ◽  
Krishna Venkatesh ◽  
...  
Keyword(s):  
Thermal Performance ◽  
High Power ◽  
Heat Sink ◽  
Light Emitting Diode ◽  
Light Emitting

Thermal Analysis of High Power Light Emitting Diodes Package

2011 ◽  
Vol 687 ◽  
pp. 215-221
Author(s):  
Yuan Yuan Han ◽  
Hong Guo ◽  
Xi Min Zhang ◽  
Fa Zhang Yin ◽  
Ke Chu ◽  
...  
Keyword(s):  
Finite Element Method ◽  
High Power ◽  
Thermal Field ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Convective Heat Exchange ◽  
Input Power ◽  
Junction Temperature ◽  
Original Structure ◽  
Light Emitting

With increasing of the input power of the chips in light emitting diode (LED)， the thermal accumulation of LEDs package increases. Therefore solving the heat issue has become a precondition of high power LED application. In this paper, finite element method was used to analyze the thermal field of high power LEDs. The effect of the heatsink structure on the junction temperature was also investigated. The results show that the temperature of the chip is 95.8°C which is the highest, and it meets the requirement. The conductivity of each component affects the thermal resistance. Convective heat exchange is connected with the heat dissipation area. In the original structure of LEDs package the heat convected through the substrate is the highest, accounting for 92.58%. Three heatsinks with fin structure are designed to decrease the junction temperature of the LEDs package.

Performance of Hybrid Fin Heat Sinks for Thermal Control of Light Emitting Diode Lighting Modules

2013 ◽  
Vol 136 (1) ◽  
Author(s):  
Kyoung Joon Kim
Keyword(s):  
Forced Convection ◽  
Thermal Performance ◽  
Heat Sink ◽  
Light Emitting Diode ◽  
Internal Flow ◽  
Thermal Control ◽  
Numerical Prediction ◽  
Light Emitting ◽  
Convection Condition ◽  
Pin Fins

In this paper we introduce a hybrid fin heat sink (HFH) proposed for the thermal control of light emitting diode (LED) lighting modules. The HFH consists of the array of hybrid fins which are hollow pin fins having internal channels and integrated with plate fins. The thermal performance of the HFH under either natural or forced convection condition is both experimentally and numerically investigated, and then its performance is compared with that of a pin fin heat sink (PFH). The observed maximum discrepancies of the numerical prediction to the measurement for the HFH are 7% and 6% for natural and forced convection conditions. The reasonable discrepancies demonstrate the tight correlation between the numerical prediction and the measurement. The thermal performance of the HFH is found to be 12–14% better than the PFH for the natural convection condition. The better performance might be explained by the enlarged external surface and the internal flow via the channel of the HF. The reference HFH is about 14% lighter than the reference PFH. The better thermal performance and the lighter weight of the HFH show the feasibility as the promising heat sink especially for the thermal control of LED street and flood lighting modules.

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