Robust superhydrophobic diamond microspheres for no-loss transport of corrosive liquid microdroplets

2017 ◽  
Vol 53 (15) ◽  
pp. 2355-2358 ◽  
Author(s):  
Qiang Wang ◽  
Jie Bai ◽  
Bing Dai ◽  
Zhenhuai Yang ◽  
Shuai Guo ◽  
...  
Keyword(s):  
Composite Film ◽  
Chemical Stability ◽  
Adhesive Force ◽  
Bonding Process ◽  
Corrosive Liquid

A superhydrophobic composite film with a high adhesive force and chemical stability based on diamond microspheres is created via a simple bonding process.

Temporary Bonding Cost Of Ownership: The link between low total thickness variation and chip yield

2014 ◽  
Vol 2014 (DPC) ◽  
pp. 001893-001912
Author(s):  
Thomas Uhrmann ◽  
Jürgen Burggraf ◽  
Harald Wiesbauer ◽  
Julian Bravin ◽  
Thorsten Matthias ◽  
...  
Keyword(s):  
Chemical Stability ◽  
High Volume ◽  
Bonding Process ◽  
Thickness Variation ◽  
Total Thickness ◽  
Process Yield ◽  
Cost Of Ownership ◽  
Temporary Bonding ◽  
Total Thickness Variation ◽  
Determining Factor

The ability to process thin wafers with thicknesses of 20-50um on front- and backside is a key technology for 3D stacked ICs (3Ds-IC). The most obvious reason for thin wafers is the reduced form factor, which is especially important for handheld consumer devices. However, probably even more important is that thinner wafers enable significant cost reduction for TSVs. Consensus has developed on the use of Temporary Bonding / Debonding Technology as the solution of choice for reliably handling thin wafers through backside processing steps. Temporary bonding and debonding comprises several processes for which yield is essential, as costly fully functional device wafers are being processed. The presented temporary bonding process consists of a bi-layer system, a release layer, Dow Corning WL-3001 Bonding Release and an adhesive layer, Dow Corning WL-4030 or WL-4050 Bonding Adhesive, processed on EVG's 850XT universal temporary bonding and debonding platform. Furthermore, this bi-layer spin coated material allows a room temperature bonding-debonding process increase process throughput which translates to low cost of ownership for high volume manufacturing. As such, this bi-layer approach features high chemical stability exposed to phosphoric acid, nitric acid, organic solvents and other chemicals familiar to TSV fabrication. Besides chemical stability this adhesive system provides also a high thermal stability when exposed to temperatures up to 300 °C. The temporary bonding process yield has a major impact on the overall Cost of Ownership (CoO). On the other hand, throughput of the individual process steps like spin coating, bonding, cure, debonding and cleaning processes is the second determining factor for improved CoO. In this presentation, we will present a study of the total thickness variation (TTV) and the evolution of TTV at different stages of the process. High resolution in-line metrology is an enabling tool to trace the bond integrity and yield throughout backside processing. As TTV is a major determining factor of the overall process yield, understanding its impact over the bonded wafer pair carries major importance. Especially, non-continuity of the edge region, showing an inherent edge bead after coating, and edge die yield will be focus of our contribution. Finally, our experimental results will be transferred into a cost of ownership model, discussing the pros and cons for high volume production.

Nanorobots Sense Local Physiochemical Heterogeneities of Tumor Matrisome

2020 ◽  
Author(s):  
Debayan Dasgupta ◽  
Dharma Pally ◽  
Deepak K. Saini ◽  
Ramray Bhat ◽  
Ambarish Ghosh
Keyword(s):  
Cell Lines ◽  
Cancer Cell ◽  
Cancer Cell Lines ◽  
Adhesive Force ◽  
Surrounding Tissue ◽  
Quantitative Measurements ◽  
Malignant Breast Tumor ◽  
Malignant Breast ◽  
Cancer Dissemination

The dissemination of cancer is brought about by continuous interaction of malignant cells with their surrounding tissue microenvironment. Understanding and quantifying the remodeling of local extracellular matrix (ECM) by invading cells can therefore provide fundamental insights into the dynamics of cancer dissemination. In this paper, we use an active and untethered nanomechanical tool, realized as magnetically driven nanorobots, to locally probe a 3D tissue culture microenvironment consisting of cancerous and non-cancerous epithelia, embedded within reconstituted basement membrane (rBM) matrix. Our assay is designed to mimic the in vivo histopathological milieu of a malignant breast tumor. We find that nanorobots preferentially adhere to the ECM near cancer cells: this is due to the distinct charge conditions of the cancer-remodeled ECM. Surprisingly, quantitative measurements estimate that the adhesive force increases with the metastatic ability of cancer cell lines, while the spatial extent of the remodeled ECM was measured to be approximately 40 μm for all cancer cell lines studied here. We hypothesized and experimentally confirmed that specific sialic acid linkages specific to cancer-secreted ECM may be a major contributing factor in determining this adhesive behavior. The findings reported here can lead to promising applications in cancer diagnosis, quantification of cancer aggression, in vivo drug delivery applications, and establishes the tremendous potential of magnetic nanorobots for fundamental studies of cancer biomechanics.

Analysis of Two Electrical Failures Caused by Die Attach of Exposed Pad Package

2014 ◽  
Author(s):  
Jinglong Li ◽  
Motohiko Masuda ◽  
Yi Che ◽  
Miao Wu
Keyword(s):  
Bonding Process ◽  
Die Attach ◽  
Die Bonding ◽  
Generic Analysis

Abstract Die attach is well known in die bonding process. Its electrical character is simple. But some failures caused by die attach are not so simple. And it is not proper to analyze by a generic analysis flow. The analysis of two failures caused by die attach are presented in this paper.

Failure Analysis on Power Trench MOSFET Devices with Copper Wire Bonds

2011 ◽  
Author(s):  
Huixian Wu ◽  
Arthur Chiang ◽  
David Le ◽  
Win Pratchayakun
Keyword(s):  
Failure Analysis ◽  
Copper Wire ◽  
New Technology ◽  
Analytical Techniques ◽  
Wire Bonding ◽  
Bonding Process ◽  
Wire Bonds ◽  
Copper Wire Bonding ◽  
Wet Chemical ◽  
Microelectronic Components

Abstract With gold prices steadily going up in recent years, copper wire has gained popularity as a means to reduce cost of manufacturing microelectronic components. Performance tradeoff aside, there is an urgent need to thoroughly study the new technology to allay any fear of reliability compromise. Evaluation and optimization of copper wire bonding process is critical. In this paper, novel failure analysis and analytical techniques are applied to the evaluation of copper wire bonding process. Several FA/analytical techniques and FA procedures will be discussed in detail, including novel laser/chemical/plasma decapsulation, FIB, wet chemical etching, reactive ion etching (RIE), cross-section, CSAM, SEM, EDS, and a combination of these techniques. Two case studies will be given to demonstrate the use of these techniques in copper wire bonded devices.

Optical Properties of Cu Nanocrystalline-OPAA Composite Film

2011 ◽  
Vol 26 (9) ◽  
pp. 907-911
Author(s):  
Yan LIU ◽  
Xiu-Chun YANG ◽  
Hui ZHOU ◽  
Jun-Wei HOU ◽  
Shan-Shan HAN ◽  
...  
Keyword(s):  
Optical Properties ◽  
Composite Film
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