Fabrication and origin of flame retarding glass fiber/bismaleimide resin composites with high thermal stability, good mechanical properties, and a low dielectric constant and loss for high frequency copper clad laminates

RSC Advances ◽  
2016 ◽  
Vol 6 (24) ◽  
pp. 19638-19646 ◽  
Author(s):  
Zhiyong Zhang ◽  
Li Yuan ◽  
Guozheng Liang ◽  
Aijuan Gu
Keyword(s):  
Glass Fiber ◽  
High Frequency ◽  
High Performance ◽  
Low Dielectric Constant ◽  
Resin Composites ◽  
Bismaleimide Resin ◽  
Low Dielectric ◽  
Glass Fiber Reinforced ◽  
Dielectric Constant And Loss ◽  
Hyperbranched Polysiloxane

High performance glass fiber reinforced resin composites were fabricated by designing structures of fiber and resin with unique hyperbranched polysiloxane.

Facile method for fabricating low dielectric constant polyimide fibers with hyperbranched polysiloxane

2017 ◽  
Vol 5 (11) ◽  
pp. 2818-2825 ◽  
Author(s):  
Jie Dong ◽  
Cairan Yang ◽  
Yang Cheng ◽  
Tingting Wu ◽  
Xin Zhao ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Stability ◽  
Dielectric Constant ◽  
High Performance ◽  
Low Dielectric Constant ◽  
Excellent Thermal Stability ◽  
Low Dielectric ◽  
Polyimide Fibers ◽  
Hyperbranched Polysiloxane ◽  
Radar Wave

High-performance fibers with a low dielectric constant and good mechanical properties as well as excellent thermal stability are in demand for the next generation of advanced radar-wave-transparent composites.

Photosensitive Polyimide having low loss tangent for RF application

2018 ◽  
Vol 2018 (1) ◽  
pp. 000476-000482 ◽  
Author(s):  
Masao Tomikawa ◽  
Hitoshi Araki ◽  
Yohei Kiuchi ◽  
Akira Shimada
Keyword(s):  
Molecular Structure ◽  
Dielectric Constant ◽  
Dielectric Properties ◽  
Dielectric Loss ◽  
High Frequency ◽  
Low Dielectric Constant ◽  
Low Loss ◽  
Elongation At Break ◽  
Low Dielectric ◽  
The Poor

Abstract Progress of 5G telecommunication and mm radar for autopilot, high frequency operation is required. Insulator materials having low loss at high frequency is desired for the applications. We designed the low dielectric constant, and low dielectric loss materials examined molecular structure of the polyimide and found that permittivity 2.6 at 20GHz, dielectric loss 0.002. Furthermore, in consideration of mechanical properties such as the toughness and adhesion to copper from a point of practical use. Dielectric properties largely turned worse when giving photosensitivity. To overcome the poor dielectric properties, we designed the photosensitive system. After all, we successfully obtained 3.5 of dielectric constant and 0.004 of dielectric loss, and 100% of elongation at break. In addition, we offered a B stage sheet as well as varnish. These materials are applicable to re-distribution layer of FO-WLP, Interposer and other RF applications for microelectronics.

Outstanding dielectric and thermal properties of main chain-type poly(benzoxazine-co-imide-co-siloxane)-based cross-linked networks

2019 ◽  
Vol 10 (19) ◽  
pp. 2387-2396 ◽  
Author(s):  
Kan Zhang ◽  
Xinye Yu ◽  
Shiao-Wei Kuo
Keyword(s):  
Dielectric Constant ◽  
Thermal Properties ◽  
High Performance ◽  
Main Chain ◽  
Low Dielectric Constant ◽  
Low Dielectric ◽  
Chain Type ◽  
Dielectric And Thermal Properties

A high performance cross-linked polymer with a very low dielectric constant was achieved via a newly designed main-chain type poly(benzoxazine-co-imide-co-siloxane).

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