Plasma free reversible and irreversible microfluidic bonding
We demonstrate a novel bonding process that allows for facile multilayer microfluidic chip fabrication and is compatible with cell micropatterning.
Keyword(s):
2013 ◽
Vol 20
(10-11)
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pp. 1987-1992
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Keyword(s):
Keyword(s):
2013 ◽
Vol 46
(11)
◽
pp. 2396-2406
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